EP0493532A1 - Ballistic resistant composite armor having improved multiple-hit capability - Google Patents
Ballistic resistant composite armor having improved multiple-hit capabilityInfo
- Publication number
- EP0493532A1 EP0493532A1 EP19900917256 EP90917256A EP0493532A1 EP 0493532 A1 EP0493532 A1 EP 0493532A1 EP 19900917256 EP19900917256 EP 19900917256 EP 90917256 A EP90917256 A EP 90917256A EP 0493532 A1 EP0493532 A1 EP 0493532A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- poly
- armor
- vibration isolating
- filaments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
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- IFVGFQAONSKBCR-UHFFFAOYSA-N n-[bis(aziridin-1-yl)phosphoryl]pyrimidin-2-amine Chemical compound C1CN1P(N1CC1)(=O)NC1=NC=CC=N1 IFVGFQAONSKBCR-UHFFFAOYSA-N 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- FJXWKBZRTWEWBJ-UHFFFAOYSA-N nonanediamide Chemical compound NC(=O)CCCCCCCC(N)=O FJXWKBZRTWEWBJ-UHFFFAOYSA-N 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- MPARYNQUYZOBJM-UHFFFAOYSA-N oxo(oxolutetiooxy)lutetium Chemical compound O=[Lu]O[Lu]=O MPARYNQUYZOBJM-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- UFQXGXDIJMBKTC-UHFFFAOYSA-N oxostrontium Chemical compound [Sr]=O UFQXGXDIJMBKTC-UHFFFAOYSA-N 0.000 description 1
- MMKQUGHLEMYQSG-UHFFFAOYSA-N oxygen(2-);praseodymium(3+) Chemical compound [O-2].[O-2].[O-2].[Pr+3].[Pr+3] MMKQUGHLEMYQSG-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- IBBMAWULFFBRKK-UHFFFAOYSA-N picolinamide Chemical compound NC(=O)C1=CC=CC=N1 IBBMAWULFFBRKK-UHFFFAOYSA-N 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920000314 poly p-methyl styrene Polymers 0.000 description 1
- 229920001599 poly(2-chlorostyrene) Polymers 0.000 description 1
- 229920001618 poly(2-methyl styrene) Polymers 0.000 description 1
- 229920001597 poly(4-chlorostyrene) Polymers 0.000 description 1
- 229920003213 poly(N-isopropyl acrylamide) Polymers 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920003220 poly(alpha-phenylethyl isocyanide) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920003195 poly(n-butyl isocyanate) Polymers 0.000 description 1
- 229920000833 poly(n-hexyl isocyanate) polymer Polymers 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000343 polyazomethine Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000120 polyethyl acrylate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000441 polyisocyanide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001184 polypeptide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920006216 polyvinyl aromatic Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910003447 praseodymium oxide Inorganic materials 0.000 description 1
- 102000004196 processed proteins & peptides Human genes 0.000 description 1
- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011226 reinforced ceramic Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910001954 samarium oxide Inorganic materials 0.000 description 1
- 229940075630 samarium oxide Drugs 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- HYXGAEYDKFCVMU-UHFFFAOYSA-N scandium oxide Chemical compound O=[Sc]O[Sc]=O HYXGAEYDKFCVMU-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229910003451 terbium oxide Inorganic materials 0.000 description 1
- SCRZPWWVSXWCMC-UHFFFAOYSA-N terbium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Tb+3].[Tb+3] SCRZPWWVSXWCMC-UHFFFAOYSA-N 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- ZCUFMDLYAMJYST-UHFFFAOYSA-N thorium dioxide Chemical compound O=[Th]=O ZCUFMDLYAMJYST-UHFFFAOYSA-N 0.000 description 1
- 229910003452 thorium oxide Inorganic materials 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910000439 uranium oxide Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
- F41H5/00—Armour; Armour plates
- F41H5/02—Plate construction
- F41H5/04—Plate construction composed of more than one layer
- F41H5/0414—Layered armour containing ceramic material
Definitions
- This invention relates to ballistic resistant composite articles. More particularly, this invention relates to such articles having improved ballistic protection.
- Ballistic articles such as bulletproof vests, helmets, structural members of helicopters and other military equipment, vehicle panels, briefcases, raincoats, parachutes, and umbrellas containing high strength fibers are known.
- Fibers conventionally used include aramid fibers such as poly (phenylenediamine terephthalamide) , graphite fibers, nylon fibers, ceramic fibers, glass fibers and the like.
- the fibers are used in a woven or knitted fabric.
- the fibers are encapsulated or embedded in a matrix material.
- USP 4,403,012 and USP 4, 457,985 disclose ballistic resistant composite articles comprised of networks of high molecular weight polyethylene or polypropylene fibers, and matrices composed of olefin polymers and copolymers, unsaturated polyester resins, epoxy resins, and other resins curable below the melting point of the fiber.
- US Patent Nos. 4,623,574 and 4,748,064 disclose a simple composite structure exhibits outstanding ballistic protection as compared to simple composites utilizing. rigid matrices, the results of which are disclosed in the patents. Particularly effective are weight polyethylene and polypropylene such as disclosed in US Patent No. 4,413,110.
- US Patent Nos. 4,737,402 and 4,613,535 disclose complex rigid composite articles having improved impact resistance which comprise a network of high strength fibers such as the ultra-high molecular weight polyethylene and polypropylene disclosed in US Patent No. 4,413,110 embedded in an elastomeric matrix material and at least one additional rigid layer on a major surface of the fibers in the matrix. It is disclosed that the composites have improved resistance to environmental hazards, improved impact resistance and are unexpectedly effective as ballistic resistant articles such as armor.
- U.S. Patent 3,516,890 disclosed an armor plate composite with multiple-hit capability. US Patent No.
- 4,836,084 discloses an armor plate composite composed of four main components, a ceramic impact layer for blunting the tip of a projectile, a sub-layer laminate of metal sheets alternating with fabrics impregnated with a viscoelastic synthetic material for absorbing the kinetic energy of the projectile by plastic deformation and a backing layer consisting of a pack of impregnated fabrics. It is disclosed that the optimum combination of the four main components gives a high degree of protection at a limited wieght per unit of surface area.
- Ballistic resistant armor made of ceramic tiles connected to a metal substrate exhibit certain properties which substantially reduces the multiple hit capability of the armor.
- This vibrational energy C an be transmitted as noise and shock, or can be transmitted to vibration sensitive areas of the armor such as to the ceramic impact layer resulting in a shattering and/or loosing of tiles.
- This invention relates to a multilayer complex ballistic armor comprising:
- a vibration isolating layer comprising a network of high strength polymeric filaments having a tenacity of at least about 7 grams/denier, a tensile modulus of at least about 160 grams/denier and an energy-to-break of at least about 8 joules/grams and
- a backing layer comprised of a rigid material.
