EP0574058A2 - Relay - Google Patents
Relay Download PDFInfo
- Publication number
- EP0574058A2 EP0574058A2 EP93201385A EP93201385A EP0574058A2 EP 0574058 A2 EP0574058 A2 EP 0574058A2 EP 93201385 A EP93201385 A EP 93201385A EP 93201385 A EP93201385 A EP 93201385A EP 0574058 A2 EP0574058 A2 EP 0574058A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- gas
- relay
- dielectric strength
- filling
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007789 gas Substances 0.000 claims abstract description 45
- 229920003023 plastic Polymers 0.000 claims abstract description 18
- 239000004033 plastic Substances 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 abstract description 8
- 229910018503 SF6 Inorganic materials 0.000 description 6
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H51/00—Electromagnetic relays
- H01H51/29—Relays having armature, contacts, and operating coil within a sealed casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/023—Details concerning sealing, e.g. sealing casing with resin
- H01H2050/025—Details concerning sealing, e.g. sealing casing with resin containing inert or dielectric gasses, e.g. SF6, for arc prevention or arc extinction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
- H01H33/02—Details
- H01H33/04—Means for extinguishing or preventing arc between current-carrying parts
- H01H33/22—Selection of fluids for arc-extinguishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/023—Details concerning sealing, e.g. sealing casing with resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/026—Details concerning isolation between driving and switching circuit
Definitions
- the present invention is in the field of encapsulated switches and relates to gas-filled encapsulated relays, in particular a plastic encapsulated relay for mounting on printed circuit boards.
- Plastic-encapsulated relays for pressure circuit boards are known, including those with a gas filling, an inert gas which is usually introduced to increase the contact reliability and which is introduced via special openings which can be closed after filling.
- an inert gas which is usually introduced to increase the contact reliability and which is introduced via special openings which can be closed after filling.
- An example of this is the wash-tight relay according to DE-A-3323922.
- this does not result in a significant increase in the dielectric strength.
- the electronegative gas can increase the dielectric strength to a sufficient extent compared to fillings with dry air or inert gas.
- the electronegative gas can increase the dielectric strength to a sufficient extent compared to fillings with dry air or inert gas.
- For fillings under Normal pressure is sufficient for a plastic housing and sealed plastic encapsulation to limit leakage losses.
- the coordination between the type of plastic and the gas and their sealing prevents an impermissible loss of diffusion of the electronegative gas.
- a specified dielectric strength is thus maintained over the service life of the relay. Compared to known relays, it is thus possible to produce smaller relays with the same high dielectric strength or relays of the same size with higher dielectric strength.
- inert gas primarily serves to ensure an uncontaminated starting atmosphere.
- Inert gas such as nitrogen or argon, diffuses through the plastic just as quickly as water vapor or oxygen.
- the plastic acts as a microfilter for the outside air diffusing into the interior of the housing to compensate, so that there is no contamination.
- electronegative gases have up to five times higher relative dielectric strength than air. Even a gas with a relative dielectric strength of 2.5 gives a sufficient increase in dielectric strength in the sense of the invention.
- the electronegative gas must remain in sufficient concentration in the interior of the housing.
- plastics are selected, the structure of which almost completely restrains the molecules of the electronegative gas.
- the molecules of the electronegative gases are larger than those of the air and the inert gases, which makes the range of suitable ones Plastics expanded.
- the composition of the gas filling changes after the manufacture of the relay, due to the diffusion properties of all gases in relation to the plastics used, but the concentration of electronegative gas remains sufficiently high to ensure a correspondingly specified dielectric strength.
- a proven, well-studied and therefore preferred electronegative gas is sulfur hexafluoride, SF6. It can be used in the form of technically pure SF6 as the sole filling gas.
- a mixture of gases can improve e.g. B. bring about temperature behavior.
- One of the gases of such a mixture is in turn preferably SF6.
