EP0478962B1 - Assemblage de conducteurs à bande pour micro-ondes - Google Patents

Assemblage de conducteurs à bande pour micro-ondes Download PDF

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Publication number
EP0478962B1
EP0478962B1 EP91114671A EP91114671A EP0478962B1 EP 0478962 B1 EP0478962 B1 EP 0478962B1 EP 91114671 A EP91114671 A EP 91114671A EP 91114671 A EP91114671 A EP 91114671A EP 0478962 B1 EP0478962 B1 EP 0478962B1
Authority
EP
European Patent Office
Prior art keywords
arrangement
microstrip
supports
arrangement according
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91114671A
Other languages
German (de)
English (en)
Other versions
EP0478962A2 (fr
EP0478962A3 (en
Inventor
Waldemar Dipl.-Ing. Szpilok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohde and Schwarz GmbH and Co KG
Original Assignee
Rohde and Schwarz GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohde and Schwarz GmbH and Co KG filed Critical Rohde and Schwarz GmbH and Co KG
Publication of EP0478962A2 publication Critical patent/EP0478962A2/fr
Publication of EP0478962A3 publication Critical patent/EP0478962A3/de
Application granted granted Critical
Publication of EP0478962B1 publication Critical patent/EP0478962B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/2039—Galvanic coupling between Input/Output
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors

Definitions

  • the invention relates to a microwave stripline arrangement (triplate line) according to the preamble of the main claim.
  • triplate line technology it is known to either embed the microstrips between the circuit boards in a dielectric (Hoffmann: Integrated microwave circuits, 1983, Figure 1.42. B)) or to hold them self-supporting between the circuit boards by means of dielectric supports (Meinke-Grundlach, paperback der Hochfrequenztechnik, 1968, p. 263, Fig. 11.5.c; Microwave Stripline Circuits, SCP and Solid State Technology, June 1966, page 26, Fig. 2, e) or European Patent 0 055 642 and EP-A-0 373 053).
  • a microwave stripline arrangement according to the invention is extremely low-loss, the effective dielectric constant, in contrast to the known triplate or suspended substrate striplines, is not frequency-dependent. Nevertheless, the microwave stripline arrangement according to the invention can be produced very precisely and very precisely in the course of automated printed circuit board production.
  • the carrier plate made of insulating material in addition to the actual microstrip arrangement, other auxiliary circuits can also be built up in conventional printed circuit technology, which can also be automatically fitted in the usual way, and additional shielding walls for such auxiliary circuits can be installed on the carrier plate between the printed circuit boards.
  • the holding sections connected to the laterally projecting narrow insulating webs, on which the conductive supports which are galvanically connected to the printed circuit boards engage, can additionally be used as electrical shielding between individual sections of the microwave circuit.
  • FIG. 1 shows the top view of a microwave stripline arrangement according to the invention which, according to the sectional view according to FIG. 2, is formed by a stripline arrangement 3 arranged between two printed circuit boards 1 and 2.
  • the microwave stripline arrangement is designed as a high-frequency filter for high powers in the MHz range, as is used, for example, in VHF / UHF transmission systems.
  • the stripline arrangement 3 consists of individual stripline sections 4, which interact with additional line components such as narrow inductors 5, large-area capacitor plates 6 or couplers 7.
