EP0530144A2 - Process for metallising plastic articles - Google Patents

Process for metallising plastic articles Download PDF

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Publication number
EP0530144A2
EP0530144A2 EP19920810626 EP92810626A EP0530144A2 EP 0530144 A2 EP0530144 A2 EP 0530144A2 EP 19920810626 EP19920810626 EP 19920810626 EP 92810626 A EP92810626 A EP 92810626A EP 0530144 A2 EP0530144 A2 EP 0530144A2
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EP
European Patent Office
Prior art keywords
noble metal
metal salt
plastic
treated
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19920810626
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German (de)
French (fr)
Other versions
EP0530144A3 (en
Inventor
Jean-Pierre Logel
Tadashi Dr. Okada
Karl-Heinz Dr. Rembold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
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Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of EP0530144A2 publication Critical patent/EP0530144A2/en
Publication of EP0530144A3 publication Critical patent/EP0530144A3/en
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/206Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2013Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal

Definitions

  • the present invention relates to a method for the partial and discontinuous metallization of plastic objects with noble metal particles and subsequent metal coating by a conventional method, and to the coated plastic objects obtainable in this way.
  • the metallization of plastic surfaces plays an increasingly important role in various branches of industry.
  • the electrically conductive coating of electrically insulating substrates is primarily in the electronic industry, e.g. important in the manufacture of printed circuits.
  • Metallized plastic parts are also used in the production of decorative and / or reflective objects.
  • the usual method of metallizing plastics is the electrochemical deposition of metals on plastic surfaces. At least four process steps are necessary in that the plastic surface is pretreated chemically or mechanically in a first step and a discontinuous metal primer is applied in a second step; in a third step, a very thin continuous metallic layer is applied through a chemical amplification bath containing a metal salt and a reducing agent, and the substrate pretreated in this way is then placed in an aqueous solution of a metal salt for galvanic metallization, so as to obtain a thicker metal layer .
  • the primer coating is e.g. applied so that the pretreated substrate is treated in an acidic tin salt solution and then metallized in an aqueous precious metal solution. Both bathrooms can also be combined
  • EP patent application No. 0417037 it is also proposed to carry out the metal coating continuously by treating the plastic article containing certain metal oxides (MnO, NiO, Cu2O, SnO or Bi2O3) with an acidic aqueous solution of a noble metal salt.
  • the metal layer produced in this way should have improved adhesion to the plastic surface. It is particularly important in this process that the solution bath is stirred optimally, otherwise certain parts of the object to be treated, in particular its cavities and the parts which are spatially unfavorably oriented in the metallization bath, are incompletely or unsatisfactorily metallized.
  • the pH of the noble metal salt solution should preferably be 0.5 to 3.5, the optimum being in a relatively narrow pH range of less than one pH unit.
  • this process consumes a relatively high proportion of precious metal salts; these salts are expensive, which has an unfavorable process cost.
  • the present invention accordingly relates to a new method for the partial and discontinuous metallization of a plastic article with precious metal particles, according to which the plastic article containing a finely divided, homogeneously distributed filler selected from the group consisting of MnO, NiO, Cu2O, SnO and Bi2O3 with an acidic aqueous solution of a noble metal salt is treated in such a way that noble metal particles are partially and discontinuously electrochemically applied to the plastic surface by suitable adjustment of the concentration of the acid, the noble metal salt and the filler with one another, and the metalized object in this way is used to produce a continuous metal layer on the treated surface a metal using a conventional process is treated.
  • a finely divided, homogeneously distributed filler selected from the group consisting of MnO, NiO, Cu2O, SnO and Bi2O3 with an acidic aqueous solution of a noble metal salt
  • the plastic object to be coated consists, for example, of 0.5-90% by weight, preferably 10-30% by weight, of the metal oxides mentioned and 99.5-10% by weight, preferably 90-70% by weight, of one polymeric resin.
  • polymeric resins all thermoplastics, thermosetting resins and elastomers and mixtures of these resins are suitable as polymeric resins. Details and explanations of the polymeric resins to be used can be found in U.S. Patent No. 4,590,115. What has been mentioned there also applies to the present invention.
  • the following resins are preferably used according to the invention: epoxy and acrylate resins, polyimides, polyamides, polyesters, polyurethanes, polyacetals, polycarbonates, melamine resins, polytetrafluoroethylenes, polyvinylfluorides, polyethylenes, polypropylenes, ABS, polyphenylene sulfide, polyetherimides, polyarylene ether ketones, PVC, melamine-formaldehyde resins .
  • Cu2O is preferred.
  • the metal oxides are incorporated into the resin by known methods. Again, details of this can be found in the aforementioned U.S. Patent No. 4,590,115. To ensure uniform noble metal deposition, it is important that the metal oxide is homogeneously distributed in the polymeric substrate. Basically, the polymeric substrates filled with such metal oxides are known and e.g. in U.S. Patent Nos. 3, 146, 125 and 4,590, 115.
  • the noble metal particles which form in the process according to the invention adhere excellently to the surface of the plastic object to be metallized, and the loss of these noble metals by deposition in the bath is extremely small.
  • aqueous solutions which contain at least 10 mol / l of a noble metal salt are particularly suitable; the upper limit is not critical and is determined solely by the solubility of the precious metal salts.
  • the preferred concentration range is between 0.01 and 100 g / liter, most preferably between 0.1 and 1 g / liter.
  • the deposited precious metal particles have a typical thickness of less than 1 ⁇ m and are distributed discontinuously on the surface.
  • noble metal salts are salts of Au, Ag, Ru, Rh, Pd, Os, Ir or Pt, but in particular salts of Au, Pt or Pd.
  • Any anions are suitable as anions as long as the salts formed in this way are soluble in an acidic aqueous solution in the concentrations given above.
  • Suitable salts are e.g. AuBr3 (HAuBr4), AuCl3 (HAuCl4) or Au2Cl6, silver acetate, silver benzoate, AgBrO3, AgClO4, AgOCN, AgNO3, Ag2SO4, RuCl4 ⁇ 5H2O, RhCl3-H2O, Rh (NO3) 2 ⁇ 2H2O, Rh (CH, COO SO4) 3 ⁇ 4H2O, Rh2 (SO4) 3 ⁇ 12H2O, Rh2 (SO4) 3 ⁇ 15H2O, PdCl2, PdCl2 ⁇ 2H2O, PdSO4, PdSO4 ⁇ 2H2O, Pd (CH3COO) 2, OsCl4, OsCl3, 0OCl3I 3H2O IrBr3 ⁇ 4H2O, IrCl2, IrCl4, IrO2, PtBr4, H2PtCl6 ⁇ 6H2O, PtCl4, P
  • noble metal salts which contain Cl ⁇ , NO3 ⁇ , SO42 ⁇ or CH3COO ⁇ as anions and are optionally present in hydrated form.
  • Particularly preferred noble metal salts are (NH4) 2PdCl6, K2PdCl6 and especially PdCl2, PdSO4, PtCl4 and HAuCl4.
  • the method according to the invention is particularly simple because the plastic objects to be treated only have to be immersed in the aqueous acidic solution of the noble metal salt without special stirring devices.
  • the aqueous acidic solution can be applied using standard coating technology, such as spraying, brushing or roller coating.
  • the metallization takes place regardless of the shape of the plastic object at all points that come into contact with the solution.
  • it can also be expedient to keep the solution in motion during the metallization process. This is done in a manner known per se by shaking or preferably by stirring, e.g. by means of a magnetic stirrer, by moving the sample or by blowing in air.
  • the temperature of the bath is generally not critical.
  • the metallization is preferably carried out at approximately 10-95 ° C., in particular at a slightly elevated temperature, approximately at 20-50 ° C.
  • the metallization takes place in an acidic solution.