- the measures envisaged in combination therefore make it possible to produce a relay with improved properties with regard to dielectric strength in a similar manner to hitherto inexpensively. This can either increase the dielectric strength compared to filling the relay interior with dry air or an inert gas are observed without having to change the relay dimensions, or smaller relay dimensions can be realized with unchanged dielectric strength.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Organic Insulating Materials (AREA)
- Casings For Electric Apparatus (AREA)
- Electronic Switches (AREA)
- Seal Device For Vehicle (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Driving Mechanisms And Operating Circuits Of Arc-Extinguishing High-Tension Switches (AREA)
- Cable Accessories (AREA)
Abstract
Description
Die vorliegende Erfindung liegt auf dem Gebiet gekapselter Schalter und betrifft gasgefüllte, gekapselte Relais, insbesondere ein kunststoffgekapseltes Relais für die Montage auf Druckschaltungsplatten.The present invention is in the field of encapsulated switches and relates to gas-filled encapsulated relays, in particular a plastic encapsulated relay for mounting on printed circuit boards.
Entwicklungen im Relaisbau zielen unter anderem darauf ab, die Effizienz zu erhöhen und damit entweder die Baugrösse zu verringern oder die elektrischen Eigenschaften zu verbessern. Bekannt ist die markante Volumenreduktion für gekapselte Hoch- und Höchstspannungsanlagen, die praktisch nur durch Füllen der gekapselten Gehäuse mit einem elektronegativen Gas, z. B. SF₆, realisierbar sind. Dabei wird zur weiteren Erhöhung der Spannungsfestigkeit mit einem gegenüber dem Atmosphärendruck erhöhten Druck gearbeitet und allfällige Leckverluste werden durch Nachfüllen ergänzt. Die mit dem erhöhten Druck einhergehende Einschränkung der unteren Betriebstemperatur wegen der erhöhten Verdampfungstemperatur des Füllgases spielt dabei keine wesentliche Rolle, da solche Anlagen meist in Räumen mit genügend hoher Minimaltemperatur betrieben werden.Developments in relay construction aim, among other things, to increase efficiency and thus either reduce the size or improve the electrical properties. Known is the striking volume reduction for encapsulated high and extra high voltage systems, which practically only by filling the encapsulated housing with an electronegative gas, e.g. B. SF₆, can be realized. To further increase the dielectric strength, the pressure is increased compared to atmospheric pressure and any leakage losses are supplemented by refilling. The limitation of the lower operating temperature associated with the increased pressure due to the increased evaporation temperature of the filling gas does not play an important role, since such systems are usually operated in rooms with a sufficiently high minimum temperature.
Bei allen aus dem Stande der Technik bekannten Anlagen, bei welchen zur Erhöhung der Spannungsfestigkeit die gekapselten Gehäuse mit einem elektronegativen Gas gefüllt sind, werden entweder allfällige Leckverluste der Kapselungen ausgeglichen oder hermetisch verschlossene, praktisch leckfreie Metall-Glas-Kapselungen verwendet.In all systems known from the prior art, in which the encapsulated housings are filled with an electronegative gas to increase the dielectric strength, either any leakage losses in the encapsulations are compensated for or hermetically sealed, practically leak-free metal-glass encapsulations are used.
Diese Kategorie der Kapselung ist jedoch bei einem kunststoffgekapselten Relais, das kostengünstig herstellbar, ein kleines Volumen aufweisen und z.B. auf Druckschaltungsplatten eingebaut werden soll, nicht realisierbar; ebensowenig kommt ein Ausgleich von Leckverlusten in Frage. Für kostengünstige Relais für Druckschaltungsplatten kann lediglich ein dicht verschlossenes Kunststoffgehäuse vorgesehen werden.However, this category of encapsulation cannot be realized with a plastic-encapsulated relay that can be manufactured inexpensively, has a small volume and is to be installed, for example, on printed circuit boards; compensation for leakage losses is also out of the question. For inexpensive relays for Pressure circuit boards can only be provided with a tightly sealed plastic housing.
Kunststoffgekapselte Relais für Druckschaltungsplatten sind bekannt, auch solche mit Gasfüllung, wobei zur Erhöhung der Kontaktzuverlässigkeit meist ein Inertgas verwendet wird, das über spezielle, nach der Füllung verschliessbare Oeffnungen eingebracht wird. Ein Beispiel dafür ist das waschdichte Relais gemäss der DE-A-3323922. Eine wesentliche Erhöhung der Spannungsfestigkeit ergibt sich daraus aber nicht.Plastic-encapsulated relays for pressure circuit boards are known, including those with a gas filling, an inert gas which is usually introduced to increase the contact reliability and which is introduced via special openings which can be closed after filling. An example of this is the wash-tight relay according to DE-A-3323922. However, this does not result in a significant increase in the dielectric strength.