  • Both the strip conductors and these additional line components are formed in conventional printed circuit board manufacturing technology from a carrier plate made of insulating material, that is to say from a carrier plate made of epoxy resin, polyimide, Teflon, glass fiber reinforced plastic, or also from an insulating material, such as is used in thin-film Circuit technology is common, the desired shape of the conductor strips 4 and the additional line components 5, 6 and 7 is milled out by milling.
  • narrow webs 8 projecting laterally in the plane of the carrier plate are milled out of the carrier plate, which at one end merge into the strip conductor 4 or the components 5 to 7 and which at the outer end pass into a holding section 9, which is milled out of the carrier plate in the same way and in which a mounting hole 10 is drilled.
  • the entire microwave circuit is coated with a metal layer using known electroplating technology, only partial sections 11 of the webs 8 remaining free. It is sufficient, in the sense of the sectional view according to FIG.
  • a metal coating 13 or 14 only on the top and bottom of the core 12 made of insulating material, but preferably the entire core 12 is coated on all sides, that is to say also on the side surfaces, with a metal layer . It must be ensured that the electrical field running between the printed circuit boards 1 and 2 does not run through the insulating material core 12, if possible, but rather this insulating material core is shielded by a metal coating, so that the dielectric losses remain as low as possible. It is also conceivable to provide a metal coating only on the top and one side surface that meets this requirement.
  • the holding sections 9 and the boreholes 10 are also preferably metallized.
  • the microwave circuit so inexpensively produced in conventional printed circuit board manufacturing technology is then installed via supports 15 between the printed circuit boards 1, 2, the supports 15 are preferably made of metal, in the exemplary embodiment shown they are via knob sections 16 from both sides in the fastening bores 10 and in corresponding ones Fit holes in the circuit boards 1, 2 used, the two circuit boards 1, 2 are clamped together by screws, not shown.
  • the entire microwave circuit is therefore only over a plurality of narrow insulating material webs distributed over the circuit 11 mechanically supported on the supports 15, the narrow webs 11 are extremely low-loss and the entire circuit is therefore particularly suitable for high outputs.
  • the holding sections 9 can also serve as a shield between adjacent circuit sections, as is shown by the elongated and parallel to one of the strip conductors 4 holding section 17, which is held over two supports between the circuit boards 1, 2, and which together with the conductive Supports 15 acts as a shield between two opposite strip lines.
  • the microwave circuit provided for high power can also be combined directly with auxiliary electrical circuits, i.e. on the same carrier plate made of insulating material, from which the strip conductors and line components are formed by milling, an electrical auxiliary circuit 18 can be constructed using conventional printed circuit technology, in the same operation as the microwave circuit.
  • this auxiliary circuit 18 is connected to the rest of the microwave circuit via a line coupler 7, which is again constructed using stripline technology according to the invention.
  • This auxiliary circuit 18 can be shielded from the rest of the microwave circuit in a known shielding technique by a shield frame and optionally by an additional shield cover.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Non-Reversible Transmitting Devices (AREA)