  • the acidity of the acidic solution also depends on the metal oxide filler used and its concentration in the plastic object. It has been shown that the optimum lies in a relatively low acidity range with regard to the acid concentration.
  • the acid concentration is adjusted in the usual way using strong acids, such as mineral acids, carboxylic acids or sulfonic acids.
  • strong acids such as mineral acids, carboxylic acids or sulfonic acids.
  • Examples include hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid, hydrofluoric acid, acetic acid or p-toluenesulfonic acid.
  • Phosphoric acid, hydrochloric acid, nitric acid and sulfuric acid are preferred.
  • the concentration of the acid expediently transfers e.g. 0.05 to 90% by volume, preferably 0.1 to 10% by volume.
  • the concentrations of the acid, the noble metal salt and the filler are adjusted to one another in such a way that the noble metal is deposited discontinuously and in a sufficient amount so that a complete metal coating is then carried out without any problems (ie with sufficient adhesion and complete coating of the object to be treated). Surface can be obtained. If, for example, a high acid and noble metal salt concentration is used, it is advisable to use a low filler concentration. When using a high acid concentration and a low noble metal salt concentration, a high filler concentration is expediently used. If, on the other hand, a low acid and noble metal salt concentration is used, it is advisable to use a medium to low filler concentration. Metallization baths in which the acid and the noble metal salt have the same anion are particularly preferred.
  • the duration of the metallization naturally depends on various parameters, such as temperature, acid concentration, concentration of the noble metal salt and the filler and, if appropriate, movement of the metallization solution. Typical metallizations usually occur between 10 seconds and 60 minutes, mostly between 30 seconds and 10 minutes.
  • the plastic objects obtained are completely completed in a manner known per se by electrochemical, electrolytic or electrochemical plus electrolytic metal deposition coated.
  • any metal for example tin, zinc, cadmium or in particular copper or nickel, can be applied in one step or in several steps carried out separately.
  • the present process allows a perfect metallization of plastic objects of any shape and with excellent application properties, in particular excellent adhesion, although the surface of the plastic Object is only partially and discontinuously metallized with the precious metal.
  • significantly smaller amounts of precious metal salts are deposited on the surface of the object; this method is therefore less expensive.
  • the present method it is also possible to adjust the amount of the noble metal particles deposited on the article surface independently of the reduced amount of Cu2O on the article surface: for example, by treating the plastic article in a solution rich in noble metal salts
  • it is low in acid more precious metal particles are produced than reduced copper parts, whereas fewer precious metal particles than copper parts can be deposited in a solution bath which is low in acid with respect to precious metal salts. Due to the fact that the metallization according to the invention is discontinuous on the surface of the object, the electrical resistance is infinite.
  • plastic objects coated in this way are used in a wide variety of industries where metallic surfaces are required, for example in the automotive industry, such as for frames for display instruments, radios, door handles for window regulators, heating grills, dashboard heads, headlights, taillights, etc., also in the radio, TV and electronics industry, in particular for printed circuits, both in multilayer and hybrid circuits and as chip carriers, and in EMI shielding installations, in addition in the aerospace industry, in the dental and medical industry, in the optical industry, for example in the manufacture of mirrors, as well as in household items.
  • automotive industry such as for frames for display instruments, radios, door handles for window regulators, heating grills, dashboard heads, headlights, taillights, etc.
  • TV and electronics industry in particular for printed circuits, both in multilayer and hybrid circuits and as chip carriers
  • EMI shielding installations in addition in the aerospace industry, in the dental and medical industry, in the optical industry, for example in the manufacture of mirrors, as well as in household items.
  • the resin-rich surface is roughened with emery paper.
  • the plates treated in this way are immersed for 10 minutes at 21 ° C. in an aqueous PdCl2 solution with a concentration of 0.1 g / l and containing 50 ml / l HCl (37%).
  • the bath is then magnetically stirred at 400 rpm. touched.
  • the plates are then cleaned (rinsed) with water and metallized for 30 minutes at 40 ° C. in a conventional copper bath EC 580 (supplier kemifar).
  • the metal layer thus obtained completely covers the surface of the plastic article and has a thickness of 2.5 microns.
  • a polyurethane layer containing 30% by weight of Cu2O is applied to one side of a molded polyurethane part by in-mold coating.
  • the molded part is treated for 30 minutes at 60-65 ° C in a degreasing bath (Kemifar EC 4035, 10 vol.%).
  • the sample is surface-etched for 20 minutes at room temperature in an etching bath (150 ml Kemifar Enplate MLB 497B, 30 ml Kemifar Enplate MLB 497C, 80 g potassium permanganate, 40 g sodium hydroxide, made up to 1 liter with water), the solution is stirred with a magnetic stirrer (400 rpm).
  • the manganese dioxide deposited on the surface is removed by immersion for 3 minutes in a 0.1 molar aqueous hydroxylamine sulfate solution under the influence of ultrasound.
  • the molding is rinsed again and then metallized by immersion in an aqueous solution of PdCl2 (0.1 g / l) containing 100 ml / l HCl 37% g for 6 minutes at 21 ° C.
  • the bath is stirred with a magnetic stirrer (400 rpm).
  • the sample is then rinsed with water and metallized in an EC 580 copper bath for 20 minutes at 40 ° C.
  • the sample is then rinsed with water and coated with copper in a galvano-copper bath (65 min at 28 ° C with 3A / dm2; Kemifar KHT 482). During the electrolysis, the sample is agitated and air is blown into the solution.
  • the copper layer obtained in this way has a layer thickness of 41 microns.
  • the adhesion after the metallization is greater than 6 N / cm. After three weeks of storage, it is greater than 10 N / cm.
  • the side of the molded part that does not contain Cu2O is not metallized.
  • the resin-rich surface is roughened with emery paper.
  • the plates treated in this way are immersed for 10 minutes at 45 ° C. in an aqueous PdCl2 solution with a concentration of 0.5 g / l and containing 0.9 ml / l HCl (37% o-ig).
  • the bath is then magnetically stirred at 400 rpm. touched.
  • the plates are then cleaned (rinsed) with water and metallized for 30 minutes at 40 ° C. in a conventional copper bath EC 580 (Kemifar).
  • the metal layer thus obtained completely covers the surface of the plastic object.
  • a sample prepared according to Example 1 is treated in stages as follows: Sources in a copper bath "MLB conditioner 212" (Shipley): MLB 212: 350ml Cuposit Z: 35ml Water: 615 ml Temp.: 62 ° C Duration: 5 min. Magnetic stirrer. 200 rpm; Rinsing with water; Etching with kMnO4 in the following copper bath: MLB 497B (Kemifar): 150 ml MLB 497C (Kemifar): 30 ml KMnO4: 80 g NaOH: 40 g Water. 1000 ml Temp.: 85 ° C Duration. 30 min. Magnetic stirrer.
  • Rinsing with water Copper coating in the EC 580 bath at 40 ° C and for 20 minutes with air blowing; Rinse with water: Electrolytic copper treatment in a bath KHT 482 (Kemifar) at 28 ° C for 55 min with 3 A / dm2 while stirring the bath and moving the sample; Rinse with water, then usual air drying and then drying in an oven at 140 ° C for 1 hour.
  • the thickness of the metal coating thus obtained is 38 microns and the adhesion of the copper is 20 N / cm.
  • the resin-rich surface is roughened with emery paper.
  • the plates treated in this way are immersed for 10 minutes at 21 ° C. in an aqueous PdCl2 solution with a concentration of 0.1 g / l and containing 2 ml / l HCl (37%).
  • the bath is then magnetically stirred at 400 rpm. touched.
  • the plates are then cleaned (rinsed) with water and metallized for 30 minutes at 40 ° C. in a conventional copper bath EC 580 (supplier kemifar).
  • the metal layer thus obtained completely covers the surface of the plastic article and has a thickness of 2.5 microns.