Einerseits bedingen verschärfte Sicherheitsanforderungen an Relais eine höhere Spannungsfestigkeit, andererseits wird durch die höhere Packungsdichte der Druckschaltungen eine kleinere Bauform der Relais angestrebt. Ein erstrebenswertes Ziel zur Verbesserung der Leistungsfähigkeit ist deshalb die Erhöhung der Spannungsfestigkeit bei gleichbleibenden Abmessungen oder die Beibehaltung der Spannungsfestigkeit trotz merklich kleinerer Abmessungen.On the one hand, stricter safety requirements for relays require a higher dielectric strength; on the other hand, the higher packing density of the pressure circuits means that the relays are designed to be smaller. A desirable goal to improve performance is therefore to increase the dielectric strength with the same dimensions or to maintain the dielectric strength despite noticeably smaller dimensions.
Es ist daher Aufgabe der vorliegenden Erfindung, ein kostengünstig herstellbares Relais anzugeben, das eine höhere Spannungsfestigkeit aufweist, als sie mit einem baugleichen Relais zu erreichen ist, dessen Innenraum mit trockener Luft oder einem inerten Gas gefüllt ist. Es sollen dabei Anwendungen vorgesehen werden, wie sie in den Kontakt-Anwendungskategorien 0, 1, 2 und 3 nach IEC-Norm 255-7 enthalten und hauptsächlich im Telekommunikationsbereich anzutreffen sind.It is therefore an object of the present invention to provide a relay which can be produced cost-effectively and which has a higher dielectric strength than can be achieved with an identical relay whose interior is filled with dry air or an inert gas. It is intended to provide applications such as those contained in contact application categories 0, 1, 2 and 3 according to IEC standard 255-7 and which are mainly found in the telecommunications sector.
Die Aufgabe wird durch die Kombination der Merkmale gemäss Patentanspruch 1 gelöst.The object is achieved by the combination of the features according to claim 1.
Unter Atmosphärendruck oder leicht erhöhtem Druck vermag das elektronegative Gas die Spannungsfestigkeit gegenüber Füllungen mit trockener Luft oder inertem Gas in ausreichendem Mass zu erhöhen. Für Füllungen unter Normaldruck genügen Kunststoffgehäuse und dichte Kunststoffkapselungen um die Leckverluste zu begrenzen. Die Abstimmung zwischen der Art der Kunststoffe und des Gases und deren Abdichtung verhindert einen unzulässigen Diffusionsverlust des elektronegativen Gases. Ueber die Lebensdauer des Relais bleibt damit eine spezifizierte Spannungsfestigkeit erhalten. Es lassen sich damit gegenüber bekannten Relais kleinere Relais mit gleich hoher Spannungsfestigkeit oder gleich grosse Relais mit höherer Spannungsfestigkeit herstellen.Under atmospheric pressure or slightly elevated pressure, the electronegative gas can increase the dielectric strength to a sufficient extent compared to fillings with dry air or inert gas. For fillings under Normal pressure is sufficient for a plastic housing and sealed plastic encapsulation to limit leakage losses. The coordination between the type of plastic and the gas and their sealing prevents an impermissible loss of diffusion of the electronegative gas. A specified dielectric strength is thus maintained over the service life of the relay. Compared to known relays, it is thus possible to produce smaller relays with the same high dielectric strength or relays of the same size with higher dielectric strength.
Vorteilhafte Weiterbildungen des erfindungsgemässen Relais können den abhängigen Ansprüchen entnommen werden.Advantageous developments of the relay according to the invention can be found in the dependent claims.
Besonderheiten der Erfindung werden nachstehend etwas eingehender erläutert.Special features of the invention are explained in somewhat more detail below.