- FIG 1 is a prospective view of an armor plate according to this invention showing its essential elements of a ceramic impact layer, a vibration isolating layer and a backing layer;
- FIG 2 is a view in cross-section and side elevation of another embodiment of this invention showing a modified vibration isolating layer.
- FIG 3 is a view in cross-section and side elevation of a modified embodiment of this invention depicted in FIG 2.
- FIG 4 is a view in cross-section and side elevation of an embodiment of this invention having a modified ceramic layer.
- the numeral 10 indicates a ballistic resistant article 10.
- Article 10, as shown in FIG 1, comprises three maintain components; a ceramic impact layer 12, a vibration isolating layer 14, and a backing layer 16.
- ceramic impact layer 12 comprises a plurality of ceramic bodies 18, in the more preferred embodiments of the invention, ceramic impact layer 12 comprises at least about four ceramic bodies 12 and in the most preferred embodiments of the invention, ceramic impact layer 12 comprises at least about nine ceramic bodies 12, with those embodiments in which the number of bodies 12 in layer 12 is at least about sixteen being the embodiment of choice.
- Ceramic impact layer 12 is excellently suitable for blunting the tip of the projectile, particularly because the ceramic material forming layer 12 will retain its hardness and strength despite the high increase in temperature that will occur in the region struck by a projectile. Ceramic impact layer 12 comprises of one or more of ceramic bodies 18.
- Body 18 is formed of a ceramic material.
- Useful ceramic materials may vary widely and include those materials normally used in the fabrication of ceramic armor which function to partially deform the initial impact surface of a projectile or cause the projectile to shatter. Illustrative of such metal and non-metal ceramic materials are those described in C.F. Liable, Ballistic Materials and Penetration Mechanics.
- Al oxide Al oxide (A1_0_), barium oxide (BaO), beryllium oxide (BeO) , calcium oxide (CaO) , cerium oxide (Ce-O- and CeO_), chromium oxide (Cr.O.), dysprosium oxide (D 2 0 3 ), erbium oxide (Er-OA, europium oxide: (EuO, Eu_0 ⁇ , and Eu 2 0.), ( Eu ⁇ g ° 2i )' gadolinium oxide (Gd_.0_), hafnium oxide (HfOriad), holmium oxide (Ho.,0,), lanthanum oxide (La_Q,), lutetium oxide (Lu 2 0 3 ), magnesium oxide (MgO) , neodymium oxide (Nd ? 0_), niobium oxide: (NbO, Nb_0 3 , and NbOA, (Nb 2 O ⁇ ), pluton
- Pu0 2 praseodymium oxide: ( Pr0 2 ' Pr 6° ⁇ i' and Pr_0 3 ), promethium oxide (Pm 2 0 3 ), samarium oxide (S O and Sm 2 0_), scandium oxide (Sc_0 3 ), silicon dioxide (Si0 2 ), strontium oxide (SrO) , tantalum oxide (Ta_0 5 ), terbium oxide (Tb-O., and Tb 4 0_,) , thorium oxide (ThOA, thulium oxide (T ⁇ O-), titanium oxide: (TiO, Ti-O-, Ti 3 0 5 and TiO_), uranium oxide (U0 2 , U-0-.
- vanadium oxide VO, 2 0 3 , V0 2 and ⁇ 2 °5 ⁇ ' y tterbiu oxide (Yb 2 0 3 ), yttrium oxide (Y 2 0 3 ), and zirconium oxide (Zr0 2 ).
- Useful ceramic materials also include boron carbide, zirconium carbide, beryllium carbide, aluminum beride, aluminum carbide, boron carbide, silicon carbide, aluminum carbide, titanium nitride, boron nitride, titanium carbide, titanium diboride, iron carbide, iron nitride, barium titanate, aluminum nitride, titanium niobate, boron carbide, silicon boride, barium titanate, silicon nitride, calcium titanate, tantalum carbide, graphites," tungsten; the ceramic alloys which include cordierite/MAS, lead zirconate titanate/PLZT, alumina-titanium carbide, alumina-zirconia, zirconia-cordierite/ZrMAS; the fiber reinforced ceramics and ceramic alloys; glassy ceramics; as well as other useful materials.
- Preferred materials for fabrication of ceramic body 12 are aluminum oxide and metal and non metal nitrides, borides and carb
- body 18 can vary widely depending on the use of the article.
- body 18 can be a unitary structure composed of one ceramic material or multilayer construction composed of layers of the same material or different ceramic materials.
- ceramic body 18 is depicted as a cubular solid, the shape of ceramic body 18 can vary widely depending on the use of the article.
- ceramic body 18 can be an irregularly or a regularly shaped body.
- Illustrative of a useful ceramic body 18 are cubular, rectangular, cylindrical, and polygonal (such as triangular, pentagonal and hexagonal) shaped bodies.
- ceramic body 18 is of cubular, rectangular or cylindrical cross-section.
- body 18 can also vary widely depending on the use of article 10. For example, in those instances where article 10 is intended for use in the fabrication of light ballistic resistant composites for use against light armaments, body 18 is generally smaller; conversely where article 10 is intended for use in the fabrication of heavy ballistic resistant composites for use against heavy armaments then body 18 is generally larger.
- the ceramic bodies 18 are attached to vibration isolating layer 14 which isolates or substantially isolates vibrational and shock waves resulting from the i pact of a projectile at a body 18 from other bodies 18 included in layer 12, and reduces the likelihood that bodies 18 not at the point of projectile contact will crack, shatter or loosen.
- the armor of this invention has relatively higher efficiency of shock absorbance.
- the efficiency of shock absorbance can be measured by the number of completely undamaged (i.e. free of cracks and flaws) ceramic bodies 18 immediately adjacent to the body or bodies 18 at the point of impact retained after impact.
- the % efficiency of shock absorbance can be calculated from the following equation:
- Ceramic bodies 18 at the point of contact may vary from one for as for example for impacts at the center of a ceramic body 18 or at the corner of a body 18 at the edge of ceramic impact layer 12, to two for impacts at the seam of two adjacent ceramic bodies 18 or at the corner of two adjacent ceramic bodies 18 at the edge of impact layer 12 to four where the impact is at the intersecting corner of four adjacent ceramic bodies 18.
- % efficiency of shock absorbance is at least about 70%, in the more preferred embodiments of the invention, the % efficiency of shock absorbance is at least about 95%, and in the most preferred embodiments of the invention, the % efficiency of shock absorbance is about 99 to about 100%.
- the amount of a surface of vibration isolating layer 14 covered by ceramic bodies 18 may vary widely. In general, the greater the area percent of the surface vibration isolating layer 14 covered or loaded, the more effective the protection, and conversely, the lower the area percent of the surface vibration isolating layer 14 covered the less effective the protection.
