EP0476577A3 - Parts supply device, parts supply method, parts managing system, and parts managing apparatus - Google Patents

Parts supply device, parts supply method, parts managing system, and parts managing apparatus Download PDF

Info

Publication number
EP0476577A3
EP0476577A3 EP19910115732 EP91115732A EP0476577A3 EP 0476577 A3 EP0476577 A3 EP 0476577A3 EP 19910115732 EP19910115732 EP 19910115732 EP 91115732 A EP91115732 A EP 91115732A EP 0476577 A3 EP0476577 A3 EP 0476577A3
Authority
EP
European Patent Office
Prior art keywords
parts
managing
supply device
parts supply
supply method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19910115732
Other versions
EP0476577A2 (en
EP0476577B1 (en
Inventor
Takashi Noyama
Yoshifumi Nakao
Masanori Yasutake
Satoshi Tanaka
Shinji Morimoto
Noriaki Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2250908A external-priority patent/JPH0793514B2/en
Priority claimed from JP29233790A external-priority patent/JPH07101793B2/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP0476577A2 publication Critical patent/EP0476577A2/en
Publication of EP0476577A3 publication Critical patent/EP0476577A3/en
Application granted granted Critical
Publication of EP0476577B1 publication Critical patent/EP0476577B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
EP91115732A 1990-09-19 1991-09-17 Parts supply device, parts supply method and parts managing apparatus Expired - Lifetime EP0476577B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2250908A JPH0793514B2 (en) 1990-09-19 1990-09-19 Parts feeder
JP250908/90 1990-09-19
JP292337/90 1990-10-29
JP29233790A JPH07101793B2 (en) 1990-10-29 1990-10-29 Supply parts management device

Publications (3)

Publication Number Publication Date
EP0476577A2 EP0476577A2 (en) 1992-03-25
EP0476577A3 true EP0476577A3 (en) 1993-03-10
EP0476577B1 EP0476577B1 (en) 1997-02-05

Family

ID=26539981

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91115732A Expired - Lifetime EP0476577B1 (en) 1990-09-19 1991-09-17 Parts supply device, parts supply method and parts managing apparatus

Country Status (3)

