EP0327949A3 - Alignment stage device - Google Patents

Alignment stage device Download PDF

Info

Publication number
EP0327949A3
EP0327949A3 EP19890101756 EP89101756A EP0327949A3 EP 0327949 A3 EP0327949 A3 EP 0327949A3 EP 19890101756 EP19890101756 EP 19890101756 EP 89101756 A EP89101756 A EP 89101756A EP 0327949 A3 EP0327949 A3 EP 0327949A3
Authority
EP
European Patent Office
Prior art keywords
stage device
alignment stage
alignment
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19890101756
Other versions
EP0327949B1 (en
EP0327949A2 (en
Inventor
Takehiko C/O Patent Division Nomura
Ryoichi C/O Patent Division Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63026790A external-priority patent/JPH01202687A/en
Priority claimed from JP63030405A external-priority patent/JPH01206287A/en
Priority claimed from JP63132994A external-priority patent/JPH01302197A/en
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of EP0327949A2 publication Critical patent/EP0327949A2/en
Publication of EP0327949A3 publication Critical patent/EP0327949A3/en
Application granted granted Critical
Publication of EP0327949B1 publication Critical patent/EP0327949B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70758Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
EP89101756A 1988-02-08 1989-02-01 Alignment stage device Expired - Lifetime EP0327949B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP63026790A JPH01202687A (en) 1988-02-08 1988-02-08 Positioning apparatus
JP26790/88 1988-02-08
JP30405/88 1988-02-12
JP63030405A JPH01206287A (en) 1988-02-12 1988-02-12 Positioning apparatus
JP132994/88 1988-05-31
JP63132994A JPH01302197A (en) 1988-05-31 1988-05-31 Positioning apparatus

Publications (3)

Publication Number Publication Date
EP0327949A2 EP0327949A2 (en) 1989-08-16
EP0327949A3 true EP0327949A3 (en) 1990-10-17
EP0327949B1 EP0327949B1 (en) 1993-12-15

Family

ID=27285539

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89101756A Expired - Lifetime EP0327949B1 (en) 1988-02-08 1989-02-01 Alignment stage device

Country Status (4)