- the area percent of the surface of vibration isolating layer 14 covered by ceramic bodies 18 is equal to or greater than about 95 area percent based on the total surface area of vibration isolating layer 14, and in the more preferred embodiments of the invention the area percent of surface covered is equal to or greater than about 97 area percent on the aforementioned basis. Amongst the more preferred embodiments of the invention, most preferred are those in which the areas percent of the surface of vibration isolating layer 14 covered by ceramic bodies 18 is equal to or greater than about 98 or 99 area percent based on the total surface area of vibration isolating layer 14.
- Means for attaching ceramic bodies 18 to vibration isolating layer 14 may vary widely and may include any means normally used on the art to provide this function.
- attaching means is selected from the group consisting of flexible adhesive bonding agents.
- flexible bonding agents provide several useful functions. For example, such agents enhance structural performance such that the composite is capable of withstanding severe impact loads, and they enhance the retention of segmented tiles which are not at the point of impact and the retention of spall/particles created by the shattering of tiles on impact.
- adhesives also enhance the conversion of absorbed energy into heat.
- a "flexible adhesive” is a polymeric adhesive which exhibits a Shore A Hardness of from about 20 to 100.
- the adhesive material is a low modulus, elastomeric material which has a tensile modulus, measured at about 23°C, of less than about 7,000 psi (41,300 kpa) .
- the tensile modulus of the elastomeric material is less than about 5,000 psi (34,500 kpa), more preferably is less than 1,000 psi (6900 kpa) and most preferably is less than about 500 psi (3450 kpa) to provide even more improved performance.
- the glass transition temperature (Tg) of the elastomeric material (as evidenced by a sudden drop in the ductility and elasticity of the material) is less than about 0 °C.
- the Tg of the elastomeric material is less than about -40°C, and more preferably is less than about -50° C.
- the elastomeric material also has an elongation to break of at least about 5%.
- the elongation to break of the elastomeric material is at least about 30%.
- suitable elastomeric materials for use as a flexible adhesive are those wich have their structures, properties, and formulation together with cross-linking procedures summarized in the Encyclopedia of Polymer Science, Vol.
- Preferred adhesives are polydienes such as polybutadiene, polychloroprene and polyisoprene; olefinic and copolymers such as ethylene-propylene copolymers, ethylene-propylene-diene copolymers, isobutylene-isoprene copolymers, and chlorosulfonated polyethylene; natural rubber; polysulfides; polyurethane elastomers; polyacrylates; polyethers; fluoroelastomer; unsaturated polyesters; vinyl esters; alkyds; flexible epoxy; flexible polyamides; epichlorohydrin; polyvinyls; flexible phenolics; silcone elastomers; thermoplastic elastomers; copolymers of ethylene, polyvinyl formal, polyvinyl butyal; and poly(bis-maleimide) .
- polydienes such as polybutadiene, polychloroprene and polyisoprene
- Blends of any combination of one or more of the above-mentioned adhesive materials are polybutadiene, polyisoprene, natural rubber, ethylene-propylene copolymers, ethylene-propylene-diene terpolymers, polysulfides, polyurethane elastomers, chlorosulfonated polyethylene, polychloroprene, poly(isobutylene-co- isoprene), polyacrylates, polyesters, polyethers, fluoroelastomers, unsaturated polyesters, vinyl esters, flexible epoxy, flexible nylon, silicone elastomers, copolymers of ethylene, polyvinyl formal, polyvinyl butryal. Blends of any combination of one or more of the above-mentioned adhesive materials.
- Vibration isolating layer 14 comprises a network of high strength polymeric filaments having a tenacity modulus of at least about 7 grams/denier, a tensile modulus of at least about 160 grams/denier and an energy-in-break of at least about 8 joules/gram.
- the fibers in the vibration isolating layer 14 may be arranged in networks having various configurations. For example, a plurality of filaments can be grouped together to form a twisted or untwisted yarn bundles in various alignment. In preferred embodiments of the invention, the filaments are aligned substantially parallel and unidirectionally to form a uniaxial layer in which a matrix material substantially coats the individual filaments.
- Two or more of these layers can be used to form a layer 14 with multiple layers of coated undirectional filaments in which each layer is rotated with respect to its adjacent layers.
- An example is a with the second, third, fourth and fifth layers rotated +45, -45, 90°and 0 with respect to the first layer, but not necessarily in that order.
- Other examples include a layer 12 with a 0/90 layout of yarn or filaments.
- the type of filaments used in the fabrication of layer 14 may vary widely and can be metallic filaments, semi-metallic filaments, inorganic filaments and/or organic filaments.
- Preferred filaments for use in the practice of this invention are those having a tenacity equal to or greater than about 10 g/d, a tensile modulus equal to or greater than about 150 g/d, and an energy-in-break equal to or greater than about 8 joules/grams.
- Particularly preferred filaments are those having a tenacity equal to or greater than about 20 g/d, a tensile modulus equal to or greater than about 500 g/d and energy-to-break equal to or greater than about 30 joules/grams.
- filaments of choice have a tenacity equal to or greater than about 30 g/d and the energy-to-break is equal to or greater than about 40 joules/gram.
- useful organic filaments are those composed of polyesters, polyolefins, polyetheramides, fluoropolymers, polyethers, celluloses, phenolics, polyesteramides, polyurethanes, epoxies, amimoplastics, silicones, polysulfones, polyetherketones, polyetherether- ketones, polyesterimides, polyphenylene sulfides, polyether acryl ketones, poly(amideimides) , and polyimides.
- aramids aromatic polyamides
- poly(m-xylylene adipamide) poly(p-xylylene sebacamide) , poly 2,2,2-trimethyl- hexamethylene terephthalamide) , poly (piperazine sebacamide) , poly (metaphenylene isophthalamide) (Nomex) and poly (p-phenylene terephthalamide) (Kevlar); .aliphatic and cycloaliphatic polyamides, such as the copolyamide of 30% hexamethylene diammonium isophthalate and 70% hexamethylene diammonium adipate, the copolyamide of up to 30% bis-(-amidocyclohexyl)methylene, terephthalic acid and caprolactam, polyhexamethylene adipamide (nylon 66), poly(butyrolactam) (nylon 4), poly (9-aminonoanoi
- liquid crystalline polymers such as lyrotropic liquid crystalline polymers which include polypeptides such as poly ⁇ -benzyl L-glutamate and the like; aromatic polyamides such as poly(l,4-benzamide) , poly(chloro-l,4- phenylene terephthalamide), poly(l,4-phenylene fumaramide) , poly(chloro-l,4-phenylene fumaramide) , ⁇ oly(4,4'-benzanilide trans, trans- uconamide) , poly(l,4-phenylene mesaconamide) , poly(l,4-phenylene) (trans-l,4-cyclohexylene amide), poly(chloro-l,4- phenylene) (trans-1,4-cyclohexylene amide), poly(l,4- phenylene 1,4-dimethyl-trans-l,4-cyclohexylene amide), poly(l,4- phenylene 1,4-
- 4,4'-terephenylene amide ⁇ oly(l,4- ⁇ henylene 2,6-na ⁇ hthal amide), poly(l,5-naphthylene terephthal amide), poly(3,3'-dimethyl-4,4-biphenylene terephthal amide), poly(3,3'-dimethoxy-4,4'-biphenylene terephthal amide), poly(3,3*-dimethoxy-4,4-biphenylene 4,4'-bibenzo amide) and the like; polyoxamides such as those derived from 2,2'dimethyl-4,4'diamino biphenyl and chloro-l,4-phenylene diamine; polyhydrazides such as poly chloroterephthalic hydrazide, 2,5-pyridine dicarboxylic acid hydrazide) poly(tere ⁇ hthalic hydrazide), poly(terephthalic- chloroterephthalic hydrazide)
- polyisocyanides such as poly( ⁇ -phenyl ethyl isocyanide) , poly(n-octyl isocyanide) and the like
- polyisocyanates such as poly(n-alkyl isocyanates) as for example poly(n-butyl isocyanate) , poly(n-hexyl isocyanate) and the like
- lyrotropic crystalline polymers with heterocylic units such as poly(l,4-phenylene-2,6- benzobisthiazole)(PBT) , ⁇ oly(l,4-phenylene-2,6- benzobisoxazole) (PBO) , poly(l,4-phenylene-l,3,4- oxadiazole) , poly(l,4- ⁇ henylene
- R. and R ? are the same or different and are hydrogen,hydroxy, halogen, alkylcarbonyl, carboxy, alkoxycarbonyl, heterocycle or alkyl or aryl either unsubstituted or substituted with one or more substituents selected from the group consisting of alkoxy, cyano, hydroxy, alkyl and aryl.
