EP0461414A3 - Method of cutting interconnection pattern with laser and apparatus thereof - Google Patents

Method of cutting interconnection pattern with laser and apparatus thereof Download PDF

Info

Publication number
EP0461414A3
EP0461414A3 EP19910107938 EP91107938A EP0461414A3 EP 0461414 A3 EP0461414 A3 EP 0461414A3 EP 19910107938 EP19910107938 EP 19910107938 EP 91107938 A EP91107938 A EP 91107938A EP 0461414 A3 EP0461414 A3 EP 0461414A3
Authority
EP
European Patent Office
Prior art keywords
laser
interconnection pattern
cutting
cutting interconnection
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP19910107938
Other versions
EP0461414A2 (en
Inventor
Tateoki Miyauchi
Mikio Hongo
Shigenobu Maruyama
Katsurou Mizukoshi
Hiroshi Yamaguchi
Koyo Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP0461414A2 publication Critical patent/EP0461414A2/en
Publication of EP0461414A3 publication Critical patent/EP0461414A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
EP19910107938 1990-05-18 1991-05-16 Method of cutting interconnection pattern with laser and apparatus thereof Ceased EP0461414A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12669190A JP3150322B2 (en) 1990-05-18 1990-05-18 Wiring cutting method by laser and laser processing device
JP126691/90 1990-05-18

Publications (2)

Publication Number Publication Date
EP0461414A2 EP0461414A2 (en) 1991-12-18
EP0461414A3 true EP0461414A3 (en) 1992-04-01

Family

ID=14941464

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19910107938 Ceased EP0461414A3 (en) 1990-05-18 1991-05-16 Method of cutting interconnection pattern with laser and apparatus thereof

Country Status (4)

Country Link
US (1) US5208437A (en)
EP (1) EP0461414A3 (en)
JP (1) JP3150322B2 (en)
KR (1) KR950001305B1 (en)