Country Link
US (1) US5235164A (en)
EP (1) EP0476577B1 (en)
DE (1) DE69124558T2 (en)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
US5877962A (en) * 1993-10-25 1999-03-02 Radcliffe; Frederick W. Cart
GB2284368B (en) * 1993-12-02 1996-01-03 Calmwaters Limited A circuit board production process
JP3552810B2 (en) * 1995-09-27 2004-08-11 松下電器産業株式会社 Method and device for batch replacement of parts in the parts supply section
DE69806123T2 (en) * 1997-01-16 2003-02-13 Matsushita Electric Ind Co Ltd METHOD FOR FEEDING COMPONENTS, METHOD FOR SHAPING COMPONENT ASSEMBLY DATA, AND THE ASSEMBLY DEVICE USING THIS METHOD FOR ELECTRONIC COMPONENTS
JP3749585B2 (en) * 1997-01-17 2006-03-01 松下電器産業株式会社 Parts taping method and apparatus
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
EP0901155B1 (en) * 1997-09-05 2004-08-18 ESEC Trading SA Semiconductor mounting assembly for applying an adhesive on a substrate
US6027019A (en) 1997-09-10 2000-02-22 Kou; Yuen-Foo Michael Component feeder configuration monitoring
JPH11134614A (en) 1997-10-28 1999-05-21 Tdk Corp Manufacturing method and manufacturing system for thin film magnetic head
EP0913857B1 (en) 1997-10-30 2004-01-28 ESEC Trading SA Method and device for positioning the bonding head of a machine for the bonding of semiconductor chips as a carrier material
EP0923111B1 (en) 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Semiconductor mounting apparatus with a reciprocating chip gripper
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
US6236901B1 (en) 1998-03-31 2001-05-22 Dell Usa, L.P. Manufacturing system and method for assembly of computer systems in a build-to-order environment
CN1230060C (en) * 1998-09-10 2005-11-30 松下技术有限公司 Method of operating electronic component mounting or insertion machine
CN1217569C (en) * 1998-09-17 2005-08-31 松下电器产业株式会社 Method and apparatus for feeding component and method and apparatus for mounting component
DE19842951C1 (en) * 1998-09-18 2000-06-21 Siemens Nixdorf Inf Syst Automatic placement machine with identification device for component containers
EP1006770A1 (en) * 1998-12-03 2000-06-07 ESEC Management SA Method of mounting components on a work piece, mounting machine, and feeder for a mounting machine
US6629007B1 (en) * 1998-12-25 2003-09-30 Matsushita Electric Industrial Co., Ltd. Apparatus and method for notifying lack of component in advance, component mounting apparatus, and article of manufacture comprising computer usable medium
DE19940584A1 (en) * 1999-08-26 2001-03-22 Siemens Ag Method and system for assembling circuit carriers arranged in an assembly unit
US6729018B1 (en) * 1999-09-03 2004-05-04 Matsushita Electric Industrial Co., Ltd. Apparatus for mounting components
US6332536B2 (en) 1999-11-03 2001-12-25 Solectron Corporation Component tape including a printed component count
US6779726B1 (en) 1999-11-03 2004-08-24 Solectron Corporation Method and apparatus for controlling a production operation using printed information on a component tape
US7149884B2 (en) 2001-01-25 2006-12-12 Dell Products L.P. Method and system for configuring a computer system via a wireless communication link
US6879869B2 (en) 2003-03-28 2005-04-12 Accu-Assembly Incorporated Placement of electronic components
US7290701B2 (en) 2004-08-13 2007-11-06 Accu-Assembly Incorporated Gathering data relating to electrical components picked from stacked trays
US7089074B2 (en) * 2004-11-10 2006-08-08 Universal Instruments Corporation Host feeder setup validation
GB0518696D0 (en) * 2005-09-14 2005-10-19 Henrob Ltd Fastener feed method and apparatus
ATE541441T1 (en) 2005-11-14 2012-01-15 Asm Assembly Sys Gmbh & Co Kg FEEDING DEVICE FOR TRANSPORTING ELECTRICAL COMPONENTS
EP1786253A3 (en) * 2005-11-14 2008-05-14 Siemens Aktiengesellschaft Production method and apparatus for fitting substrates with electrical components
US7440813B2 (en) * 2006-04-20 2008-10-21 Valor Computerized Systems Ltd. System and methods for automatic generation of component data
DE102006022371A1 (en) * 2006-05-12 2007-11-15 Siemens Ag Operation of a manufacturing plant for electronic assemblies
GB0818401D0 (en) 2008-10-08 2008-11-12 Henrob Ltd Fastener feed method and apparatus
EP3557965A1 (en) 2012-03-12 2019-10-23 Mycronic AB Device for automatic storage of electronic components
EP3047715B1 (en) 2013-09-18 2019-03-27 Mycronic AB Method, system and device for identifying a bin in an smt system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4610083A (en) * 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
DE3704414A1 (en) * 1987-02-12 1988-08-25 Siemens Ag Arrangement and method for supplying material completely automatically to automatic fitting machines

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT390423B (en) * 1983-04-21 1990-05-10 Sticht Walter METHOD AND DEVICE FOR PRODUCING WORKPIECES
GB2181276B (en) * 1985-10-04 1990-05-09 Honda Motor Co Ltd Method of and apparatus for installing bearings on engine components
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
US4894908A (en) * 1987-08-20 1990-01-23 Gmf Robotics Corporation Method for automated assembly of assemblies such as automotive assemblies and system utilizing same
US4815190A (en) * 1987-08-20 1989-03-28 Gmf Robotics Corporation Method for automated assembly of assemblies such as automotive assemblies
US5090113A (en) * 1989-04-05 1992-02-25 Canon Kabushiki Kaisha Apparatus for supplying articles
JPH02296400A (en) * 1989-05-11 1990-12-06 Nippondenso Co Ltd Odd shaped component automatic mounting device
JPH03120897A (en) * 1989-10-04 1991-05-23 Matsushita Electric Ind Co Ltd Parts feeder and electronic parts mounting machine using the parts feeder
JP2830920B2 (en) * 1990-03-19 1998-12-02 松下電器産業株式会社 Parts supply method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4610083A (en) * 1985-08-26 1986-09-09 Zenith Electronics Corporation Method and apparatus for electronic component matching
DE3704414A1 (en) * 1987-02-12 1988-08-25 Siemens Ag Arrangement and method for supplying material completely automatically to automatic fitting machines

Also Published As

Publication number Publication date
EP0476577A2 (en) 1992-03-25
DE69124558T2 (en) 1997-05-28
EP0476577B1 (en) 1997-02-05
DE69124558D1 (en) 1997-03-20
US5235164A (en) 1993-08-10

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