- polystyrene polyethylene, polypropylene, poly(l-octadence) , polyisobutylene, poly(l-pentene) , poly(2-methylstyrene) , poly(4-methylstyrene) , poly(l-hexene) , poly(l-pentene) , poly(4-methoxystrene) , poly(5-methyl-l-hexene) , poly(4-methylpentene) , polymers including polystyrene, polyethylene, polypropylene, poly(l-octadence) , polyisobutylene, poly(l-pentene) , poly(2-methylstyrene) , poly(4-methylstyrene) , poly(l-hexene) , poly(l-pentene) , poly(4-methoxystrene) , poly(5-methyl-l-hexene) , poly
- Illustrative of useful inorganic filaments for use in the fabrication of vibration isolating layer 14 are glass fibers such as fibers formed from quartz, magnesia aluminosilicate, non-alkaline aluminoborosilicate, soda borosilicate, soda silicate, soda lime-aluminosilicate, lead silicate, non-alkaline lead boroalumina, non-alkaline barium boroalumina, non-alkaline zinc boroalumina, non-alkaline iron aluminosilicate, cadmium borate, alumina fibers which include "saffil" fiber in eta, delta, and theta phase form, asbestos, boron, silicone carbide, graphite and carbon such as those derived from the carbonization of polyethylene, polyvinylalcohol, saras, polyamide (Nomex) type, nylon, polybenzimidazole, polyoxadiazole, polyphenylene, PPR, petroleum and coal pitches (isotropic),
- vibration isolating layer 14 is fabricated from a filament network, which may include a high molecular weight polyethylene filament, a high molecular weight polypropylene filament, an aramid filament, a high molecular weight polyvinyl alcohol filament, a high molecular weight polyacrylonitrile filament or mixtures thereof.
- Highly oriented polypropylene and polyethylene filaments of molecular weight at least 200,000, preferably at least one million and more preferably at least two million may be used in the fabrication of girdle 14.
- Such high molecular weight polyethylene and polypropylene may be formed into reasonably well oriented filaments by the techniques prescribed in the various references referred to above, and especially by the technique of US Patent Nos.
- polypropylene is a much less crystalline material than polyethylene and contains pendant methyl groups
- tenacity values achievable with polypropylene are generally substantially lower than the corresponding values for polyethylene. Accordingly, a suitable tenacity is at least about 8 grams/denier,with a preferred tenacity being at least about 11 grams/denier.
- the tensile modulus for polypropylene is at least about 160 grams/denier, preferably at least about 200 grams/denier.
- PV-OH filaments having high tensile modulus preferred for use in the fabrication of layer 14 are described in USP 4,440,711 to Y. Kwon, et al., which is hereby incorporated by reference to the extent it is not inconsistent herewith.
- PV-OH filament of molecular weight of at least about 200,000.
- Particularly useful PV-OH filament should have a modulus of at least about 300 g/denier, a tenacity of at least about 7 g/denier (preferably at least about 10 g/denier, more preferably at about 14 g/denier, and most preferably at least about 17 g/denier) , and an energy to break of at least about 8 joules/g.
- P(V-OH) filaments having a weight average molecular weight of at least about 200,000, a tenacity of at least about 10 g/denier, a modulus of at least about 300 g/denier, and an energy to break of about 8 joules/g are more useful in producing a ballistic resistant article.
- P(V-OH) filament having such properties can be produced, for example, by the process disclosed in US Patent No. 4,599,267.
- PAN filament for use in the fabrication of layer 14 are of molecular weight of at least about 4000,000. Particularly useful PAN filament should have a tenacity of at least about 10 g/denier and an energy-to-break of at least about 8 joule/g. PAN filament having a molecular weight of at least about 4000,000, a tenacity of at least about 15 to about 20 g/denier and an energy-to-break of at least about 8 joule/g is most useful in producing ballistics resistant articles; and such filaments are disclosed, for example, in US 4,535,027.
- suitable aramid filaments for use in the fabrication of girdle 14 are those formed principally from aromatic polyamide are described in US Patent No. 3,671,542, which is hereby incorporated by reference.
- Preferred aramid filament will have a tenacity of at least about 20 g/d, a tensile modulus of at least about 400 g/d and an energy-to-break at least about 8 joules/gram, and particularly preferred aramid filaments will have a tenacity of at least about 20 g/d, a modulus of at least about 480 g/d and an energy to break of at least about 20 joules/gram.
- aramid filaments will have a tenacity of at least about 20 g/denier, a modulus of at least about 900 g/denier and an energy-to-break of at least about 30 joules/gram.
- ⁇ oly(phenylenediamine terephalamide) filaments produced commercially by Dupont Corporation under the trade name of Kevlar 29, 49, 129 and 149 and having moderately high moduli and tenacity values are particularly useful in forming ballistic resistant composites.
- poly(metaphenylene isophthalamide) filaments produced commercially by Dupont under the trade name Nomex.
- layer 14 is formed of filaments arranged in a network which can have various configurations.
- a plurality of filaments can be grouped together to form a twisted or untwisted yarn.
- the filaments or yarn may be formed as a feltted, knitted or woven (plain, basket, sating and crow feet weaves, etc.) into a network, or formed into a network by any of a variety- of conventional techniques.
- the filaments are untwisted mono-filament yarn wherein the filaments are parallel, unidirectionally aligned.
