EP0342688A3 - Attache pour serrage de plaquettes pour réacteur à plasma - Google Patents

Attache pour serrage de plaquettes pour réacteur à plasma Download PDF

Info

Publication number
EP0342688A3
EP0342688A3 EP19890109026 EP89109026A EP0342688A3 EP 0342688 A3 EP0342688 A3 EP 0342688A3 EP 19890109026 EP19890109026 EP 19890109026 EP 89109026 A EP89109026 A EP 89109026A EP 0342688 A3 EP0342688 A3 EP 0342688A3
Authority
EP
European Patent Office
Prior art keywords
plasma reactor
wafer clamp
wafer
clamp
reactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19890109026
Other languages
German (de)
English (en)
Other versions
EP0342688A2 (fr
Inventor
Roger Bennett Lachenbruch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CollabRx Inc
Original Assignee
CollabRx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CollabRx Inc filed Critical CollabRx Inc
Publication of EP0342688A2 publication Critical patent/EP0342688A2/fr
Publication of EP0342688A3 publication Critical patent/EP0342688A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP19890109026 1988-05-20 1989-05-19 Attache pour serrage de plaquettes pour réacteur à plasma Withdrawn EP0342688A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19653588A 1988-05-20 1988-05-20
US196535 1988-05-20

Publications (2)

Publication Number Publication Date
EP0342688A2 EP0342688A2 (fr) 1989-11-23
EP0342688A3 true EP0342688A3 (fr) 1991-04-17

Family

ID=22725797

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890109026 Withdrawn EP0342688A3 (fr) 1988-05-20 1989-05-19 Attache pour serrage de plaquettes pour réacteur à plasma

Country Status (2)

Country Link
EP (1) EP0342688A3 (fr)
JP (1) JPH0231420A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH684602A5 (de) * 1991-11-06 1994-10-31 Balzers Hochvakuum Halterahmen zum Festhalten von einem scheibenartigen Substrat.
US5730801A (en) * 1994-08-23 1998-03-24 Applied Materials, Inc. Compartnetalized substrate processing chamber
WO1996008857A1 (fr) * 1994-09-14 1996-03-21 Paul Julian Edwards Circuit a couplage photonique a bruit reduit
AU3553795A (en) * 1994-09-15 1996-03-29 Materials Research Corporation Apparatus and method for clampling a substrate
DE4433538A1 (de) * 1994-09-20 1996-03-21 Siemens Ag Verfahren zur Vermeidung der Re-Deposition von Ätzprodukten auf Substratoberflächen während des Wolfram-Rückätzprozesses bei der Herstellung hochintegrierter Schaltungen
GB2311651A (en) * 1996-03-27 1997-10-01 Surface Tech Sys Ltd Clamping device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4344383A (en) * 1980-12-10 1982-08-17 Rca Corporation Retainer ring for securing substrates in a vacuum deposition system
JPS60184677A (ja) * 1984-03-01 1985-09-20 Nippon Telegr & Teleph Corp <Ntt> 薄膜形成法及びそれに用いる基板保持・加熱装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4344383A (en) * 1980-12-10 1982-08-17 Rca Corporation Retainer ring for securing substrates in a vacuum deposition system
JPS60184677A (ja) * 1984-03-01 1985-09-20 Nippon Telegr & Teleph Corp <Ntt> 薄膜形成法及びそれに用いる基板保持・加熱装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 10, no. 31 (C-327)(2088) 06 February 1986, & JP-A-60 184677 (NIPPON DENSHIN DENWA KOSHA) 20 September 1985, *

Also Published As

Publication number Publication date
EP0342688A2 (fr) 1989-11-23
JPH0231420A (ja) 1990-02-01

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