Die Vorteile elektronegativer Gase in Bezug auf die Spannungsfestigkeit von Kontakten treten bei gekapselten Hochspannungsanlagen markant zu Tage. Die dort verfügbare, aufwendige Technik lässt sich allerdings nicht ohne weiteres auf andere Anwendungen übertragen, wo vielfach andere Randbedingungen gegeben sind. Kleinrelais für den Einsatz auf Druckschaltungsplatten zum Beispiel, müssen in Grossserien kostengünstig herstellbar und für den Einsatz bei Temperaturen bis weit unter 0°C geeignet sein. Ein hermetisch verschlossenes Gehäuse ist unter diesem Gesichtspunkt prohibitiv teuer. Ferner führt ein hoher Druck, wie er bei SF₆-Anlagen üblich ist, zur unzulässigen Kondensation des Gases schon bei moderaten Temperaturen.The advantages of electronegative gases in terms of the dielectric strength of contacts are evident in encapsulated high-voltage systems. However, the complex technology available there cannot easily be transferred to other applications where there are often other boundary conditions. Small relays for use on printed circuit boards, for example, must be inexpensive to manufacture in large series and suitable for use at temperatures well below 0 ° C. From this point of view, a hermetically sealed housing is prohibitively expensive. Furthermore, a high pressure, as is usual with SF₆ systems, leads to inadmissible condensation of the gas even at moderate temperatures.
Hier setzt nun die Erfindung an, indem eine die Randbedingungen berücksichtigende Erhöhung der Spannungsfestigkeit mit adäquaten Mitteln angestrebt wird. Die Vorteile der elektronegativen Gase wird genützt, aber nicht im vollen Umfang, das heisst nicht durch Verwendung unter stark erhöhtem Druck, sondern unter Atmosphärendruck.This is where the invention comes in, by striving for an adequate increase in the dielectric strength taking into account the boundary conditions. The advantages of electronegative gases are used, but not to the full extent, that is, not by using them under greatly increased pressure, but under atmospheric pressure.
Dies bringt zwar nur eine teilweise Erhöhung der Spannungsfestigkeit, die aber der Anwendung entsprechend genügt, sofern das Gas seine Wirkung über die geforderte Lebensdauer des Relais entfalten kann. Weil mit Normaldruck gearbeitet wird, kann auf eine hermetisch dicht verschlossene Kapsel verzichtet werden. Ein Verschluss mit einem Gehäuse aus kostengünstigen Kunststoffen ohne Verbindung zur Aussenluft genügt. Selbstverständlich kann erfindungsgemäss auch mit leicht erhöhtem Druck der Gasfüllung etwa bis 1,5 bar gearbeitet werden. Bestimmend für den zulässigen Druck ist dabei lediglich, dass keine besonderen Massnahmen für die Kapselung getroffen werden müssen, um den Partialdruck des elektronegativen Gases über die Lebensdauer des Relais aufrechterhalten zu können.This only brings about a partial increase in the dielectric strength, but this is sufficient for the application, provided the gas can develop its effect over the required service life of the relay. Because the pressure is normal, there is no need for a hermetically sealed capsule. A closure with a housing made of inexpensive plastics without a connection to the outside air is sufficient. Of course, according to the invention it is also possible to work with a slightly increased pressure of the gas filling, up to about 1.5 bar. The only determining factor for the permissible pressure is that no special measures have to be taken for the encapsulation in order to be able to maintain the partial pressure of the electronegative gas over the life of the relay.
Die bekannte Technik der Verwendung von Inertgas dient vor allem dazu, eine nicht kontaminierte Startatmosphäre zu gewährleisten. Inertgas, wie zum Beispiel Stickstoff oder Argon, diffundiert dann aber ähnlich schnell wie Wasserdampf oder Sauerstoff durch den Kunstsstoff. Fur die zum Ausgleich in den Gehäuseinnenraum diffundierende Aussenluft wirkt der Kunststoff als Mikrofilter, so dass keine Kontamination erfolgt.The known technique of using inert gas primarily serves to ensure an uncontaminated starting atmosphere. Inert gas, such as nitrogen or argon, diffuses through the plastic just as quickly as water vapor or oxygen. The plastic acts as a microfilter for the outside air diffusing into the interior of the housing to compensate, so that there is no contamination.