Abstract

In a process for the partial and discontinuous metallisation of a plastic article by means of noble-metal particles, the plastic article containing a finely divided, homogeneously distributed filler selected from the group consisting of MnO, NiO, Cu2O, SnO and Bi2O3 is treated with an acidic aqueous solution of a noble-metal salt in such a manner that noble-metal particles are partly and discontinuously applied by electrochemical means to the plastic surface by suitable adjustment of the concentration of the acids, of the noble-metal salt and of the filler with respect to one another, and the article metallised in this way is treated with a metal by a conventional process in order to produce a continuous metal layer on the treated surface.

Description

Die vorliegende Erfindung betrifft ein Verfahren zur teilweisen und diskontinuierlichen Metallisierung von Kunststoff-Gegenständen mit Edelmetallpartikeln und anschliessende Metallbeschichtung nach einem konventionellen Verfahren, sowie die so erhältlichen beschichteten Kunststoff-Gegenstände.The present invention relates to a method for the partial and discontinuous metallization of plastic objects with noble metal particles and subsequent metal coating by a conventional method, and to the coated plastic objects obtainable in this way.

In verschiedenen Industriezweigen spielt die Metallisierung von Kunststoff-Oberflächen eine zunehmend wichtige Rolle. Die elektrisch leitende Beschichtung von elektrisch isolierenden Substraten ist vor allem in der elektronischen Industrie, z.B. bei der Herstellung gedruckter Schaltungen, von Bedeutung. Aber auch bei der Herstellung dekorativer und/oder reflektierender Gegenstände kommen metallisierte Kunststoff-Teile zur Anwendung.The metallization of plastic surfaces plays an increasingly important role in various branches of industry. The electrically conductive coating of electrically insulating substrates is primarily in the electronic industry, e.g. important in the manufacture of printed circuits. Metallized plastic parts are also used in the production of decorative and / or reflective objects.

Die übliche Methode, Kunststoffe zu metallisieren, ist die elektrochemische Abscheidung von Metallen auf kunststoffoberflächen. Dabei sind mindestens vier Verfahrensschritte notwendig, indem in einem ersten Schritt die kunststoffoberfläche chemisch oder mechanisch vorbehandelt und in einem zweiten Schritt ein diskontinuierlicher Metall-Primer aufgebracht werden; in einem dritten Schritt wird durch ein chemisches Verstärkungsbad, enthaltend ein Metallsalz und ein Reduktionsmittel, eine sehr dünne kontinuierliche metallische Schicht aufgebracht, und das so vorbehandelte Substrat wird dann zur galvanischen Metallisierung in eine wässrige Lösung eines Metallsalzes gegeben, um so eine dickere Metallschicht zu erhalten. Die Primer-Beschichtung wird z.B. so aufgebracht, dass das vorbehandelte Substrat in einer sauren Zinnsalz-Lösung behandelt und anschliessend in einer wässrigen Edelmetall-Lösung metallisiert wird. Beide Bäder können auch kombiniert werdenThe usual method of metallizing plastics is the electrochemical deposition of metals on plastic surfaces. At least four process steps are necessary in that the plastic surface is pretreated chemically or mechanically in a first step and a discontinuous metal primer is applied in a second step; in a third step, a very thin continuous metallic layer is applied through a chemical amplification bath containing a metal salt and a reducing agent, and the substrate pretreated in this way is then placed in an aqueous solution of a metal salt for galvanic metallization, so as to obtain a thicker metal layer . The primer coating is e.g. applied so that the pretreated substrate is treated in an acidic tin salt solution and then metallized in an aqueous precious metal solution. Both bathrooms can also be combined

Diese Methode ist ziemlich kompliziert und hat viele Einzelschritte, die durch heikle Prozessbedingungen charakterisiert sind. Während die chemische bzw. mechanische Vorbehandlung oft zur Beschädigung des Substrats führt, treten beim Aufbringen des Metall-Primers häufig Probleme wegen mangelnder Benetzbarkeit der Kunststoff-Oberfläche durch die Primer-Lösung auf. Die so erzeugte Primer-Schicht ist von schlechter Qualität, diskontinuierlich und schlecht haftend. Dieses und andere spezielle Metallisierungsverfahren sind im US-Patent Nr. 4,590, 115 beschrieben.This method is quite complicated and has many individual steps that are characterized by delicate process conditions. While chemical or mechanical pretreatment often leads to damage to the substrate, problems often arise when the metal primer is applied due to the lack of wettability of the plastic surface by the primer solution. The primer layer so produced is of poor quality, discontinuous and poorly adherent. This and other special metallization processes are described in U.S. Patent No. 4,590,115.

In der EP-Patentanmeldung Nr. 0417037 wird ferner vorgeschlagen, die Metallbeschichtung kontinuierlich durchzuführen, indem der Kunststoff-Gegenstand enthaltend bestimmte Metalloxide (MnO, NiO, Cu₂O, SnO oder Bi₂O₃) mit einer sauren wässrigen Lösung eines Edelmetallsalzes behandelt wird. Die so erzeugte Metallschicht soll eine verbesserte Haftung auf der Kunststoff-Oberfläche aufweisen. Bei diesem Verfahren ist es besonders wichtig, dass das Lösungsbad optimal gerührt wird, sonst werden bestimmte Teile des zu behandelnden Gegenstandes, besonders dessen Hohlräume und die im Metallisierungsbad räumlich ungünstig orientierten Teile , unvollständig bzw. nicht zufriedenstellend metallisiert. Gemäss diesem Verfahren soll der pH-Wert der Edelmetallsalz-Lösung bevorzugt 0,5 bis 3,5 betragen, wobei das Optimum in einem relativ engen pH-Bereich von weniger als einer pH-Einheit liegt. Ausserdem verbraucht dieses Verfahren einen relativ hohen Anteil an Edelmetallsalzen; diese Salze sind teuer, was sich verfahrenskostenungünstig auswirkt.In EP patent application No. 0417037 it is also proposed to carry out the metal coating continuously by treating the plastic article containing certain metal oxides (MnO, NiO, Cu₂O, SnO or Bi₂O₃) with an acidic aqueous solution of a noble metal salt. The metal layer produced in this way should have improved adhesion to the plastic surface. It is particularly important in this process that the solution bath is stirred optimally, otherwise certain parts of the object to be treated, in particular its cavities and the parts which are spatially unfavorably oriented in the metallization bath, are incompletely or unsatisfactorily metallized. According to this method, the pH of the noble metal salt solution should preferably be 0.5 to 3.5, the optimum being in a relatively narrow pH range of less than one pH unit. In addition, this process consumes a relatively high proportion of precious metal salts; these salts are expensive, which has an unfavorable process cost.

Es wurde nun gefunden, dass man dieses Verfahren dadurch erheblich verbessert werden kann, wenn die Oberfläche des zu behandelnden Kunststoff-Gegenstandes mit Edelmetallpartikeln nur teilweise und diskontinuierlich metallisiert und anschliessend mit einem Metall nach einem konventionellen Verfahren beschichtet wird; Das neue Verfahren kann in einem viel breiteren Aciditätsbereich durchgeführt werden, ferner werden dabei bedeutend kleinere Anteile an Edelmetallsalzen verbraucht, und die so erhaltenen Gegenstände zeichnen sich durch hervorragende anwendungstechnische Eigenschaften aus.It has now been found that this process can be significantly improved if the surface of the plastic article to be treated is only partially and discontinuously metallized with precious metal particles and then coated with a metal by a conventional process; The new process can be carried out in a much broader acidity range, significantly smaller proportions of noble metal salts are consumed, and the articles obtained in this way are distinguished by excellent performance properties.

Die vorliegende Erfindung betrifft demnach ein neues Verfahren zur teilweisen und diskontinuierlichen Metallisierung eines Kunststoff-Gegenstandes mit Edelmetallpartikeln, wonach der Kunststoff-Gegenstand enthaltend einen feinteiligen, homogen verteilten Füllstoff ausgewählt aus der Gruppe bestehend aus MnO, NiO, Cu₂O, SnO und Bi₂O₃ mit einer sauren wässrigen Lösung eines Edelmetallsalzes so behandelt wird, dass auf der Kunststoff-Oberfläche durch geeignete Einstellung der Konzentration der Säure, des Edelmetallsalzes und des Füllstoffes untereinander Edelmetallpartikeln teilweise und diskontinuierlich elektrochemisch aufgebracht werden und der so metallisierte Gegenstand zur Herstellung einer kontinuierlichen Metallschicht auf der behandelten Oberfläche mit einem Metall nach einem konventionellen Verfahren behandelt wird.The present invention accordingly relates to a new method for the partial and discontinuous metallization of a plastic article with precious metal particles, according to which the plastic article containing a finely divided, homogeneously distributed filler selected from the group consisting of MnO, NiO, Cu₂O, SnO and Bi₂O₃ with an acidic aqueous solution of a noble metal salt is treated in such a way that noble metal particles are partially and discontinuously electrochemically applied to the plastic surface by suitable adjustment of the concentration of the acid, the noble metal salt and the filler with one another, and the metalized object in this way is used to produce a continuous metal layer on the treated surface a metal using a conventional process is treated.