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US5300756A (en) * 1991-10-22 1994-04-05 General Scanning, Inc. Method for severing integrated-circuit connection paths by a phase-plate-adjusted laser beam
JP3399590B2 (en) * 1993-08-04 2003-04-21 富士通株式会社 Wiring cutting device
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
JP3179963B2 (en) * 1994-04-26 2001-06-25 松下電器産業株式会社 Laser processing device and laser processing method
US5562842A (en) * 1994-10-17 1996-10-08 Panasonic Technologies, Inc. Material treatment apparatus combining a laser diode and an illumination light with a video imaging system
US5998759A (en) 1996-12-24 1999-12-07 General Scanning, Inc. Laser processing
US6046429A (en) 1997-06-12 2000-04-04 International Business Machines Corporation Laser repair process for printed wiring boards
AUPP290398A0 (en) * 1998-04-09 1998-05-07 Pacific Solar Pty Limited Aluminium film interrupting process
US6544865B1 (en) 1998-04-09 2003-04-08 Pacific Solar Pty. Limited Metal film interrupting process
AU744262C (en) * 1998-04-09 2003-03-06 Csg Solar Ag Metal film interrupting process
US6300590B1 (en) * 1998-12-16 2001-10-09 General Scanning, Inc. Laser processing
JP3648399B2 (en) * 1999-03-18 2005-05-18 株式会社東芝 Semiconductor device
JP2001100145A (en) 1999-09-29 2001-04-13 Sunx Ltd Laser marker
JP4584387B2 (en) 1999-11-19 2010-11-17 シャープ株式会社 Display device and defect repair method thereof
US6281471B1 (en) * 1999-12-28 2001-08-28 Gsi Lumonics, Inc. Energy-efficient, laser-based method and system for processing target material
US7838794B2 (en) 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US7723642B2 (en) * 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US20040134894A1 (en) * 1999-12-28 2004-07-15 Bo Gu Laser-based system for memory link processing with picosecond lasers
US6340806B1 (en) * 1999-12-28 2002-01-22 General Scanning Inc. Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train
KR100850262B1 (en) 2000-01-10 2008-08-04 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 Laser system and method for processing a memory link with a burst of laser pulses having ultrashort pulse widths
US7671295B2 (en) * 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US20060141681A1 (en) * 2000-01-10 2006-06-29 Yunlong Sun Processing a memory link with a set of at least two laser pulses
US20030222324A1 (en) * 2000-01-10 2003-12-04 Yunlong Sun Laser systems for passivation or link processing with a set of laser pulses
US6887804B2 (en) 2000-01-10 2005-05-03 Electro Scientific Industries, Inc. Passivation processing over a memory link
WO2001054853A2 (en) * 2000-01-27 2001-08-02 National Research Council Of Canada Method and apparatus for repair of defects in materials with short laser pulses
US6341009B1 (en) 2000-02-24 2002-01-22 Quantronix Corporation Laser delivery system and method for photolithographic mask repair
US6436093B1 (en) * 2000-06-21 2002-08-20 Luis Antonio Ruiz Controllable liquid crystal matrix mask particularly suited for performing ophthamological surgery, a laser system with said mask and a method of using the same
US6464692B1 (en) * 2000-06-21 2002-10-15 Luis Antonio Ruiz Controllable electro-optical patternable mask, system with said mask and method of using the same
US6841788B1 (en) * 2000-08-03 2005-01-11 Ascend Instruments, Inc. Transmission electron microscope sample preparation
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
US20070173075A1 (en) * 2001-03-29 2007-07-26 Joohan Lee Laser-based method and system for processing a multi-material device having conductive link structures
US6444907B1 (en) * 2001-05-01 2002-09-03 Bridgeport Fittings, Inc. Electrical cable connector
US6825440B2 (en) * 2001-05-15 2004-11-30 Moritax Corporation Laser beam machining method and apparatus
JP2005512814A (en) * 2001-12-17 2005-05-12 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド Processing a memory link with a set of at least two laser pulses
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
JP2003320466A (en) * 2002-05-07 2003-11-11 Disco Abrasive Syst Ltd Processing machine using laser beam
JP2004170930A (en) 2002-10-31 2004-06-17 Olympus Corp Microdissection apparatus and method
US6979798B2 (en) * 2003-03-07 2005-12-27 Gsi Lumonics Corporation Laser system and method for material processing with ultra fast lasers
DE10326505B4 (en) * 2003-06-10 2012-01-19 Solarion Ag Laser scribing of thin-film semiconductor devices
WO2005108376A1 (en) * 2004-05-06 2005-11-17 Smithkline Beecham Corporation Calcilytic compounds
WO2005111728A2 (en) * 2004-05-10 2005-11-24 Matsushita Electric Industrial Co., Ltd. Composite sheet material selection method for use in ultra-fast laser patterning
US7935941B2 (en) * 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US8148211B2 (en) * 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US7425471B2 (en) * 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US8383982B2 (en) * 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20060191884A1 (en) * 2005-01-21 2006-08-31 Johnson Shepard D High-speed, precise, laser-based material processing method and system
US8290239B2 (en) * 2005-10-21 2012-10-16 Orbotech Ltd. Automatic repair of electric circuits
US8198566B2 (en) * 2006-05-24 2012-06-12 Electro Scientific Industries, Inc. Laser processing of workpieces containing low-k dielectric material
US7605343B2 (en) * 2006-05-24 2009-10-20 Electro Scientific Industries, Inc. Micromachining with short-pulsed, solid-state UV laser
US8084706B2 (en) * 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
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Also Published As

Publication number Publication date
JP3150322B2 (en) 2001-03-26
KR910020870A (en) 1991-12-20
US5208437A (en) 1993-05-04
JPH0423453A (en) 1992-01-27
EP0461414A2 (en) 1991-12-18
KR950001305B1 (en) 1995-02-15

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