- the filaments may also be formed into nonwoven cloth layers be convention techniques.
- vibration isolating layer 14 is composed by one or more layers of continuous fibers embedded in a continuous phase of an elastomeric matrix material which preferably substantially coats each filament contained in the bundle of filaments.
- the manner in which the filaments are dispersed may vary widely.
- the filaments may be aligned in a substantially parallel, unidirectional fashion, or filaments may be aligned in a multidirectional fashion, or with filaments at varying angles with each other.
- filaments in each layer forming layer 12 are aligned in a substantially parallel, unidirectional fashion such as in a prepreg, pultruded sheet and the like.
- the method of surface treatment may be chemical, physical or a combination of chemical and physical actions. Examples of purely chemical treatments are used of SO_ or chlorosulfonic acid. Examples of combined chemical and physical treatments are corona discharge treatment or plasma treatment using one of several commonly available machines.
- the matrix material is a low modulus elastomeric material. A wide variety of elastomeric materials and formulation may be utilized in the preferred embodiments of this invention.
- Suitable elastomeric materials for use in the formation of the- matrix are those which have their structures, properties, and formulation together with cross-linking procedures summarized in the Encyclopedia of Polymer Science, Volume 5 in the section Elastomers-Synthetic (John Wiley & Sons Inc., 1964).
- any of the following elastomeric materials may be employed: polybutadiane, polyisoprene, natural rubber, ethylene-propylene copolymers, ethylene-propylene-dien terpolymers, polysulfide polymers, polyurethane elastomers, chlorosulfonated polyethylene, polychloroprene, plasticized polyvinylchloride using dioctyl phthate or other plasticers well known in the art, butadiene acrylonitrile elastomers, poly(isobutylene-co-isoprene), polyacrylates, polyesters, unsaturated polyesters, vinyl esters, polyethers, fluoroelastomers, silicone elastomers, thermoplastic elastomers, and copolymers of ethylene.
- Particularly useful elastomers are polysulfide polymers, polyurethane elastomers, unsaturated polyesters vinyl esters; and block copolymers of conjugated dienes such as butadiene and isoprene are vinyl aromatic monomers such as styrene, vinyl toluene and t-butyl styrene are preferred conjugated aromatic monomers.
- Block copolymers incorporating polyisoprene may be hydrogenated to produce thermoplastic elastomers having saturated hydrocarbon elastomer segments.
- A is a block from a polyvinyl aromatic monomer
- B is a block from a conjugated dien elastomer.
- Many of these polymers are produced commercially by the Shell Chemical Co. and described in the bulletin "Kraton Thermoplastic Rubber", SC-68-81.
- the elastomeric matrix material consists essentially of at least one of the above-mentioned elastomers.
- the low modulus elastomeric matrixes may also include fillers such as carbon black, glass microballons, and the like up to an amount preferably not to exceed about 250% by volume of the elastomeric material, more preferably not to exceed about 100% by weight and most preferably not to exceed about 50% by volume.
- the matrix material may be extended with oils, may include fire retardants such as halogenated parafins, and vulcanized " by sulfur, peroxide, metal oxide, or radiation cure systems using methods well known to rubber technologists.
- Blends of different elastomeric materials may be blended with one or more thermoplastics. High density, low density, and linear low density polyethylene may be cross-linked to obtain a matrix material of appropriate properties, either alone or as blends.
- the modulus of the elastomeric matrix material should not exceed about 6,000 psi (41,300 kpa), preferably is less than about 5,000 psi (34,500 kpa), more preferably is less than 500 psi (3450 kpa).
- the matrix material is a low modulus
- elastomeric material has a tensile modulus, measured at about 23°C, of less than about 7,000 psi (41,300 kpa).
- the tensile modulus of the elastomeric material is less than about 5,000 psi (34,500 kpa), more preferably, is less than 1,000 psi (6900 kpa) and most preferably is less than about 500 psi (3,450 kpa) to provide even more improved performance.
- the glass transition temperature (tg) of the elastomeric material (as evidenced by a sudden drop in the ductility and elasticity of the material) is less than about 0°C.
- the Tg of the elastomeric material is less than about -40° C, and more preferably is less than about -50 °C.
- the elastomeric material also has an elongation to break of at least about 50% Preferably, the elongation to break of the elastomeric material is at least about 300%
- the proportions of matrix to filament in layer 14 may vary widely depending on a number of factors including, whether the matrix material has any ballistic-resistant properties of its own (which is generally not the case) and upon the rigidity, shape, heat resistance, wear resistance, flammability resistance and other properties desired for layer 14. In general, the proportion of matrix to filament in layer 14 may vary from relatively small amounts where the amount of matrix is about 10% by volume of the filaments to relatively large amount where the amount of matrix is up to about 90% by volume of the filaments. In the preferred embodiments of this invention, matrix amounts of from about 15 to about 80% by volume are employed.
- girdle 14 contains a relatively minor proportion of the matrix (e.g., about 10 to about 30% by volume of composite) , since the ballistic-resistant properties are almost entirely attributable to the filaments, and in the particularly preferred embodiments of the invention, the proportion of the matrix in layer 14 is from about 10 to about 30% by weight of filaments.
- Vibration isolating layer 14 can be fabricated using conventional procedures.
- vibration isolation layer 14 is a woven fabric
- vibration isolating layer 14 can be fabricated using conventional fabric weaving techniques of the type commonly employed for ballistic purposes such as a plain weave or a Panama weave.
- vibration isolating layer 14 is formed by continuing the combination of fibers and matrix material in the desired configurations and amounts, and then subjecting the combination to heat and pressure.
- molding temperatures range from about 20 to about 150 C,
- the pressure may range from about 10 psi (69 kpa to about 10,000 psi (69,000 kpa).
- a pressure between about 10 psi (69 kpa) and about 100 psi (690 kpa), when combined with temperatures below about 100 C for a period of time less than about 1.0 min. may be used simply to cause adjacent filaments to stick together.
- the upper limitation of the temperature range would be about 10 to about 20°C higher than for ECPE filament.
- the filaments are pre-coated with the desired matrix material prior to being arranged in a network and molded into layer 14 as described above.
- the coating may be applied to the filaments in a variety of ways and any method known to those of skill in the art for coating filaments may be used.
- one method is to apply the matrix material to the stretched high modulus filaments either as a liquid, a sticky solid or particles in suspension, or as fluidized bed.
- the matrix material may be applied as a solution or emulsion in a suitable solvent which does not adversely affect the properties of the filament at the temperature of application.
- any liquid may be used.
- preferred groups of solvents include water, paraffin oils, ketones, alcohols, aromatic solvents or hydrocarbon solvents or mixtures thereof, with illustrative specific solvents including paraffin oil, xylene, toluene and octane.
- the techniques used to dissolve or disperse the matrix in the solvents will be those conventionally used for the coating of similar elastomeric materials on a variety of substrates.