Der zu beschichtende Kunststoffgegenstand besteht z.B. aus 0,5-90 Gew.-%, vorzugsweise 10-30 Gew.-%, der genannten Metalloxide und 99,5- 10 Gew.-%, vorzugsweise 90-70 Gew.-%, eines polymeren Harzes.
Als polymere Harze eignen sich prinzipiell alle Thermoplasten, hitzehärtbaren Harze und Elastomeren und Gemische dieser Harze.
Einzelheiten und Erklärungen über die zu verwendenden polymeren Harze können dem US-Patent Nr. 4,590, 115 entnommen werden. Das dort Erwähnte hat auch für die vorliegende Erfindung Gültigkeit.
The plastic object to be coated consists, for example, of 0.5-90% by weight, preferably 10-30% by weight, of the metal oxides mentioned and 99.5-10% by weight, preferably 90-70% by weight, of one polymeric resin.
In principle, all thermoplastics, thermosetting resins and elastomers and mixtures of these resins are suitable as polymeric resins.
Details and explanations of the polymeric resins to be used can be found in U.S. Patent No. 4,590,115. What has been mentioned there also applies to the present invention.

Erfindungsgemäss bevorzugt kommen folgende Harze zum Einsatz: Epoxid- und Acrylatharze, Polyimide, Polyamide, Polyester, Polyurethane, Polyacetale, Polycarbonate, Melaminharze, Polytetrafluorethylene, Polyvinylfluoride, Polyethylene, Polypropylene, ABS, Polyphenylensulfid, Polyetherimide, Polyarylenetherketone, PVC, Melamin-Formaldehydharze und Phenolharze.The following resins are preferably used according to the invention: epoxy and acrylate resins, polyimides, polyamides, polyesters, polyurethanes, polyacetals, polycarbonates, melamine resins, polytetrafluoroethylenes, polyvinylfluorides, polyethylenes, polypropylenes, ABS, polyphenylene sulfide, polyetherimides, polyarylene ether ketones, PVC, melamine-formaldehyde resins .

Von den Metalloxiden ist Cu₂O bevorzugt.Of the metal oxides, Cu₂O is preferred.

Die Einarbeitung der Metalloxide in das Harz erfolgt nach bekannten Methoden. Einzelheiten darüber können wiederum dem oben erwähnten US-Patent Nr. 4,590, 115 entnommen werden. Für die Gewährleistung einer gleichmässigen Edelmetallabscheidung ist es wichtig, dass das Metalloxid im polymeren Substrat homogen verteilt ist. Grundsätzlich sind die mit solchen Metalloxiden gefüllten polymeren Substrate bekannt und z.B. in den US-Patenten Nr. 3, 146, 125 und 4,590, 115 beschrieben.The metal oxides are incorporated into the resin by known methods. Again, details of this can be found in the aforementioned U.S. Patent No. 4,590,115. To ensure uniform noble metal deposition, it is important that the metal oxide is homogeneously distributed in the polymeric substrate. Basically, the polymeric substrates filled with such metal oxides are known and e.g. in U.S. Patent Nos. 3, 146, 125 and 4,590, 115.

Die sich beim erfindungsgemässen Verfahren bildenden Edelmetallteilchen an der Oberfläche des zu metallisierenden Kunststoff-Gegenstandes haften ausgezeichnet, und der Verlust an diesen Edelmetallen durch Abscheiden im Bad ist äussert gering.The noble metal particles which form in the process according to the invention adhere excellently to the surface of the plastic object to be metallized, and the loss of these noble metals by deposition in the bath is extremely small.

Erfindungsgemäss eignen sich besonders wässrige Lösungen, welche mindestens 10⁻⁵ Mol/l eines Edelmetallsalzes enthalten; die obere Grenze ist unkritisch und wird allein durch die Löslichkeit der Edelmetallsalze bestimmt. Der bevorzugte Konzentrationsbereich liegt zwischen 0,01 und 100 g/Liter, ganz bevorzugt zwischen 0,1 und 1 g/Liter. Die abgeschiedenen Edelmetallpartikeln haben eine typische Dicke von weniger als 1 µm und sind auf der Oberfläche diskontinuierlich verteilt.According to the invention, aqueous solutions which contain at least 10 mol / l of a noble metal salt are particularly suitable; the upper limit is not critical and is determined solely by the solubility of the precious metal salts. The preferred concentration range is between 0.01 and 100 g / liter, most preferably between 0.1 and 1 g / liter. The deposited precious metal particles have a typical thickness of less than 1 µm and are distributed discontinuously on the surface.

Als Edelmetallsalze eignen sich besonders Salze von Au, Ag, Ru, Rh, Pd, Os, Ir oder Pt, insbesondere aber Salze von Au, Pt oder Pd.Particularly suitable as noble metal salts are salts of Au, Ag, Ru, Rh, Pd, Os, Ir or Pt, but in particular salts of Au, Pt or Pd.

Als Anionen sind beliebige Anionen geeignet, solange die so gebildeten Salze in einer sauren wässrigen Lösung in den oben angegebenen Konzentrationen löslich sind.Any anions are suitable as anions as long as the salts formed in this way are soluble in an acidic aqueous solution in the concentrations given above.

Geeignete Salze sind z.B. AuBr₃ (HAuBr₄), AuCl₃ (HAuCl₄) oder Au₂Cl₆, Silberacetat, Silberbenzoat, AgBrO₃, AgClO₄, AgOCN, AgNO₃, Ag₂SO₄, RuCl₄·5H₂O, RhCl₃-H₂O, Rh(NO₃)₂·2H₂O, Rh(CH₃COO)₂, Rh₂(SO₄)₃·4H₂O, Rh₂(SO₄)₃·12H₂O, Rh₂(SO₄)3·15H₂O, PdCl₂, PdCl₂·2H₂O, PdSO₄, PdSO₄·2H₂O, Pd(CH₃COO)₂, OsCl₄, OsCl₃, 0OCl₃·3H₂O, OsI₄, IrBr₃·4H₂O, IrCl₂, IrCl₄, IrO₂, PtBr₄, H₂PtCl₆·6H₂O, PtCl₄, PtCl₃, Pt(SO₄)2·4H₂O oder Pt(COCl₂)Cl₂, sowie die entsprechenden komplexsalze wie NaAuCl₄, (NH₄)₂PdCl₄, (NH4)₂PdCl₆, K₂PdCl₆ oder kAuCl₄.Suitable salts are e.g. AuBr₃ (HAuBr₄), AuCl₃ (HAuCl₄) or Au₂Cl₆, silver acetate, silver benzoate, AgBrO₃, AgClO₄, AgOCN, AgNO₃, Ag₂SO₄, RuCl₄ · 5H₂O, RhCl₃-H₂O, Rh (NO₃) ₂ · 2H₂O, Rh (CH, COO SO₄) ₃ · 4H₂O, Rh₂ (SO₄) ₃ · 12H₂O, Rh₂ (SO₄) 3 · 15H₂O, PdCl₂, PdCl₂ · 2H₂O, PdSO₄, PdSO₄ · 2H₂O, Pd (CH₃COO) ₂, OsCl₄, OsCl₃, 0OCl₃I 3H₂O IrBr₃ · 4H₂O, IrCl₂, IrCl₄, IrO₂, PtBr₄, H₂PtCl₆ · 6H₂O, PtCl₄, PtCl₃, Pt (SO₄) 2 · 4H₂O or Pt (COCl₂) Cl₂, as well as the corresponding complex salts like NaAuCl₄, (NH₄) ₂PdCl₄, (NH4) , K₂PdCl₆ or kAuCl₄.

Bevorzugt sind jene Edelmetallsalze, welche als Anion Cl⁻, NO₃⁻, SO₄²⁻ oder CH₃COO⁻ enthalten und gegebenenfalls in hydratisierter Form vorliegen.
Besonders bevorzugte Edelmetallsalze sind (NH₄)₂PdCl₆, K₂PdCl₆ und vor allem PdCl₂, PdSO₄, PtCl₄ und HAuCl₄.
Preference is given to those noble metal salts which contain Cl⁻, NO₃⁻, SO₄²⁻ or CH₃COO⁻ as anions and are optionally present in hydrated form.
Particularly preferred noble metal salts are (NH₄) ₂PdCl₆, K₂PdCl₆ and especially PdCl₂, PdSO₄, PtCl₄ and HAuCl₄.

