EP0315320A3 - Thick-film high frequency signal circuit apparatus with feedthrough capacitor - Google Patents

Thick-film high frequency signal circuit apparatus with feedthrough capacitor Download PDF

Info

Publication number
EP0315320A3
EP0315320A3 EP88309154A EP88309154A EP0315320A3 EP 0315320 A3 EP0315320 A3 EP 0315320A3 EP 88309154 A EP88309154 A EP 88309154A EP 88309154 A EP88309154 A EP 88309154A EP 0315320 A3 EP0315320 A3 EP 0315320A3
Authority
EP
European Patent Office
Prior art keywords
thick
feedthrough capacitor
high frequency
frequency signal
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP88309154A
Other languages
German (de)
French (fr)
Other versions
EP0315320A2 (en
Inventor
Masao C/O Patent Division Segawa
Masayuki C/O Patent Division Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba AVE Co Ltd
Original Assignee
Toshiba Corp
Toshiba Audio Video Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62275202A external-priority patent/JPH01117014A/en
Priority claimed from JP63011607A external-priority patent/JP2585337B2/en
Application filed by Toshiba Corp, Toshiba Audio Video Engineering Co Ltd filed Critical Toshiba Corp
Publication of EP0315320A2 publication Critical patent/EP0315320A2/en
Publication of EP0315320A3 publication Critical patent/EP0315320A3/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A thick-film high frequency signal circuit apparatus with a feedthrough capacitor. The apparatus includes a thick-film circuit (28a) in which a high frequency signal circuit is constituted on a substrate (33) in a thick-film configuration, a shielding case (27) for housing the thick-­ film circuit (28a) therein, a feedthrough capacitor (20a) constituted on one surface of the substrate (33) in the thick-film configuration and a terminal (50) for transmitting signals between the thick-film circuit (28a) and a circuit outside the shielding case (27), the terminal (50) having a first end (50a, 50b) coupled to the thick-film circuit (28a) through the feedthrough capacitor (20a) and a second end (50c) protruding outside the shielding case (27) through a hole (31) defined therein.
EP88309154A 1987-10-29 1988-10-03 Thick-film high frequency signal circuit apparatus with feedthrough capacitor Ceased EP0315320A3 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62275202A JPH01117014A (en) 1987-10-29 1987-10-29 Penetrating capacitor
JP275202/87 1987-10-29
JP11607/88 1988-01-20
JP63011607A JP2585337B2 (en) 1988-01-20 1988-01-20 High frequency circuit board device

Publications (2)

Publication Number Publication Date
EP0315320A2 EP0315320A2 (en) 1989-05-10
EP0315320A3 true EP0315320A3 (en) 1990-02-07

Family

ID=26347061

Family Applications (1)

Application Number Title Priority Date Filing Date
EP88309154A Ceased EP0315320A3 (en) 1987-10-29 1988-10-03 Thick-film high frequency signal circuit apparatus with feedthrough capacitor

Country Status (3)