Anders liegen die Verhältnisse bei der erfindungsgemässen Erhöhung der Spannungsfestigkeit durch das elektronegative Gas. Elektronegative Gase weisen je nach Art bis fünffach höhere relative elektrische Durchschlagfestigkeit als Luft auf. Schon ein Gas mit einer relativen elektrischen Durchschlagsfestigkeit von 2,5 ergibt eine genügende Erhöhung der Spannungsfestigkeit im Sinn der Erfindung. Das elektronegative Gas muss in genügender Konzentration im Gehäuseinnenraum erhalten bleiben. Zu diesem Zweck werden Kunststoffe ausgewählt, deren Struktur die Moleküle des elektronegativen Gases fast völlig zurückhält. In der Regel sind die Moleküle der elektronegativen Gase grösser als jene der Luft und der Inertgase, was die Palette an geeigneten Kunststoffen erweitert. Die Zusammensetzung der Gasfüllung ändert sich nach der Herstellung des Relais zwar noch, bedingt durch die Diffusionseigenschaften aller Gase in Bezug auf die verwendeten Kunstsstoffe, die Konzentration an elektronegativem Gas bleibt jedoch genügend hoch um eine entsprechend spezifizierte Spannungsfestigkeit zu gewährleisten.The situation is different with the increase in dielectric strength according to the invention due to the electronegative gas. Depending on the type, electronegative gases have up to five times higher relative dielectric strength than air. Even a gas with a relative dielectric strength of 2.5 gives a sufficient increase in dielectric strength in the sense of the invention. The electronegative gas must remain in sufficient concentration in the interior of the housing. For this purpose, plastics are selected, the structure of which almost completely restrains the molecules of the electronegative gas. As a rule, the molecules of the electronegative gases are larger than those of the air and the inert gases, which makes the range of suitable ones Plastics expanded. The composition of the gas filling changes after the manufacture of the relay, due to the diffusion properties of all gases in relation to the plastics used, but the concentration of electronegative gas remains sufficiently high to ensure a correspondingly specified dielectric strength.
Die Verwendung einer Gasfüllung unter Normaldruck reduziert nicht nur die Forderungen bezüglich des Verschlusses, sie vergrössert auch die Auswahlmöglichkeit für die Gehäusematerialien. Bekanntlich ergeben sich mit dem Alter gasgefüllter Relais Veränderungen in der Füllung nicht nur infolge Lecks sondern auch infolge von Diffusionsverlusten durch das Gehäuse hindurch. Die relativ teuren und schwierig zu handhabenden Metallgehäuse sind hervorragend geeignet, diesem Mangel zu begegenen. Wesentlich kostengünstiger sind Kunststoffkapseln. Ohne geeignete Paarung von Kunststoff und elektronegativem Gas diffundiert letzteres aber zu rasch weg, so dass die Spannungsfestigkeit während der Lebensdauer unter den spezifizierten Wert absinkt. Die für die Kapselung verwendeten Kunststoffe müssen daher gegenüber dem Füllgas bezüglich Diffusion optimiert sein.The use of a gas filling under normal pressure not only reduces the requirements regarding the closure, it also increases the choice of the housing materials. As is known, with the age of gas-filled relays, changes in the filling result not only as a result of leaks but also as a result of diffusion losses through the housing. The relatively expensive and difficult to handle metal housings are ideally suited to remedy this shortcoming. Plastic capsules are much cheaper. Without a suitable pairing of plastic and electronegative gas, the latter diffuses away too quickly, so that the dielectric strength drops below the specified value during the service life. The plastics used for the encapsulation must therefore be optimized with respect to the filling gas with regard to diffusion.
Ein bewährtes, gut untersuchtes und daher bevorzugtes elektronegatives Gas ist Schwefelhexafluorid, SF₆. Es lässt sich in Form von technisch reinem SF₆ als alleiniges Füllgas verwenden. Eine Mischung von Gasen kann Verbesserungen z. B. bezüglich Temperaturverhalten bringen. Bevorzugt ist eines der Gase einer solchen Mischung wiederum SF₆.A proven, well-studied and therefore preferred electronegative gas is sulfur hexafluoride, SF₆. It can be used in the form of technically pure SF₆ as the sole filling gas. A mixture of gases can improve e.g. B. bring about temperature behavior. One of the gases of such a mixture is in turn preferably SF₆.