Das erfindungsgemässe Verfahren ist deshalb besonders einfach, weil die zu behandelnden Kunststoff-Gegenstände lediglich in die wässrige saure Lösung des Edelmetallsalzes ohne besondere Rühreinrichtungen eingetaucht werden müssen. Das Aufbringen der wässrigen sauren Lösung kann alternativ mittels einer Standardbeschichtungstechnologie, wie durch Aufsprayen, Aufpinseln oder roller coating, erfolgen. Die Metallisierung erfolgt unabhängig von der Form des Kunststoff-Gegenstandes an allen Stellen, die mit der Lösung in Kontakt kommen. Es kann aber auch zweckmässig sein, die Lösung während des Metallisierungsvorgangs in Bewegung zu halten. Dies erfolgt auf an sich bekannte Weise durch Schütteln oder vorzugsweise durch Rühren, z.B. mittels eines Magnetrührers, durch Bewegen der Probe oder durch Einblasen von Luft.The method according to the invention is particularly simple because the plastic objects to be treated only have to be immersed in the aqueous acidic solution of the noble metal salt without special stirring devices. Alternatively, the aqueous acidic solution can be applied using standard coating technology, such as spraying, brushing or roller coating. The metallization takes place regardless of the shape of the plastic object at all points that come into contact with the solution. However, it can also be expedient to keep the solution in motion during the metallization process. This is done in a manner known per se by shaking or preferably by stirring, e.g. by means of a magnetic stirrer, by moving the sample or by blowing in air.

Die Temperatur des Bades ist grundsätzlich nicht kritisch. Vorzugsweise wird die Metallisierung bei etwa 10-95 °C durchgeführt, insbesondere bei leicht erhöhter Temperatur, etwa bei 20-50°C.The temperature of the bath is generally not critical. The metallization is preferably carried out at approximately 10-95 ° C., in particular at a slightly elevated temperature, approximately at 20-50 ° C.

Die Metallisierung erfolgt in einer sauren Lösung. Die Acidität der sauren Lösung hängt auch vom verwendeten Metalloxid-Füllstoff sowie dessen Konzentration im Kunststoff-Gegenstand ab. Es hat sich gezeigt, dass das Optimum jeweils in einem relativ tiefen Aciditätsbereich bezüglich der Säurekonzentration liegt.The metallization takes place in an acidic solution. The acidity of the acidic solution also depends on the metal oxide filler used and its concentration in the plastic object. It has been shown that the optimum lies in a relatively low acidity range with regard to the acid concentration.

Das Einstellen der Säurekonzentration erfolgt auf übliche Weise mittels starker Säuren, wie Mineralsäuren, Carbonsäuren oder Sulfonsäuren. Beispiele dafür sind Salzsäure, Salpetersäure, Schwefelsäure, Phosphorsäure, Fluorwasserstoffsäure, Essigsäure oder p-Toluolsulfonsäure. Bevorzugt sind Phosporsäure, Salzsäure, Salpetersäure und Schwefelsäure. Die Konzentration der Säure berträgt zweckmässig z.B. 0,05 bis 90 Vol.%, bevorzugt 0,1 bis 10 Vol.%.The acid concentration is adjusted in the usual way using strong acids, such as mineral acids, carboxylic acids or sulfonic acids. Examples include hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid, hydrofluoric acid, acetic acid or p-toluenesulfonic acid. Phosphoric acid, hydrochloric acid, nitric acid and sulfuric acid are preferred. The concentration of the acid expediently transfers e.g. 0.05 to 90% by volume, preferably 0.1 to 10% by volume.

Erfindungsgemäss werden die Konzentrationen der Säure, des Edelmetallsalzes und des Füllstoffes (Metalloxids) untereinander derart eingestellt, dass die Edelmetallabscheidung diskontinuierlich erfolgt und in einer genügenden Menge, so dass anschliessend eine vollständige Metallbeschichtung problemlos (d.h. u.a. mit genügender Haftung und vollständiger Beschichtung der zu behandelnden Gegenstand-Oberflächejerhalten werden kann.
Wird z.B. eine hohe Säure- und Edelmetallsalz-konzentration eingesetzt, so ist es zweckmässig, eine niedrige Füllstoff-konzentration zu verwenden. Bei Verwendung einer hohen Säurekonzentration und einer niedrigen Edelmetallsalz-konzentration wird zweckmässig eine hohe Füllstoff-konzentration eingesetzt. Werden dagegen eine niedrige Säure- und Edelmetallsalz-konzentration verwendet, so ist es zweckmässig, eine mittlere bis niedrige Füllstoff-konzentration einzusetzen.
Besonders bevorzugt sind Metallisierungsbäder, in welchen die Säure und das Edelmetallsalz das gleiche Anion besitzen.
According to the invention, the concentrations of the acid, the noble metal salt and the filler (metal oxide) are adjusted to one another in such a way that the noble metal is deposited discontinuously and in a sufficient amount so that a complete metal coating is then carried out without any problems (ie with sufficient adhesion and complete coating of the object to be treated). Surface can be obtained.
If, for example, a high acid and noble metal salt concentration is used, it is advisable to use a low filler concentration. When using a high acid concentration and a low noble metal salt concentration, a high filler concentration is expediently used. If, on the other hand, a low acid and noble metal salt concentration is used, it is advisable to use a medium to low filler concentration.
Metallization baths in which the acid and the noble metal salt have the same anion are particularly preferred.

Die Metallisierungsdauer hängt natürlich von verschiedenen Parametern ab, wie Temperatur, Säurekonzentration, Konzentration des Edelmetallsalzes und des Füllstoff und gegebenenfalls Bewegung der Metallisierungslösung. Typische Metallisierungen entstehen üblicherweise zwischen 10 Sek. und 60 Minuten, meistens zwischen 30 Sek. und 10 Minuten.The duration of the metallization naturally depends on various parameters, such as temperature, acid concentration, concentration of the noble metal salt and the filler and, if appropriate, movement of the metallization solution. Typical metallizations usually occur between 10 seconds and 60 minutes, mostly between 30 seconds and 10 minutes.

Nach der erfindungsgemäss diskontinuierlichen Metallisierungsstufe werden die erhaltenen kunsstoff-Gegenstände auf an sich bekannte Weise durch elektrochemische, elektrolytische oder elektrochemische plus elektrolytische Metallabscheidung vollständig beschichtet. Bei diesem Schichtaufbau kann ein beliebiges Metall, z.B. Zinn, Zink, Cadmium oder insbesondere Kupfer oder Nickel, in einer Stufe oder in mehreren getrennt durchgeführten Stufen aufgebracht werden.After the discontinuous metallization step according to the invention, the plastic objects obtained are completely completed in a manner known per se by electrochemical, electrolytic or electrochemical plus electrolytic metal deposition coated. With this layer structure, any metal, for example tin, zinc, cadmium or in particular copper or nickel, can be applied in one step or in several steps carried out separately.