Country Link
US (1) US4858064A (en)
EP (1) EP0315320A3 (en)
KR (1) KR910004957B1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0173691B1 (en) * 1993-07-07 1999-02-01 카나이 쯔또무 Magnetron with feed through capacitor and filter
TW443717U (en) * 1996-06-28 2001-06-23 Sharp Kk Tuner structure and cable modem tuner using the same
EP1246326A1 (en) * 2001-03-30 2002-10-02 Agilent Technologies, Inc. (a Delaware corporation) Electronic packages
US8761895B2 (en) * 2008-03-20 2014-06-24 Greatbatch Ltd. RF activated AIMD telemetry transceiver
US11147977B2 (en) 2008-03-20 2021-10-19 Greatbatch Ltd. MLCC filter on an aimd circuit board conductively connected to a ground pin attached to a hermetic feedthrough ferrule
WO2009117599A2 (en) 2008-03-20 2009-09-24 Greatbatch Ltd. Shielded three-terminal flat-through emi/energy dissipating filter
US9463329B2 (en) 2008-03-20 2016-10-11 Greatbatch Ltd. Shielded three-terminal flat-through EMI/energy dissipating filter with co-fired hermetically sealed feedthrough
US10080889B2 (en) 2009-03-19 2018-09-25 Greatbatch Ltd. Low inductance and low resistance hermetically sealed filtered feedthrough for an AIMD
US8095224B2 (en) * 2009-03-19 2012-01-10 Greatbatch Ltd. EMI shielded conduit assembly for an active implantable medical device
US8624478B2 (en) * 2009-10-09 2014-01-07 Mapper Lithography Ip B.V. High voltage shielding arrangement of a charged particle lithography system
US9931514B2 (en) 2013-06-30 2018-04-03 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US10272252B2 (en) 2016-11-08 2019-04-30 Greatbatch Ltd. Hermetic terminal for an AIMD having a composite brazed conductive lead
US10596369B2 (en) 2011-03-01 2020-03-24 Greatbatch Ltd. Low equivalent series resistance RF filter for an active implantable medical device
US9427596B2 (en) 2013-01-16 2016-08-30 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US10350421B2 (en) 2013-06-30 2019-07-16 Greatbatch Ltd. Metallurgically bonded gold pocket pad for grounding an EMI filter to a hermetic terminal for an active implantable medical device
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US20130046354A1 (en) 2011-08-19 2013-02-21 Greatbatch Ltd. Implantable cardioverter defibrillator designed for use in a magnetic resonance imaging environment
US9504843B2 (en) 2011-08-19 2016-11-29 Greatbach Ltd. Implantable cardioverter defibrillator designed for use in a magnetic resonance imaging environment
WO2014041649A1 (en) * 2012-09-13 2014-03-20 電気化学工業株式会社 Rubber composition, and vulcanizate and molded article thereof
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
US10912945B2 (en) 2018-03-22 2021-02-09 Greatbatch Ltd. Hermetic terminal for an active implantable medical device having a feedthrough capacitor partially overhanging a ferrule for high effective capacitance area
US10905888B2 (en) 2018-03-22 2021-02-02 Greatbatch Ltd. Electrical connection for an AIMD EMI filter utilizing an anisotropic conductive layer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325103A (en) * 1978-12-28 1982-04-13 Murata Manufacturing Co., Ltd. Provisional fixing structure of electronic tuner
US4611882A (en) * 1982-09-08 1986-09-16 Alps Electric Co., Ltd. High-frequency circuit device with an annular capacitor on the back of an insulated substrate
US4747019A (en) * 1984-12-14 1988-05-24 Murata Manufacturing Co., Ltd. Feedthrough capacitor arrangement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954659U (en) * 1982-10-01 1984-04-10 松下冷機株式会社 door body
US4616655A (en) * 1984-01-20 1986-10-14 Cordis Corporation Implantable pulse generator having a single printed circuit board and a chip carrier
JPH0424649Y2 (en) * 1985-02-18 1992-06-11
JPS62180882U (en) * 1986-05-08 1987-11-17

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4325103A (en) * 1978-12-28 1982-04-13 Murata Manufacturing Co., Ltd. Provisional fixing structure of electronic tuner
US4611882A (en) * 1982-09-08 1986-09-16 Alps Electric Co., Ltd. High-frequency circuit device with an annular capacitor on the back of an insulated substrate
US4747019A (en) * 1984-12-14 1988-05-24 Murata Manufacturing Co., Ltd. Feedthrough capacitor arrangement

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
R.C.A. TECHNICAL NOTES, no. 1317, 27th October 1982, sheets 1-3, A Publication of RCA, Princeton, New Jersey, US; J.P. HEENAN et al.: "Method for attaching edge terminals" *

Also Published As

Publication number Publication date
US4858064A (en) 1989-08-15
EP0315320A2 (en) 1989-05-10
KR890007628A (en) 1989-06-20
KR910004957B1 (en) 1991-07-18

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