- Other techniques for applying the coating to the filaments may be used, including coating of the high modulus precursor (gel filament) before the high temperature stretching operation, either before or after removal of the solvent from the filament. The filament may then be stretched at elevated temperatures to produce the coated filaments.
- the gel filament may be passed through a solution of the appropriate matrix material, as for example an elastomeric material dissolved in paraffin oil, or an aromatic oraliphatic solvent, under conditions to attain the desired coating. Crystallization of the polymer in the gel filament may or may not have taken place before the filament passes into the cooling solution. Alternatively, the filament may be extruded into a fluidized bed of the appropriate matrix material in powder form.
- the appropriate matrix material as for example an elastomeric material dissolved in paraffin oil, or an aromatic oraliphatic solvent
- the proportion of coating on the coated filaments or fabrics n layer 14 may vary from relatively small amounts of (e.g. 1% by volume of filaments) to relatively large amounts (e.g. 150% by volume of filaments), depending upon whether the coating material has any impact or ballistic-resistant properties of its own (which is generally not the case) and upon the rigidity, shape, heat resistance, wear resistance, flammability resistance and other properties desired for the complex composite article.
- layer 14 containing coated filaments should have a relatively minor proportion of coating (e.g. about 10 to about 30 percent by volume of filaments), since the ballistic-resistant properties of girdle 14 are almost entirely attributable to the filament.
- coated filaments with higher coating contents may be employed.
- the coating constitutes greater than about 60% (by volume of filament)
- the coated filament is consolidated with similar coated filaments to forma fiber layer without the use of additional matrix material.
- the coating may be applied to a precursor material of the final filament.
- the desired and preferred tenacity, modulus and other properties of the filament should be judged by continuing the manipulative process on the filament precursor in a manner corresponding to that employed on the coated filament precursor, hus, for example, if the coating is applied to the xerogel filament described in US Application Serial No. 572,607 of Kavesh et aj.. and the coated xerogel filament is then stretched under defined temperature and stretch ratio conditions, then the filament tenacity and filament modulus values would be measured on uncoated xerogel filament which is similarly stretched.
- each filament be substantially coated with the matrix material for the production of vibration isolating layer 14.
- a filament is substantially coated by using any of the coating processes described above or can be substantially coated by employing any other process capable of producing a filament coated essentially to the same degree as a filament coated by the processes described heretofore (e.g., by employing known high pressure molding techniques) .
- filaments and networks produced therefrom are formed into “simple composites" as the precursor to preparing the complex composite articles of the present invention.
- the term, "simple composite”, as used herein is intended to mean composites made up of one or more layers, each of the layers containing filaments as described above with a single major matrix material, which material may include minor proportions of other materials such as fillers, lubricants or the like as noted heretofore.
- the proportion of elastomeric matrix material to filament is variable for the simple composites, with . matrix material amounts of from about 5% to about 150 vol %, by volume of the filament, representing the broad general range. Within this range, it is preferred to use composites having a relatively high filament content, such as composites having only about 10 to about 50 vol % matrix material, by volume of the composite, and more preferably from about 10 to about 30 vol % matrix material by volume of the composite.
- the filament network occupies different proportions of the total volume of the simple composite.
- the filament network comprises at least about 20 volume percent of the simple composite.
- the filament network comprises at least about 50 volume percent, more preferably about 70 volume percent, and most preferably at least about 95 volume percent, with the matrix occupying the remaining volume.
- a particularly effective technique for preparing a preferred composite of this invention comprised of substantially parallel, undirectionally aligned filaments includes the steps of pulling a filament or bundles of filaments through a bath containing a solution of a matrix material preferably, an elastomeric matrix material, and circumferentially winding this filament into a single sheet-like layer around and along a bundle of filaments the length of a suitable form, such as a cylinder.
- the solvent is- then evaporated leaving a sheet-like layer of filaments embedded in a matrix that can be removed from the cylindrical form.
- a plurality of filaments or bundles of filaments can be simultaneously pulled through the bath containing a solution or dispersion of a matrix material and laid down in closely positioned, substantially parallel relation to one another on a suitable surface. Evaporation of the solvent leaves a sheet-like layer comprised of filaments which are coated with the matrix material and which are substantially parallel and aligned along a common filament direction.
- the sheet is suitable for subsequent processing such as laminating to another sheet to form composites containing more than one layer.
- a yarn-type simple composite can be produced by pulling a group of filament bundles through a dispersion or solution of the matrix material to substantially coat each of the individual filaments, and then evaporating the solvent to form the coated yarn.
- the yarn can then, for example, be employed to form fabrics, which in turn, can be used to form more complex composite structures.
- the coated yarn can also be processed into a simple composite by employing conventional filament winding techniques; for example, the simple composite can have coated yarn formed into overlapping filament layers.
- the number of layers of fibers included in layer 14 may vary widely. In general, the greater the number of layers the greater the degree of ballistic protection provided and conversely, the lesser the number of layers the lesser the degree of ballistic protection provided.
- layer 14 is a laminate in which one or more layers of filaments coated with matrix material (pre-molded if desired) are arranged in a sheet-like array and aligned parallel to one another along a common filament direction. Successive layers of such coated unidirectional filaments can be rotated with respect to the previous layer after which the laminate can be molded under heat and pressure to form the laminate.
- An example of such a layered vibration isolating layer is the layered structure in which the second, third, fourth and fifth layer are rotated 45° , 45° , 90° and 0 ° with respect to the first layer, but not necessarily in that order.
- layered layer 12 is a layered structure in which the various unidirectional layers forming girdle are aligned such that the common filament axis is adjacent layers is 0°, 90°.
- Backing layer 16 is comprised of a rigid ballistic material which may vary widely depending on the uses of article 10, and may offer additional ballistic protection.
- the term "rigid" as used in the present specification and claims is intended to include semi-flexible and semi-rigid structures that are not capable of being free standing, without collapsing.
- the backing material employed may vary widely and may be metallic, semi-metallic material, an organic material and/or an inorganic material.
- Materials useful for fabrication of backing layer 16 include high modulus polymeric materials such as polyamides as for example aramids, nylon-66, nylon-6 and the like; polyesters such as polyethylene terephthalate polybutylene terephthalate, and the like, acetalo; poylsulfones; polyethersulfones; polyacrylates; acrylonitrile/butadiene/styrene copolymers; poly(amide- imide) ; polycarbonates; polyphenylenesulfides; polyurethanes, polyphenyleneoxides; polyester carbonates; polyesterimides; polyimides; polyetheretherketone; epoxy resins; phenolic resins; polysulfides; silicones; polyacrylates; polyacrylics; polydienes; vinyl ester resins; modified phenolic resins; unsaturated polyester; allylic resins; alky
- vibration isolating layer 14 may be reinforced by high strength filaments described above for use in the fabrication of vibration isolating layer 14, such as aramid filaments,
- Useful backing materials also include metals such as nickel, manganese, tungsten, magnesium, titanium, aluminum and steel plate.