Im Vergleich zum Verfahren gemäss EP-Patentanmeldung Nr. 0417037, wonach eine kontinuierliche Edelmetallbeschichtung erzeugt wird, erlaubt das vorliegende Verfahren eine einwandfreie Metallisierung von Kunststoff-Gegenständen beliebiger Form und mit ausgezeichneten anwendungstechnischen Eigenschaften, insbesondere hervorragender Haftung, herzustellen, obwohl die Oberfläche des Kunststoff-Gegenstandes nur teilweise und diskontinuierlich mit dem Edelmetall metallisiert ist. Ausserdem werden deutlich geringere Mengen an Edelmetallsalzen auf der Gegenstand-Oberfläche abgeschieden; dieses Verfahren ist daher kostengünstiger.
Nach dem vorliegenden Verfahren ist es ferner möglich, die Menge der auf der Gegenstand-Oberfläche abgeschiedenen Edelmetallpartikeln unabhängig von der an der Gegenstand-Oberfläche reduzierten Cu₂O-Menge einzustellen: so können z.B. durch Behandlung des Kunststoff-Gegenstandes in einer Lösung, welche reich an Edelmetallsalzen jedoch säurearm ist, mehr Edelmetallpartikeln als reduzierte Kupferteile erzeugt werden, dagegen können weniger Edelmetallpartikeln als Kupferteile in einem Lösungsbad, das säurereich jedoch bezüglich Edelmetallsalze arm ist, abgeschieden werden.
Durch die Tatsache, dass die erfindungsgemäss durchgeführte Metallisierung auf der Gegenstand-Oberfläche diskontinuierlich ist, ist der elektrische Widerstand unendlich. Die so beschichteten Kunststoff-Gegenstände kommen in den verschiedenartigsten Industriezweigen, bei denen man metallische Oberflächen benötigt, zur Anwendung, z.B. in der Automobilindustrie, wie für Rahmen von Anzeigeinstrumenten, Radios, Türgriffen für Fensterheber, Heizungsgrills, Armaturenbrettköpfe, Scheinwerfer, Rücklichter, etc., ferner in der Radio-, TV- und Elektronikindustrie, insbesondere für gedruckte Schaltungen, sowohl in Mehrschicht- wie auch Hybrid-Schaltungen und als Chips-Träger, und in EMI-Shielding Installationen, ausserdem in der Luftfahrindustrie, in der Dental- und Medizinalindustrie, in der optischen Industrie, beispielsweise bei der Spiegelherstellung, sowie bei Haushalt-Gegenständen.
In comparison to the process according to EP patent application No. 0417037, according to which a continuous noble metal coating is produced, the present process allows a perfect metallization of plastic objects of any shape and with excellent application properties, in particular excellent adhesion, although the surface of the plastic Object is only partially and discontinuously metallized with the precious metal. In addition, significantly smaller amounts of precious metal salts are deposited on the surface of the object; this method is therefore less expensive.
According to the present method, it is also possible to adjust the amount of the noble metal particles deposited on the article surface independently of the reduced amount of Cu₂O on the article surface: for example, by treating the plastic article in a solution rich in noble metal salts However, it is low in acid, more precious metal particles are produced than reduced copper parts, whereas fewer precious metal particles than copper parts can be deposited in a solution bath which is low in acid with respect to precious metal salts.
Due to the fact that the metallization according to the invention is discontinuous on the surface of the object, the electrical resistance is infinite. The plastic objects coated in this way are used in a wide variety of industries where metallic surfaces are required, for example in the automotive industry, such as for frames for display instruments, radios, door handles for window regulators, heating grills, dashboard heads, headlights, taillights, etc., also in the radio, TV and electronics industry, in particular for printed circuits, both in multilayer and hybrid circuits and as chip carriers, and in EMI shielding installations, in addition in the aerospace industry, in the dental and medical industry, in the optical industry, for example in the manufacture of mirrors, as well as in household items.

Beispiel 1:Example 1:

Ausgehend von einem Laminierharzgemisch auf Basis von Bisphenol A-diglycidylether mit einem Epoxid-Gehalt von 2,03 Eq/kg, gelöst in Methylethylketon, enthaltend
   67,39 Teile Laminierharz
   2,37 Teile Härter (Dicyandiamid und 2-Methylimidazol; 10:1)
   werden darin 25, 16 Teile Cu₂O und 5,09 Teile Antimontrioxid suspendiert. Mit dieser Suspension wird auf üblichen Wege Glasgewebe (Hersteller. Clark-Schwebel) des Typs 7628 (200 g/m²) imprägniert. Diese Prepregs werden getrocknet und in 7 Lagen zu Platten verpresst, deren Zusammensetzung sich wie folgt präsentiert: Harz/Härter 38,5 Gew.-% Glasgewebe 45,9 Gew.-% Sb₂O₃ 1,3 Gew.-% Cu₂O 14,3 Gew.-%
Starting from a laminating resin mixture based on bisphenol A diglycidyl ether with an epoxy content of 2.03 eq / kg, dissolved in methyl ethyl ketone, containing
67.39 parts of laminating resin
2.37 parts hardener (dicyandiamide and 2-methylimidazole; 10: 1)
25, 16 parts of Cu₂O and 5.09 parts of antimony trioxide are suspended therein. This suspension is used to impregnate type 7628 (200 g / m²) glass fabric (manufacturer. Clark-Schwebel). These prepregs are dried and pressed into sheets in 7 layers, the composition of which is as follows: Resin / hardener 38.5% by weight Glass fabric 45.9% by weight Sb₂O₃ 1.3% by weight Cu₂O 14.3% by weight

Mit einem Schmirgelpapier wird die harzreiche Oberfläche aufgerauht. Die so behandelten Platten werden 10 Minuten bei 21°C in eine wässrige PdCl₂-Lösung der Konzentration 0,1 g/l und enthaltend 50 ml/l HCl (37 %-ig) getaucht. Dabei wird das Bad mit einem Magnetrührer bei 400 U/Min. gerührt. Dann werden die Platten mit Wasser gereinigt (gespült) und während 30 Min. bei 40°C in einem konventionellen Kupfer-Bad EC 580 (Lieferant kemifar) metallisiert. Die so erhaltene Metallschicht deckt die Oberfläche des Kunststoff-Gegenstandes vollständig und hat eine Dicke von 2,5 Mikron.The resin-rich surface is roughened with emery paper. The plates treated in this way are immersed for 10 minutes at 21 ° C. in an aqueous PdCl₂ solution with a concentration of 0.1 g / l and containing 50 ml / l HCl (37%). The bath is then magnetically stirred at 400 rpm. touched. The plates are then cleaned (rinsed) with water and metallized for 30 minutes at 40 ° C. in a conventional copper bath EC 580 (supplier kemifar). The metal layer thus obtained completely covers the surface of the plastic article and has a thickness of 2.5 microns.

Beispiele 2-17: Examples 2-17 :

Reaktionsbedingungen und Ausgangsmaterialien sind analog dem Beispiel 1, jedoch werden die folgenden Parameter bzw. Metallisierungsbedingungen gemäss folgender Tabelle variiert.

Figure imgb0001
Reaction conditions and starting materials are analogous to Example 1, but the following parameters or metallization conditions are varied according to the following table.
Figure imgb0001

Beispiel 18:Example 18:

Auf ein Polyurethan-Formteil wird auf einer Seite durch In-Mold-Coating eine Polyurethanschicht enthaltend 30 Gew.% Cu₂O aufgetragen. Das Formteil wird 30 Minuten bei 60-65 °C in einem Entfettungsbad (Kemifar EC 4035, 10 Vol.%) behandelt. Nach Spülen mit Wasser wird die Probe 20 Minuten bei Raumtemperatur in einem Aetzbad (150 ml Kemifar Enplate MLB 497B, 30 ml Kemifar Enplate MLB 497C, 80 g Kaliumpermanganat, 40 g Natriumhydroxid, mit Wasser auf 1 l aufgefüllt) oberflächlich angeätzt, wobei die Lösung mit einem Magnetrührer gerührt wird (400 U/Min.). Nach Spülen mit Wasser wird das oberflächlich abgeschiedene Mangandioxid durch 3-minütiges Eintauchen in eine 0,1 molare wässrige Hydroxylaminsulfatlösung unter Einfluss von Ultraschall entfern. Das Formteil wird wiederum gespült und dann durch Eintauchen in eine wässrige Lösung von PdCl₂ (0,1 g/l) enthaltend 100 ml/l HCl 37%g während 6 Min. bei 21°C metallisiert. Dabei wird das Bad mit einem Magnetrührer gerührt (400 U/Min.). Anschliessend wird die Probe mit Wasser gespült und im Kupferbad EC 580 20 Min. bei 40°C metallisiert. Anschliessend wird die Probe mit Wasser gespült und in einem Galvano-Kupferbad (65 Min. bei 28°C mit 3A/dm²; Kemifar KHT 482) mit Kupfer beschichtet. Während der Elektrolyse wird die Probe bewegt, und Luft wird in die Lösung eingeblasen. Die so erhaltene Kupferschicht hat eine Schichtdicke von 41 Mikron. Die Haftung nach der Metallisierung ist grösser als 6 N/cm. Nach drei Wochen Lagerung ist sie grösser als 10 N/cm. Die Seite des Formteils, die kein Cu₂O enthält, wird nicht metallisiert.A polyurethane layer containing 30% by weight of Cu₂O is applied to one side of a molded polyurethane part by in-mold coating. The molded part is treated for 30 minutes at 60-65 ° C in a degreasing bath (Kemifar EC 4035, 10 vol.%). After rinsing with water, the sample is surface-etched for 20 minutes at room temperature in an etching bath (150 ml Kemifar Enplate MLB 497B, 30 ml Kemifar Enplate MLB 497C, 80 g potassium permanganate, 40 g sodium hydroxide, made up to 1 liter with water), the solution is stirred with a magnetic stirrer (400 rpm). After rinsing with water, the manganese dioxide deposited on the surface is removed by immersion for 3 minutes in a 0.1 molar aqueous hydroxylamine sulfate solution under the influence of ultrasound. The molding is rinsed again and then metallized by immersion in an aqueous solution of PdCl₂ (0.1 g / l) containing 100 ml / l HCl 37% g for 6 minutes at 21 ° C. The bath is stirred with a magnetic stirrer (400 rpm). The sample is then rinsed with water and metallized in an EC 580 copper bath for 20 minutes at 40 ° C. The sample is then rinsed with water and coated with copper in a galvano-copper bath (65 min at 28 ° C with 3A / dm²; Kemifar KHT 482). During the electrolysis, the sample is agitated and air is blown into the solution. The copper layer obtained in this way has a layer thickness of 41 microns. The adhesion after the metallization is greater than 6 N / cm. After three weeks of storage, it is greater than 10 N / cm. The side of the molded part that does not contain Cu₂O is not metallized.