Claims (9)

  1. Assemblage de conducteurs à bande pour micro-ondes (Triplate-Leitung) constitué par deux cartes de circuit imprimé parallèles (1, 2) et un assemblage de micro-bandes (3, 4, 5, 6, 7) parallèle à ces cartes et disposé entre elles, qui est fixé au moyen d'appuis (15) entre les cartes de circuit imprimé (1, 2), caractérisé en ce que l'assemblage de micro-bandes (3, 4, 5, 6, 7) est constitué par un noyau (12) en matière isolante, qui est usiné à partir d'une plaque de support en matière isolante et qui est revêtu sur au moins deux côtés d'une couche métallique (13, 14), et cet assemblage de micro-bandes (3, 4, 5, 6, 7) comporte d'étroites barrettes isolantes (8, 11) s'écartant latéralement dans le plan de l'assemblage de micro-bandes, et qui sont également usinées à partir de la plaque de support et sur lesquelles viennent en prise les appuis (15).
  2. Assemblage selon la revendication 1, caractérisé en ce que les étroites arêtes (8,11) s'écartant latéralement se transforment en tronçons de maintien (9,17) formés également en matière isolante à partir de la plaque de support et qui à leur tour sont revêtues au moins sur deux côtés d'une couche métallique et contre lesquelles viennent en prise les appuis (15).
  3. Assemblage selon la revendication 2, caractérisé en ce que les tronçons de maintien revêtent la forme de bandes (17) disposées parallèlement à une certaine distance d'au moins un des conducteurs en bandes (4) de l'assemblage de micro-bandes (3).
  4. Assemblage selon une des précédentes revendications, caractérisé en ce que les appuis (15) sont constitués d'une matière conductrice et sont reliés galvaniquement à la couche métallique des tronçons de maintien (9, 10) et avec les cartes de circuit imprimé (1, 2).
  5. Assemblage selon une des précédentes revendications, caractérisé en ce que dans les tronçons de maintien (9, 17) sont pratiqués des trous de fixation (10), dans lesquels sont mis en place les appuis (15) disposés entre les cartes de circuit imprimé (1, 2).
  6. Assemblage selon une ou plusieurs des revendications précédentes, caractérisé en ce que l'assemblage de micro-bandes (3) est constitué par des conducteurs micro-bandes (4) et des éléments constitutifs de conduction (inductance 5, capacité 6 ou coupleur 7) et qu'ainsi ces conducteurs micro-bandes (4) comme également les éléments constitutifs ce conduction (5, 6, 7) sont usinés à partir de la plaque de support en matière isolante et sont revêtus au moins sur deux côtés d'une couche métallique (13, 14).
  7. Assemblage selon une des précédentes revendications, caractérisé en ce que le noyau en matière isolante (12) des conducteurs en bande (4) et/ou des éléments constitutifs de conduction (5, 6, 7) est revêtu de tous côtés d'une couche métallique.
  8. Assemblage selon une ou plusieurs des revendications précédentes, caractérisé en ce que sur une partie de la plaque de support en matière isolante, à partir de laquelle sont usinés l'assemblage de micro-bandes (3, 4, 5, 6, 7) et les barrettes isolantes (8, 11), un circuit auxiliaire supplémentaire (18) est réalisé selon la technique connue des circuits imprimés.
  9. Procédé pour fabriquer un assemblage de conducteurs en bande pour micro-ondes selon une ou plusieurs des précédentes revendications, procédé caractérisé en ce qu'à partir d'une plaque de support en matière isolante telle que celle utilisée pour des circuits imprimés, l'assemblage de micro-bandes est réalisé selon la forme désirée avec ses barrettes isolantes s'écartant latéralement selon la technique connue de fabrication des cartes de circuit imprimé par forage, fraisage et galvanisation, et est ensuite disposé au moyen d'appuis, qui viennent en prise contre les tronçons de maintien des barrettes isolantes de l-sssemblage de micro-bandes, sont disposé entre deux cartes de circuit imprimé.
EP91114671A 1990-10-05 1991-08-30 Assemblage de conducteurs à bande pour micro-ondes Expired - Lifetime EP0478962B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4031536 1990-10-05
DE4031536A DE4031536A1 (de) 1990-10-05 1990-10-05 Mikrowellenschaltung

Publications (3)

Publication Number Publication Date
EP0478962A2 EP0478962A2 (fr) 1992-04-08
EP0478962A3 EP0478962A3 (en) 1993-04-21
EP0478962B1 true EP0478962B1 (fr) 1994-10-26

Family

ID=6415644

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91114671A Expired - Lifetime EP0478962B1 (fr) 1990-10-05 1991-08-30 Assemblage de conducteurs à bande pour micro-ondes

Country Status (3)

Country Link
EP (1) EP0478962B1 (fr)
DE (2) DE4031536A1 (fr)
ES (1) ES2063423T3 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59505908D1 (de) * 1994-12-22 1999-06-17 Siemens Matsushita Components Streifenleitungsfilter
DE20117856U1 (de) * 2001-11-02 2003-03-13 Weidmüller Interface GmbH & Co., 32760 Detmold Modulares Steckverbindersystem

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496996A1 (fr) * 1980-12-18 1982-06-25 Thomson Csf Ligne de transmission hyperfrequence, du type triplaque a air et ses utilisations
FR2640084A1 (fr) * 1988-12-06 1990-06-08 Thomson Csf Piece de maintien mecanique pour ligne de transmission hyperfrequence, notamment du type triplaque

Also Published As

Publication number Publication date
ES2063423T3 (es) 1995-01-01
DE59103343D1 (de) 1994-12-01
DE4031536C2 (fr) 1992-09-17
EP0478962A2 (fr) 1992-04-08
EP0478962A3 (en) 1993-04-21
DE4031536A1 (de) 1992-04-16

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