- useful steels are carbon steels which include mild steels of grades AISI 1005 to AISI 1030, medium-carbon steels of grades AISI 1030 to AISI 1055, high-carbon steels of the grades AISI 1060 to AISI 1095, free-machining steels, low-temperature carbon steels, rail steel, and superplastic steels; high-speed steels such as tungsten steels, molybdenum steels, chromium steels, vanadium steels, and cobalt steels; hot-die steels; low-alloy steels; low-expansion alloys; mold-steel; nitriding steels for example those composed of low-and medium-carbon steels in combination with chromium and aluminum,
- Useful materials also include alloys such as manganese alloys, such as manganese aluminum alloy, manganese bronze alloy; nickel alloys such as, nickel bronze, nickel cast iron alloy, nickel-chromium alloys, nickel-chromium steel alloys, nickel copper alloys, nickel-molydenu iron alloys, nickel-molybdenum steel alloys, nickel-silver alloys, nickel-steel alloys; iron-chromium-molybdenum-cobalt steel alloys; magnesium alloys; aluminum alloys such as those of aluminum alloy 1000 series of commercially pure aluminum, aluminum-manganese alloys of aluminum alloy 300 series, aluminum-magnesium-manganese alloys, aluminum- magnesium alloys, aluminum-copper alloys, aluminum-silicon- magnesium alloys of 6000 series, aluminum-copper-chromium of 7000 series, aluminum casting alloys; aluminum brass alloys and aluminum bronze alloys.
- nickel alloys such as, nickel bronze, nickel cast iron alloy, nickel-chromium alloys, nickel-chromium
- backing layer 16 materials useful in the fabrication of backing layer 16 are the fiber composites used in the fabrication of vibration isolating layer 14 which comprises fibrous network in a rigid matrix. Yet, other materials useful in the fabrication of backing layer 16 are non-shattering glass such as bulletproof glass.
- FIG 2 depicts an armor plate composite 20 which differs from the armor plate 10 of FIG 1 as far as the construction of the vibration isolating layer 14 is concerned, corresponding parts being referred to by like numerals.
- vibration isolating layer 14 is composed of three superimposed constituent layers 22, 24 and 26.
- Layers 22 and 26 are thin layers of a metal or non-metal rigid material such as those materials used in the fabrication of backing layer 16 (preferably a glass- filled epoxy resin), and layer 30 is a network of polymeric fibers in a matrix such as those materials discussed herein above for use in the fabrication of vibration isolating layer 14 and is preferably extended chain polyethylene fibers in a matrix.
- Rigid layers 26 and 30 function: to improve the overall performance of vibration isolating layer 14; to improve the surface characteristics of vibration isolation layer 14; to provide a surface on which ceramic bodies 12 can be attached; and to retain dimensional stability (i.e. flatness and straightness) of the surface of vibration isolating layer 14 subject to severe impact deformation.
- constituent layers 22, 24 and 26 are bonded together with a suitable agent such as an adhesive described above for attachment of ceramic bodies
- FIG 3 shows a variant of the embodiment of FIG 2, which is indicated at 32.
- ceramic impact layer 10 is covered with cover layer 34 which functions as ah anti-spall layer to retain spall or particles resulting from the shattering of ceramic bodies 18 by the striking projectile, and which functions to maintain ceramic bodies 18 which are not hit by the projectile in position;
- cover layer 34 which functions as ah anti-spall layer to retain spall or particles resulting from the shattering of ceramic bodies 18 by the striking projectile, and which functions to maintain ceramic bodies 18 which are not hit by the projectile in position;
- cover layer 34 consists of top cover 40 and release layer 38.
- Top cover 36 is formed from a rigid material as for example the metals and non-metals described above for use in the fabrication of backing layer 16 and is preferably composed of a metal such as steel, titanium and aluminum alloys, or of a rigid high strength polymeric composite such as a thermoplastic resin such as a polyurethane, polyester or polyamide, a thermosetting resin such as epoxy, phenolic or vinylester resin or a mixture thereof reinforced with polymeric filaments such as aramid or extended chain polyethylene or inorganic filaments such as S-glass fibers, silicon carbide fibers, E-glass fibers, carbon fibers, boron fibers and the like.
- a metal such as steel, titanium and aluminum alloys
- a rigid high strength polymeric composite such as a thermoplastic resin such as a polyurethane, polyester or polyamide, a thermosetting resin such as epoxy, phenolic or vinylester resin or a mixture thereof reinforced with polymeric filaments such as aramid or
- Release layer 38 is formed from materials similar to those used to form vibration isolating layer 14 and functions to eliminate or to substantially reduce the strain on unhit ceramic bodies 18 in the deformation of the composites from impact by the projectile.
- the construction of vibration isolating layer 14 and backing layer 6 in composite 32 and their materials of construction are the same as in composite 20 of FIG 2.
- FIG 4 depicts composite 40, which is a variation of the embodiment of FIG 2.
- Composite 40 includes ceramic body retaining means 42 between individual ceramic bodies
- Ceramic body retaining means 42 reduces the differences in performance of segmented ceramic impact layer 12 at the seams formed by adjacent ceramic bodies 18 which is usually a weak area, and at the center of ceramic body 18 which is usually a strong area. Ceramic body retaining means 42 also allows maximum loading of ceramic bodies 18 in segmented ceramic impact layer 12, provides optimized spacing between adjacent ceramic bodies 18 retains unhit ceramic bodies 18 in place upon severe impact deformation, and transmitts and distributes the impact shock to the entire composite 40 upon impact.
- Peripheral impact layer retaining means 44 minimizes the differences in the performance at the edges of the composite armor (which because of the segmented nature of the ceramic impact layer 14 tends to be a relatively weak area) and at the center of the ceramic which tends to be a relatively strong area.
- Ceramic body retaining means 42 and peripheral impact layer retaining means 44 are composed of an "elastic" material which may vary widely and be metallic, semi- metallic material, an organic material and/or an inorganic material.
- the term "elastic" as used in the present specification and claims is intended to include materials inherently capable of free standing without collapsing. Illustrative of such materials are those described in G.S. Brady and H.R. Clauser, Materials Handbook. 12th Edition (1986).
- illustrative useful materials suitable for use in the fabrication of ceramic body retaining means 42 and peripheral impact layer retaining means 44 are those materials described herein abovefor use in the fabricaton of the backing layer 16 and cover layer 34. These materials include in the embodiments of FIGs. 1, 2 and 3 high modulus polymeric materials with or without fibrous fillers such as a thermosetting or thermoplastic resin such as a polycarbonate or epoxy which is optionally reinforced by high strength filaments such as aramid filament.
- vibration isolating layer 14 and backing layer 16 in composite 40 and their mateials of construction are the same as in composite 20 of FIG 2.
- Complex ballistic articles of this invention have many uses. For example, such composites may be incorporated into more complex composites to provide a rigid complex composite article suitable, for example, as structural ballistic-resistant components, such as helmets, structural members of aircraft, and vehicle panels.