Beispiel 19:Example 19:

Ausgehend von einem Laminierharzgemisch auf Basis von Bisphenol A-diglycidylether mit einem Epoxid-Gehalt von 2,03 Eq/kg, gelöst in Methylethylketon, enthaltend
   96 Teile Laminierharz
   3 Teile Härter (Dicyandiamid und 2-Methylimidazol; 10:1)
   werden darin 1 Teil Cu₂O suspendiert. Mit dieser Suspension wird auf üblichen Wege Glasgewebe (Hersteller: Clark-Schwebel) des Typs 7628 (200 g/m²) imprägniert. Diese Prepregs werden getrocknet und in 7 Lagen zu Platten verpresst, deren Zusammensetzung sich wie folgt präsentiert:

Harz/Härter
59,5 Gew.-%
Glasgewebe
39,9 Gew.-%
Cu₂O
0,6 Gew.-%
Starting from a laminating resin mixture based on bisphenol A diglycidyl ether with an epoxy content of 2.03 eq / kg, dissolved in methyl ethyl ketone, containing
96 parts of laminating resin
3 parts hardener (dicyandiamide and 2-methylimidazole; 10: 1)
1 part of Cu₂O are suspended therein. Glass suspension (manufacturer: Clark-Schwebel) of type 7628 (200 g / m²) is impregnated with this suspension in the usual way. These prepregs are dried and pressed into sheets in 7 layers, the composition of which is as follows:
Resin / hardener
59.5% by weight
Glass fabric
39.9% by weight
Cu₂O
0.6% by weight

Mit einem Schmirgelpapier wird die harzreiche Oberfläche aufgerauht. Die so behändelten Platten werden 10 Minuten bei 45°C in eine wässrige PdCl₂-Lösung der Konzentration 0,5 g/l und enthaltend 0,9 ml/l HCl (37%o-ig) getaucht. Dabei wird das Bad mit einem Magnetrührer bei 400 U/Min. gerührt. Dann werden die Platten mit Wasser gereinigt (gespült) und während 30 Min. bei 40°C im konventionellen Kupfer-Bad EC 580 (Kemifar) metallisiert. Die so erhaltene Metallschicht deckt die Oberfläche des Kunststoff-Gegenstandes vollständig.The resin-rich surface is roughened with emery paper. The plates treated in this way are immersed for 10 minutes at 45 ° C. in an aqueous PdCl₂ solution with a concentration of 0.5 g / l and containing 0.9 ml / l HCl (37% o-ig). The bath is then magnetically stirred at 400 rpm. touched. The plates are then cleaned (rinsed) with water and metallized for 30 minutes at 40 ° C. in a conventional copper bath EC 580 (Kemifar). The metal layer thus obtained completely covers the surface of the plastic object.

Beispiel 20: Example 20 :

Eine gemäss Beispiel 1 hergestellte Probe wird wie folgt stufenweise behandelt:
Quellen in einem Kupfer-Bad "MLB conditioner 212" (Shipley):
   MLB 212: 350ml
   Cuposit Z: 35ml
   Wasser : 615 ml
   Temp. : 62°C
   Dauer : 5 Min.
   Magnetrührer. 200 U/Min.;
Spülen mit Wasser;
Aetzen mit kMnO₄ im folgenden Kupfer-Bad:
   MLB 497B (Kemifar): 150 ml
   MLB 497C (Kemifar): 30 ml
   KMnO₄: 80 g
   NaOH: 40 g
   Wasser. 1000 ml
   Temp. : 85°C
   Dauer. 30 Min.
   Magnetrührer. 700 U/Min.
Spülen mit Wasser;
Deoxidierung in einer wässrigen Hydroxylaminsulfät-Lösung (0,1 Molar.) während 3 Min. bei R.T. mit Ultraschalrührer;
Spülen mit Wasser;
Behandlung mit Palladium in einem wässrigen Bad:
   PdCl₂: 0,1 g/l
   HCl(37%-ig): 100 ml/l
   Temp.: 21°C
   Dauer: 10 Min.
Spülen mit Wasser;
Kupferbeschichtung im Bad EC 580 bei 40°C und während 20 Min. mit Einblasen von Luft;
Spülen mit Wasser:
Elektrolyrische Kupferbehandlung in einem Bad KHT 482 (Kemifar) bei 28°C während 55 Min. mit 3 A/dm² unter Rührung des Bades und Bewegen des Musters;
Spülen mit Wasser, dann übliche Lufttrocknung und anschliessende Trocknung in einem Ofen bei 140°C während 1 Stunde.
Die Dicke der so erhaltenen Metallbeschichtung beträgt 38 Mikron, und die Haftung des Kupfers beträgt 20 N/cm.
A sample prepared according to Example 1 is treated in stages as follows:
Sources in a copper bath "MLB conditioner 212" (Shipley):
MLB 212: 350ml
Cuposit Z: 35ml
Water: 615 ml
Temp.: 62 ° C
Duration: 5 min.
Magnetic stirrer. 200 rpm;
Rinsing with water;
Etching with kMnO₄ in the following copper bath:
MLB 497B (Kemifar): 150 ml
MLB 497C (Kemifar): 30 ml
KMnO₄: 80 g
NaOH: 40 g
Water. 1000 ml
Temp.: 85 ° C
Duration. 30 min.
Magnetic stirrer. 700 rpm
Rinsing with water;
Deoxidation in an aqueous hydroxylamine sulfate solution (0.1 molar) for 3 min at RT with an ultrasonic stirrer;
Rinsing with water;
Treatment with palladium in an aqueous bath:
PdCl₂: 0.1 g / l
HCl (37%): 100 ml / l
Temp .: 21 ° C
Duration: 10 min.
Rinsing with water;
Copper coating in the EC 580 bath at 40 ° C and for 20 minutes with air blowing;
Rinse with water:
Electrolytic copper treatment in a bath KHT 482 (Kemifar) at 28 ° C for 55 min with 3 A / dm² while stirring the bath and moving the sample;
Rinse with water, then usual air drying and then drying in an oven at 140 ° C for 1 hour.
The thickness of the metal coating thus obtained is 38 microns and the adhesion of the copper is 20 N / cm.