Die vorgesehenen Massnahmen in Kombination erlauben es also, ein Relais mit verbesserten Eigenschaften bezüglich Spannungsfestigkeit auf ähnliche Weise wie bis anhin kostengünstig herzustellen. Damit kann entweder eine gegenüber einer Füllung des Relaisinnenraumes mit trockener Luft oder einem inerten Gas erhöhte Spannungsfestigkeit eingehalten werden, ohne dass die Relaisabmessungen deswegen verändert werden müssen, oder bei unveränderter Spannungsfestigkeit können kleinere Relaisabmessungen realisiert werden.The measures envisaged in combination therefore make it possible to produce a relay with improved properties with regard to dielectric strength in a similar manner to hitherto inexpensively. This can either increase the dielectric strength compared to filling the relay interior with dry air or an inert gas are observed without having to change the relay dimensions, or smaller relay dimensions can be realized with unchanged dielectric strength.
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1851/92A CH683727A5 (en) | 1992-06-11 | 1992-06-11 | Relay. |
CH1851/92 | 1992-06-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0574058A2 true EP0574058A2 (en) | 1993-12-15 |
EP0574058A3 EP0574058A3 (en) | 1994-01-05 |
EP0574058B1 EP0574058B1 (en) | 1996-06-12 |
Family
ID=4220092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP93201385A Expired - Lifetime EP0574058B1 (en) | 1992-06-11 | 1993-05-14 | Relay |
Country Status (8)
Country | Link |
---|---|
US (1) | US5554963A (en) |
EP (1) | EP0574058B1 (en) |
JP (1) | JPH0652769A (en) |
AT (1) | ATE139367T1 (en) |
CA (1) | CA2098145A1 (en) |
CH (1) | CH683727A5 (en) |
DE (1) | DE59302884D1 (en) |
ES (1) | ES2090845T3 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5532750A (en) * | 1994-04-05 | 1996-07-02 | U.S. Philips Corporation | Interlaced-to-sequential scan conversion |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2059497A (en) * | 1996-02-27 | 1997-09-16 | Kilovac Corporation | Improved sealed relay |
JP3001437B2 (en) * | 1996-11-18 | 2000-01-24 | 東北日本電気株式会社 | Electrical contact and its activation suppression method |
US6040539A (en) * | 1998-01-08 | 2000-03-21 | Hiegel; Todd N. | Protective cover for a computer mouse |
US7321281B2 (en) * | 2005-05-17 | 2008-01-22 | Gigavac Llc | Hermetically sealed relay having low permeability plastic housing |
US7944333B2 (en) * | 2006-09-11 | 2011-05-17 | Gigavac Llc | Sealed contactor |
US7852178B2 (en) * | 2006-11-28 | 2010-12-14 | Tyco Electronics Corporation | Hermetically sealed electromechanical relay |
US9524840B2 (en) | 2015-01-21 | 2016-12-20 | Thomas & Betters International LLC | High-temperature, high-pressure vacuum relay |
US10343545B2 (en) * | 2016-01-15 | 2019-07-09 | Trumpet Holdings, Inc. | Systems and methods for separating batteries |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2226627A1 (en) * | 1972-05-31 | 1973-12-13 | Siemens Ag | SHIELD GAS CONTACT |
US4168480A (en) * | 1978-02-13 | 1979-09-18 | Torr Laboratories, Inc. | Relay assembly |
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- 1993-05-14 EP EP93201385A patent/EP0574058B1/en not_active Expired - Lifetime
- 1993-05-14 AT AT93201385T patent/ATE139367T1/en active
- 1993-05-14 DE DE59302884T patent/DE59302884D1/en not_active Expired - Lifetime
- 1993-05-14 ES ES93201385T patent/ES2090845T3/en not_active Expired - Lifetime
- 1993-06-10 JP JP5138753A patent/JPH0652769A/en active Pending
- 1993-06-10 CA CA002098145A patent/CA2098145A1/en not_active Abandoned
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US5532750A (en) * | 1994-04-05 | 1996-07-02 | U.S. Philips Corporation | Interlaced-to-sequential scan conversion |
Also Published As
Publication number | Publication date |
---|---|
ES2090845T3 (en) | 1996-10-16 |
JPH0652769A (en) | 1994-02-25 |
EP0574058B1 (en) | 1996-06-12 |
EP0574058A3 (en) | 1994-01-05 |
CA2098145A1 (en) | 1993-12-12 |
US5554963A (en) | 1996-09-10 |
DE59302884D1 (en) | 1996-07-18 |
ATE139367T1 (en) | 1996-06-15 |
CH683727A5 (en) | 1994-04-29 |
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