Country Link
US (1) US4948330A (en)
EP (1) EP0327949B1 (en)
KR (1) KR930000292B1 (en)
DE (1) DE68911330T2 (en)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960423B2 (en) * 1988-11-16 1999-10-06 株式会社日立製作所 Sample moving device and semiconductor manufacturing device
JPH03159148A (en) * 1989-11-16 1991-07-09 Advantest Corp Positioning device and ic test device using the positioning device
US5061039A (en) * 1990-06-22 1991-10-29 The United States Of America As Represented By The United States Department Of Energy Dual axis translation apparatus and system for translating an optical beam and related method
US5165297A (en) * 1991-02-15 1992-11-24 Albert Einstein College Of Medicine Of Yeshiva University, A Div. Of Yeshiva Univ. Remote controlled micromanipulator
US5303035A (en) * 1992-05-04 1994-04-12 New Focus, Inc. Precision micropositioner
JPH07218749A (en) * 1993-12-07 1995-08-18 Furukawa Electric Co Ltd:The Multiaxial fine adjustable stage
DE69500707T2 (en) * 1994-02-07 1998-02-12 Ushio Electric Inc Holding device
US7365513B1 (en) 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5874820A (en) * 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US6989647B1 (en) * 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5528118A (en) * 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US5489089A (en) * 1994-04-26 1996-02-06 Ohio Northern University Automatic alignmant vise
JPH08241126A (en) * 1995-03-02 1996-09-17 Canon Inc Method and unit for synchronous position control
US6008500A (en) * 1995-04-04 1999-12-28 Nikon Corporation Exposure apparatus having dynamically isolated reaction frame
NL1000815C2 (en) * 1995-07-14 1997-01-15 Univ Delft Tech XY displacement device.
JP3365598B2 (en) * 1995-08-31 2003-01-14 富士通株式会社 Method and apparatus for manufacturing optical module assembly
CH691709A5 (en) * 1995-11-03 2001-09-14 Zeiss Carl Fa Drive for moving a moving part of the device.
IL119213A (en) * 1996-09-06 2000-08-31 Orbot Instr Ltd Universal chuck for holding plates of various sizes
US5812310A (en) * 1996-10-16 1998-09-22 Applied Precision, Inc. Orthogonal high accuracy microscope stage
KR100235610B1 (en) * 1997-06-30 1999-12-15 Daewoo Electronics Co Ltd Panel positioning device
US6185030B1 (en) * 1998-03-20 2001-02-06 James W. Overbeck Wide field of view and high speed scanning microscopy
US6764272B1 (en) 1999-05-27 2004-07-20 Micron Technology, Inc. Adjustable coarse alignment tooling for packaged semiconductor devices
US6405659B1 (en) 2000-05-01 2002-06-18 Nikon Corporation Monolithic stage
JP2001328043A (en) * 2000-05-24 2001-11-27 Harmonic Drive Syst Ind Co Ltd Table positioning device
US6553644B2 (en) * 2001-02-09 2003-04-29 International Business Machines Corporation Fixture, carrier ring, and method for processing delicate workpieces
KR100416791B1 (en) * 2001-03-19 2004-01-31 삼성전자주식회사 Microscope Apparatus and Inspection Method for Semiconductor Wafer Inspection
DE10139586C2 (en) * 2001-08-11 2003-11-27 Erich Thallner Plate-shaped adjustment element
US6888289B2 (en) * 2002-07-16 2005-05-03 Baldor Electric Company Multi-axes, sub-micron positioner
US7036777B2 (en) * 2003-05-14 2006-05-02 Quickset International, Inc. Zero backlash positioning device
US7180662B2 (en) * 2004-04-12 2007-02-20 Applied Scientific Instrumentation Inc. Stage assembly and method for optical microscope including Z-axis stage and piezoelectric actuator for rectilinear translation of Z stage
KR100610833B1 (en) 2004-06-21 2006-08-08 현대자동차주식회사 A part panel setting device
KR101130890B1 (en) 2005-03-18 2012-03-28 엘지전자 주식회사 Proximity type esposurer
DE102005045680A1 (en) * 2005-09-24 2007-04-05 Edmund Uschkurat Device for aligning an object along an X-, Y- or Z-axis used e.g. in the pharmaceutical industry comprises a base plate and tables adjustable along the X-axis, Y-axis and the Z-axis
FR2893132B1 (en) * 2005-11-09 2008-07-25 Innopsys Sa SCALING ANALYSIS DEVICE FOR FLUORESCENCE BIOLOGICAL SAMPLES
JP4849227B2 (en) * 2006-07-31 2012-01-11 株式会社ダイフク Automatic load position correction device
CN102910405B (en) * 2012-10-25 2015-12-09 深圳市华星光电技术有限公司 A kind of card casket transportation fork-truck
US10041973B2 (en) * 2013-09-04 2018-08-07 Infineon Technologies Ag Method and apparatus for dynamic alignment of semiconductor devices
US10186450B2 (en) * 2014-07-21 2019-01-22 Asm Ip Holding B.V. Apparatus and method for adjusting a pedestal assembly for a reactor
JP6960352B2 (en) * 2018-02-20 2021-11-05 株式会社日立ハイテク Stage device and charged particle beam device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702399A (en) * 1970-08-04 1972-11-07 Ass Elect Ind Specimen stage for an electron microscope
US4328553A (en) * 1976-12-07 1982-05-04 Computervision Corporation Method and apparatus for targetless wafer alignment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB892836A (en) * 1958-09-25 1962-03-28 Leitz Ernst Gmbh Improvements in or relating to arrangements for effecting fine adjusting movement of microscope stages and other movable members requiring precision adjustment
GB1193501A (en) * 1967-02-02 1970-06-03 Watson W & Sons Ltd Improvements in or relating to Positioning Apparatus
US3466514A (en) * 1967-06-26 1969-09-09 Ibm Method and apparatus for positioning objects in preselected orientations
GB1270566A (en) * 1969-10-31 1972-04-12 Image Analysing Computers Ltd Improved precision stage for optical microscope
US3829978A (en) * 1972-09-18 1974-08-20 U Okun Worktable for positioning workpieces in measuring devices to check dimensions
US3918167A (en) * 1974-03-01 1975-11-11 Gerber Scientific Instr Co Apparatus for sensing relative movement of a work table and tool
JPS5650517Y2 (en) * 1977-02-09 1981-11-26
US4248498A (en) * 1978-06-29 1981-02-03 Georges Michael P Automatic microscope slide
JPS5878642A (en) * 1981-11-05 1983-05-12 株式会社ニコン Focus point detector of eye bottom camera
US4457664A (en) * 1982-03-22 1984-07-03 Ade Corporation Wafer alignment station
US4609264A (en) * 1984-01-23 1986-09-02 The Micromanipulator Microscope Company, Inc. Apparatus for positioning flat objects for microscopic examination
US4667415A (en) * 1985-11-29 1987-05-26 Gca Corporation Microlithographic reticle positioning system
JPS6325946A (en) * 1986-07-18 1988-02-03 Toshiba Corp Minutely movable table apparatus
JPS6372138A (en) * 1986-09-12 1988-04-01 Metsukusu:Kk Device for positioning silicon wafer
JPH052632A (en) * 1991-06-25 1993-01-08 Sumitomo Heavy Ind Ltd Deciding device for fruit surface pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702399A (en) * 1970-08-04 1972-11-07 Ass Elect Ind Specimen stage for an electron microscope
US4328553A (en) * 1976-12-07 1982-05-04 Computervision Corporation Method and apparatus for targetless wafer alignment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN. vol. 15, no. 11, April 1973, NEW YORK US page 3545 R.D.Moro et al: "WAFER STEPPER HEAD ASSEMBLY" *

Also Published As

Publication number Publication date
DE68911330D1 (en) 1994-01-27
EP0327949B1 (en) 1993-12-15
KR890013710A (en) 1989-09-25
EP0327949A2 (en) 1989-08-16
KR930000292B1 (en) 1993-01-15
US4948330A (en) 1990-08-14
DE68911330T2 (en) 1994-05-26

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