EP0295626A3 - Photosensitive composition - Google Patents
Photosensitive composition Download PDFInfo
- Publication number
- EP0295626A3 EP0295626A3 EP88109468A EP88109468A EP0295626A3 EP 0295626 A3 EP0295626 A3 EP 0295626A3 EP 88109468 A EP88109468 A EP 88109468A EP 88109468 A EP88109468 A EP 88109468A EP 0295626 A3 EP0295626 A3 EP 0295626A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensitizer
- diazonaphthoquinone
- oxo
- ester
- photosensitive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract 2
- 229930003836 cresol Natural products 0.000 abstract 2
- 150000002148 esters Chemical class 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 abstract 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 abstract 1
- 239000004793 Polystyrene Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/72—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A photoresist pattern exhibiting high resolution
for an i-line exposure and having a steep sectional
profile can be formed by making use of a
photosensitive composition comprising a cresol
novolac resin and a sensitizer blended therewith
wherein(i) the cresol novolac resin has a meta to
para ratio of 50/50 to 70/30 and a standard polystyrene
equivalent weight-average molecular weight of 5,000 to
50,000 and(ii) the sensitizer comprises an ester of
1-oxo-2-diazonaphthoquinone-5-sulfonic acid with
2,3,4-trihydroxybenzophenone and/or an ester of
1-oxo-2-diazonaphthoquinone-5-sulfonic acid with
2,3,4,4′-tetrahydroxybenzophenone and the content of
said sensitizer is 14 to 35 % by weight based on said
polymer compound.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP147066/87 | 1987-06-15 | ||
JP62147066A JPS63311350A (en) | 1987-06-15 | 1987-06-15 | Photosensitive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0295626A2 EP0295626A2 (en) | 1988-12-21 |
EP0295626A3 true EP0295626A3 (en) | 1990-07-18 |
Family
ID=15421712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP88109468A Withdrawn EP0295626A3 (en) | 1987-06-15 | 1988-06-14 | Photosensitive composition |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0295626A3 (en) |
JP (1) | JPS63311350A (en) |
KR (1) | KR910004841B1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5069996A (en) * | 1989-07-24 | 1991-12-03 | Ocg Microelectronic Materials, Inc. | Process for developing selected positive photoresists |
DE4111445A1 (en) * | 1991-04-09 | 1992-10-15 | Hoechst Ag | RADIATION-SENSITIVE MIXTURE WITH ESTERS OF 1,2-NAPHTHOQUINONE-2-DIAZIDE SULFONIC ACID AND A RADIATION-SENSITIVE RECORDING MATERIAL PRODUCED THEREFOR |
KR100523768B1 (en) * | 2002-06-01 | 2005-10-26 | 강승진 | Photosensitive composition |
TWI678596B (en) | 2018-09-13 | 2019-12-01 | 新應材股份有限公司 | Positive photoresist composition and method of forming patterned polyimide layer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3603372A1 (en) * | 1985-02-13 | 1986-08-14 | Mitsubishi Chemical Industries Ltd., Tokio/Tokyo | POSITIVE PHOTORESIST MIX |
GB2190090A (en) * | 1986-05-02 | 1987-11-11 | Tokyo Ohka Kogyo Co Ltd | A positive-working photoresist composition |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0658529B2 (en) * | 1983-08-17 | 1994-08-03 | 三菱化成株式会社 | Positive-type cresol lunovolak photoresist composition |
JPS62143045A (en) * | 1985-11-29 | 1987-06-26 | Mitsubishi Chem Ind Ltd | Positive type photosensitive lithographic plate |
-
1987
- 1987-06-15 JP JP62147066A patent/JPS63311350A/en active Pending
-
1988
- 1988-05-31 KR KR1019880006418A patent/KR910004841B1/en not_active IP Right Cessation
- 1988-06-14 EP EP88109468A patent/EP0295626A3/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3603372A1 (en) * | 1985-02-13 | 1986-08-14 | Mitsubishi Chemical Industries Ltd., Tokio/Tokyo | POSITIVE PHOTORESIST MIX |
GB2190090A (en) * | 1986-05-02 | 1987-11-11 | Tokyo Ohka Kogyo Co Ltd | A positive-working photoresist composition |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 11, no. 373 (P-643)(2820) 05 December 1987, & JP-A-62 143045 (MITSUBISHI CHEM IND LTD) 26 June 1987, * |
PATENT ABSTRACTS OF JAPAN vol. 9, no. 167 (P-372)(1890) 12 July 1985, & JP-A-60 042 753 (MITSUBISHI KASEI KOGYO K.K.) 07 March 1985, * |
Also Published As
Publication number | Publication date |
---|---|
KR910004841B1 (en) | 1991-07-13 |
JPS63311350A (en) | 1988-12-20 |
EP0295626A2 (en) | 1988-12-21 |
KR890000928A (en) | 1989-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE NL |
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PUAL | Search report despatched |
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|
17P | Request for examination filed |
Effective date: 19901212 |
|
17Q | First examination report despatched |
Effective date: 19930507 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 19930918 |