- a panel consisting of a 4 by 24 checker board with square cells of dimensions of 4" (10.2cm) by 4" (10.2cm) by 1/2" (1.3 cm) depth was constructed.
- the cells of panel were filled with marble tiles.
- the panel was
- Example 1 constructed on a Spectra composite of Example 1.
- the checker board was placed into a 16" (40.6 cm) by 16" (40.6 cm) by 1/2" (1.3 cm) aluminum frame, and was covered with a piece of 1/8" (0.32 cm) thick polycarbonate.
- the whole unit was mounted on a 1/4" (0.64 cm) thick steel plate (AR 400 sold by Ryerson Aluminum and Steel Company) , and the entire arrangement was consolidated into a single unit with the thermosetting vinyl ester resin mixture used in Example 1.
- a panel was constructed using the same procedure described in Example 2 with the exception that the
- a panel was constructed using the same procedure described in Example 2 except that a known vibration and shock isolation material - felt replaced the Spectra ® composite sandwich.
- the felt used was a 1/8" (0.32 cm) think 100% dense wool pad (sold by McMaster-Carr under the trade name of 8757K1 with a weight of 1.53 lbs/sq.yd).
- Example 2 The sample was tested under the same conditions described in Example 2. After the first shot at the center of tile, 2 out of 9 meighboring tiles at the point of impact remained undamaged. Thus, the efficiency was 22%. After 5 hits, 5 tiles were retained but they were slightly cracked. Therefore, the efficiency was 0% after 5 hits. The other tiles were a]l shattered. The piece of felt used was torn into pieces after 5 shots.
- a panel was constructed using the same procedure as Example 2 except that a 1/8" (0.32 cm) thick glass reinforced epoxy composite (GRP) replaced the Spectra® composite.
- GRP glass reinforced epoxy composite
- This GRP is sold by Ryerson Plastics under the trade name Ryertex G-10 PHPP4008.
- the sample was tested under the same conditions as described in Example 2. After the first shot at the center of tile, 1 out of 9 neighboring tiles at the point of impact remained undamaged. Thus the efficiency was 10%. After 5 hits, 2 tiles were retained but were damaged. The remaining tiles were shattered. Therefore, the efficiency was 0% after 5 hits. The GRP was badly damaged after 5 shots.
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Abstract
Un blindage (40) à couches multiples comprend une couche d'impact (12) en un matériau céramique dur, une couche (14) d'amortissement des vibrations adjacente à ladite couche dure d'impact (12), en contact avec celle-ci, et une couche de support (16) fixée à la face de la couche (14) d'amortissement des vibrations opposée à la face de celle-ci fixée à la couche dure d'impact (12).A multi-layer shield (40) includes an impact layer (12) of hard ceramic material, a vibration damping layer (14) adjacent to said hard impact layer (12) in contact therewith. ci, and a support layer (16) fixed to the face of the vibration damping layer (14) opposite to the face thereof fixed to the hard impact layer (12).
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US43586389A | 1989-11-13 | 1989-11-13 | |
US435863 | 1989-11-13 |
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EP0493532A1 true EP0493532A1 (en) | 1992-07-08 |
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EP19900917256 Ceased EP0493532A1 (en) | 1989-11-13 | 1990-11-07 | Ballistic resistant composite armor having improved multiple-hit capability |
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EP (1) | EP0493532A1 (en) |
JP (1) | JPH05501604A (en) |
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JPH06503159A (en) * | 1990-11-21 | 1994-04-07 | アライド−シグナル・インコーポレーテッド | Bulletproof composite materials for armor |
DE4310737A1 (en) * | 1993-04-01 | 1994-10-06 | Deutsch Franz Forsch Inst | Armour |
GB9307233D0 (en) * | 1993-04-07 | 1993-06-02 | Courtaulds Aerospace Ltd | Ceramic ballistic amour |
IL124543A (en) * | 1998-05-19 | 2001-08-26 | Cohen Michael | Composite armor panel |
AU6173698A (en) * | 1997-02-19 | 1998-09-09 | Franklin C. Moore | Composite armor for a vehicle and method for manufacturing such an armour |
AU1273899A (en) * | 1997-10-24 | 1999-05-17 | Lanxide Technology Company, Lp | Armor material and methods of making same |
US6609452B1 (en) | 2000-01-11 | 2003-08-26 | M Cubed Technologies, Inc. | Silicon carbide armor bodies, and methods for making same |
CA2483231C (en) | 2004-09-30 | 2011-11-29 | Aceram Technologies Inc. | Ceramic armor system with diamond coating |
EP2095055B1 (en) | 2006-12-04 | 2017-04-19 | Battelle Memorial Institute | Composite armor and method for making composite armor |
RU2560444C2 (en) * | 2013-05-31 | 2015-08-20 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом"-Госкорпорация "Росатом" | Heat protective armour layered system |
DE102017116319A1 (en) * | 2017-07-19 | 2019-01-24 | Kennametal Inc. | Armor plate and armor consisting of carrier and armor plate |
CN109584738B (en) * | 2019-01-15 | 2024-02-23 | 东莞市和镁五金有限公司 | Preparation method of LED display screen mask |
DE102019116153A1 (en) | 2019-06-13 | 2020-12-17 | Kennametal Inc. | Armor plate, armor plate composite and armor |
DE102022100599A1 (en) | 2022-01-12 | 2023-08-03 | Kennametal Inc. | Armor Plate, Armor Plate Composite, and Armor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4623574A (en) * | 1985-01-14 | 1986-11-18 | Allied Corporation | Ballistic-resistant composite article |
US4737402A (en) * | 1985-02-28 | 1988-04-12 | Allied Corporation | Complex composite article having improved impact resistance |
NL8600449A (en) * | 1986-02-22 | 1987-09-16 | Delft Tech Hogeschool | ARMOR PLATE-COMPOSITE WITH CERAMIC COLLECTION COAT. |
IT1222926B (en) * | 1987-10-16 | 1990-09-12 | Lasar Spa | SEMI-RIGID LAYERED SCREEN |
US4868040A (en) * | 1988-10-20 | 1989-09-19 | Canadian Patents & Development Limited | Antiballistic composite armor |
-
1990
- 1990-11-07 WO PCT/US1990/006455 patent/WO1991007633A1/en not_active Application Discontinuation
- 1990-11-07 CA CA 2072748 patent/CA2072748A1/en not_active Abandoned
- 1990-11-07 EP EP19900917256 patent/EP0493532A1/en not_active Ceased
- 1990-11-07 JP JP3500512A patent/JPH05501604A/en not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO9107633A1 * |
Also Published As
Publication number | Publication date |
---|---|
JPH05501604A (en) | 1993-03-25 |
CA2072748A1 (en) | 1991-05-14 |
WO1991007633A1 (en) | 1991-05-30 |
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