Beispiel 21:Example 21:

Ausgehend von einem Laminierharzgemisch auf Basis von Bisphenol A-diglycidylether mit einem Epoxid-Gehalt von 2,03 Eq/kg, gelöst in Methylethylketon, enthaltend
   67,39 Teile Laminierharz
   2,37 Teile Härter (Dicyandiamid und 2-Methylimidazol; 10: 1)
   werden darin 25,16 Teile SnO und 5,09 Teile Antimontrioxid suspendiert. Mit dieser Suspension wird auf üblichen Wege Glasgewebe (Hersteller. Clark-Schwebel) des Typs 7628 (200 g/m²) imprägniert. Diese Prepregs werden getrocknet und in 7 Lagen zu Platten verpresst, deren Zusammensetzung sich wie folgt präsentiert: Harz/Härter 28,5 Gew.-% Glasgewebe 45,9 Gew.-% Sb₂O₃ 1,3 Gew.-% SnO 14,3 Gew.-%
Starting from a laminating resin mixture based on bisphenol A diglycidyl ether with an epoxy content of 2.03 eq / kg, dissolved in methyl ethyl ketone, containing
67.39 parts of laminating resin
2.37 parts hardener (dicyandiamide and 2-methylimidazole; 10: 1)
25.16 parts of SnO and 5.09 parts of antimony trioxide are suspended therein. This suspension is used to impregnate type 7628 (200 g / m²) glass fabric (manufacturer. Clark-Schwebel). These prepregs are dried and pressed into sheets in 7 layers, the composition of which is as follows: Resin / hardener 28.5% by weight Glass fabric 45.9% by weight Sb₂O₃ 1.3% by weight SnO 14.3% by weight

Mit einem Schmirgelpapier wird die harzreiche Oberfläche aufgerauht. Die so behandelten Platten werden 10 Minuten bei 21°C in eine wässrige PdCl₂-Lösung der Konzentration 0,1 g/l und enthaltend 2 ml/l HCl (37 %-ig) getaucht. Dabei wird das Bad mit einem Magnetrührer bei 400 U/Min. gerührt. Dann werden die Platten mit Wasser gereinigt (gespült) und während 30 Min. bei 40°C in einem konventionellen Kupfer-Bad EC 580 (Lieferant kemifar) metallisiert. Die so erhaltene Metallschicht deckt die Oberfläche des Kunststoff-Gegenstandes vollständig und hat eine Dicke von 2,5 Mikron.The resin-rich surface is roughened with emery paper. The plates treated in this way are immersed for 10 minutes at 21 ° C. in an aqueous PdCl₂ solution with a concentration of 0.1 g / l and containing 2 ml / l HCl (37%). The bath is then magnetically stirred at 400 rpm. touched. The plates are then cleaned (rinsed) with water and metallized for 30 minutes at 40 ° C. in a conventional copper bath EC 580 (supplier kemifar). The metal layer thus obtained completely covers the surface of the plastic article and has a thickness of 2.5 microns.

Claims (11)

Verfahren zur teilweisen und diskontinuierlichen Metallisierung eines Kunststoff-Gegenstandes mit Edelmetallpartikeln, wonach der Kunststoff-Gegenstand enthaltend einen feinteiligen, homogen verteilten Füllstoff ausgewählt aus der Gruppe bestehend aus MnO, NiO, Cu₂O, SnO und Bi₂O₃ mit einer sauren wässrigen Lösung eines Edelmetallsalzes so behandelt wird, dass auf der Kunststoff-Oberfläche durch geeignete Einstellung der Konzentration der Säure, des Edelmetallsalzes und des Füllstoffes untereinander Edelmetallpartikeln teilweise und diskontinuierlich elektrochemisch aufgebracht werden und der so metallisierte Gegenstand zur Herstellung einer kontinuierlichen Metallschicht auf der behandelten Oberfläche mit einem Metall nach einem konventionellen Verfahren behandelt wird.Process for the partial and discontinuous metallization of a plastic article with precious metal particles, according to which the plastic article containing a finely divided, homogeneously distributed filler selected from the group consisting of MnO, NiO, Cu₂O, SnO and Bi₂O₃ is treated with an acidic aqueous solution of a noble metal salt that noble metal particles are partially and discontinuously electrochemically applied to the plastic surface by suitable adjustment of the concentration of the acid, the noble metal salt and the filler to one another, and the thus metallized article is treated with a metal by a conventional method to produce a continuous metal layer on the treated surface becomes. Verfahren gemäss Anspruch 1, wobei der Kunststoff-Gegenstand aus 0,5-90 Gew.-% des Füllstoffs und 99,5-10 Gew.-% eines polymeren Harzes besteht.A method according to claim 1, wherein the plastic article consists of 0.5-90% by weight of the filler and 99.5-10% by weight of a polymeric resin. Verfahren gemäss Anspruch 2, wobei der Kunststoff-Gegenstand aus 10-30 Gew.-% des Füllstoffs und 90-70 Gew.-% eines polymeren Harzes besteht.A method according to claim 2, wherein the plastic article consists of 10-30% by weight of the filler and 90-70% by weight of a polymeric resin. Verfahren gemäss Anspruch 1, wobei die wässrige Lösung mindestens 10⁻⁵ Mol/l eines Edelmetallsalzes enthält.A method according to claim 1, wherein the aqueous solution contains at least 10⁻⁵ mol / l of a noble metal salt. Verfahren gemäss Anspruch 1, wobei das Edelmetallsalz ein Salz von Au, Ag, Ru, Rh, Pd, Os, Ir oder Pt ist.A method according to claim 1, wherein the noble metal salt is a salt of Au, Ag, Ru, Rh, Pd, Os, Ir or Pt. Verfahren gemäss Anspruch 1, wobei das Edelmetallsalz als Anion Cl⁻, NO₃⁻, SO₄²- oder CH₃COO⁻ enthält.A method according to claim 1, wherein the noble metal salt contains Cl⁻, NO₃⁻, SO₄²- or CH₃COO⁻ as an anion. Verfahren gemäss Anspruch 1, wobei der Kunststoff-Gegenstand in eine saure, wässrige Lösung eines Edelmetallsalzes eingetaucht wird oder das Metallisieren mittels einer Standardbeschichtungstechnologie vorgenommen wird.A method according to claim 1, wherein the plastic article is immersed in an acidic, aqueous solution of a noble metal salt or the metallization is carried out by means of a standard coating technology. Verfahren gemäss Anspruch 7, wobei die Metallisierung bei einer Temperatur von etwa 10-95°C durchgeführt wird.A method according to claim 7, wherein the metallization is carried out at a temperature of about 10-95 ° C. Verfahren gemäss Anspruch 1, wobei die Säurekonzentration der Edelmetallsalz-Lösung zwischen 0,05 und 90 Vol. % liegt.A method according to claim 1, wherein the acid concentration of the noble metal salt solution is between 0.05 and 90 vol.%. Verfahren gemäss Anspruch 1, wobei der erhaltene Kunststoff-Gegenstand nach der diskontinuierlichen Metallisierung durch elektrochemische, elektrolytische oder elektrochemische plus elektrolytische Metallabscheidung behandelt wird.A method according to claim 1, wherein the plastic article obtained is treated after the discontinuous metallization by electrochemical, electrolytic or electrochemical plus electrolytic metal deposition. Der nach dem Verfahren gemäss Anspruch 1 erhältliche Kunststoff-Gegenstand.The plastic object obtainable by the method according to claim 1.
EP19920810626 1991-08-23 1992-08-14 Process for metallising plastic articles Withdrawn EP0530144A3 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19540122A1 (en) * 1994-10-28 1996-05-02 Motorola Inc Process for reducing the initiation time in an electroless bath
EP0726697A2 (en) * 1995-01-30 1996-08-14 Nec Corporation Improved printed wiring board and method for preparing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2014399A1 (en) * 1969-03-27 1970-10-15 General Electric Company, Schenectady, N.Y. (V.St.A.) Metal-containing synthetic resin and its use in the manufacture of metal plating or electrical circuits
EP0417037A2 (en) * 1989-09-01 1991-03-13 Ciba-Geigy Ag Process for coating plastic articles

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2014399A1 (en) * 1969-03-27 1970-10-15 General Electric Company, Schenectady, N.Y. (V.St.A.) Metal-containing synthetic resin and its use in the manufacture of metal plating or electrical circuits
EP0417037A2 (en) * 1989-09-01 1991-03-13 Ciba-Geigy Ag Process for coating plastic articles

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19540122A1 (en) * 1994-10-28 1996-05-02 Motorola Inc Process for reducing the initiation time in an electroless bath
FR2726205A1 (en) * 1994-10-28 1996-05-03 Motorola Inc PROCESS FOR REDUCING THE START-UP TIME IN A AUTOCATALYTIC BATH
EP0726697A2 (en) * 1995-01-30 1996-08-14 Nec Corporation Improved printed wiring board and method for preparing the same
EP0726697A3 (en) * 1995-01-30 1998-01-07 Nec Corporation Improved printed wiring board and method for preparing the same

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JPH05195286A (en) 1993-08-03

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