EP0271164B1 - Tool for manufacturing a circuit pattern of an electrical circuit board by cutting of a copper plate and the circuit pattern of an electric circuit board which is suitable for work with the tool - Google Patents
Tool for manufacturing a circuit pattern of an electrical circuit board by cutting of a copper plate and the circuit pattern of an electric circuit board which is suitable for work with the tool Download PDFInfo
- Publication number
- EP0271164B1 EP0271164B1 EP87202441A EP87202441A EP0271164B1 EP 0271164 B1 EP0271164 B1 EP 0271164B1 EP 87202441 A EP87202441 A EP 87202441A EP 87202441 A EP87202441 A EP 87202441A EP 0271164 B1 EP0271164 B1 EP 0271164B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- tool
- circuit pattern
- punches
- copper plate
- dies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 24
- 229910052802 copper Inorganic materials 0.000 title claims description 24
- 239000010949 copper Substances 0.000 title claims description 24
- 238000005520 cutting process Methods 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Definitions
- the invention relates to a tool for producing a circuit pattern of an electrical circuit board with cable and ground cables and connection points for components according to a predetermined layout by cutting a copper plate with the help of tool stamps and the stamp associated holding down along the edges of the trains and connection points and Circuit pattern of an electrical circuit board that is suitable for machining using the tool.
- the height or depth of the circuit patterns in the program plates predominantly correspond to approximately half the thickness of the copper plate.
- the stamp and hold-down surfaces are square. Such a square design gives more freedom for the design of the circuit pattern.
- a circuit pattern for the tool must be based on the design options of the tool. Accordingly, according to a further embodiment of the invention, it is provided that all conductor shapes of the pattern and all intermediate areas between them in the matrix pattern are composed of partial areas which correspond to the stamp and hold-down areas. In a further embodiment of the invention, it is provided that the connection points for components are constructed from a plurality of stamp and hold-down surfaces combined to form a group, and the cable and ground cables are constructed from stamp and hold-down surfaces which are lined up in a row. Such a structure is easily possible and also useful.
- the stamp 1 shows a stamp 1 and a hold-down device 3 of a tool for cutting a circuit pattern of an electrical circuit board.
- the stamp 1 and the hold-down device 3 consist of a multiplicity of individual stamps 1 a and single hold-down devices 3 a with the same square stamp surfaces 1 b and hold-down surfaces 3 b.
- the stamp surfaces 1b and the hold-down surfaces 3b of the individual stamps 1a and individual hold-downs 3b lie side by side in a matrix pattern, each individual stamp 1a being aligned with a single hold-down element 3a.
- the plunger 1 and hold-down device 3 shown diagrammatically in FIG. 1 are guided in a tool frame which is not shown for simplicity and clarity.
- the stamp 1 and the hold-down device 3 are actuated by program plates 4 and 6, which are shown in FIGS. 2 and 3 from their programming side 5, 7.
- the program plates 4, 6 are provided in relief with three program levels, which result from the circuit pattern shown in FIG. 2.
- the level 2.1 is kept white
- the level 2.2 is dotted and the level 2.3 is hatched (FIG. 2a).
- program board 3 in which, this time the other way round, level 3.1 is hatched, level 3.2 is dotted and level 3.3 is white. Accordingly, there is a circuit pattern relief on the program side 5 of the program plate 4 as well as on the program side 7 of the program plate 6.
- This circuit pattern relief is predominantly positively protruding in the program plate 4 for the stamps 1 and predominantly negatively embedded in the program plate 6 for the hold-down devices 3; both program pages are mirror images of each other.
- the edges 10 of the circuit pattern or the relief are preferably somewhat withdrawn or chamfered so that the mutual movement of the individual stamps or individual hold-downs is not impaired. It is only important when designing the program pages that the individual stamps or individual hold-down devices are securely loaded.
- FIGS. 4 and 5 show the program plates 4 and 6 in section along the line IV-IV according to FIGS. 2 and 3, the three program levels 2.1 to 2.3 and 3.1 to 3.3 being recognizable in each case.
- All punches 1 a are located at a uniform height in a tool holder (not shown), the punch surfaces 1 b facing a (nickel-plated) copper plate 8.
- the program plate 4 according to FIG. 2 with its program side 5 is arranged on the side of the stamp 1a remote from the stamp surfaces 1b. This program plate 4 is movable against the stamp 1.
- the hold-downs 3a lie with their cutting surfaces 3b on the (nickel-plated) copper plate 8 on the other side.
- the hold-down devices 3a are also guided in a tool holder, not shown.
- the program plate 6 according to FIG.
- the prepared work processes are completed before the copper plate 8 is cut.
- 5 shows, the program plates 4 and 6 are then moved towards each other in the direction of the arrows 9, the punches 1 and the hold-down devices 3 being displaced due to the mirror-image formation of the program areas 5 and 7.
- the copper plate 8 is cut into plate parts 8.1, 8.2, 8.3 and 8.4. If the height relationships of the circuit pattern relief are kept in such a way that they do not exceed half the thickness of the copper plate in most places, then the copper plate remains after the cutting as well, even if the structure is dissolved plate.
- the stripping after cutting is done by a flat "program plate" on both sides.
- FIG. 6 shows a circuit pattern which is particularly suitable for the tool with the matrix grid of the punches and hold-down devices.
- the circuit pattern according to FIG. 6 consists of conductor tracks 11, 12, 13, 14, 15, 16, 17, 18, etc., which are only shown as examples.
- the cable runs are expanded at their ends with openings 20 to form solder connection points 21.
- some conductor tracks abut one another edge by edge. This is possible because after the copper plate 8 has been cut, this dissolved copper plate is introduced into an injection mold. In the cavity of the injection mold, not shown, the cable runs are pressed into different planes by means of pins of the tool, not shown.
- the principle of the circuit pattern according to FIG. 6 can be seen in the fact that the individual cable runs are formed from individual stamp or hold-down surfaces which are arranged in a row.
- the cable run 18 is taken as an example. This is formed from partial surfaces 3c of the hold-down devices 3a, which are dashed at an angle in FIG. 1.
- the corresponding stamp surfaces 1c are indicated with asterisks, provided that the edges 24a and 24b are guided parallel to one another, as are the edges 25a and 25b.
- the cable line 18 in FIG. 6 in conjunction with FIG. 1 it can be seen that the cable line itself is formed from a series of square stamp or hold-down surfaces 1b and 3b.
- the connection point 27 is formed from square stamp or hold-down surfaces combined into a group.
- Fig. 6 the part of the circuit pattern which is found in the tool according to Figs. 1 to 5 is outlined in thick dash lines. In order to arrive at the overall circuit board, several such tools are used side by side.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
Die Erfindung bezieht sich auf ein Werkzeug zum Herstellen eines Schaltungsmusters einer elektrischen Schaltungsplatte mit Leitungs- und Massezügen sowie Anschlußstellen für Bauteile nach einem vorgegebenen Lay-out durch Schneiden einer Kupferplatte mit Hilfe von Werkzeugstempeln und den Stempeln zugeordneten Niederhaltern längs der Ränder der Züge und Anschlußstellen und Schaltungsmuster einer elektrischen Schaltungsplatte, das zum Bearbeiten mit Hilfe des Werkzeuges geeignet ist.The invention relates to a tool for producing a circuit pattern of an electrical circuit board with cable and ground cables and connection points for components according to a predetermined layout by cutting a copper plate with the help of tool stamps and the stamp associated holding down along the edges of the trains and connection points and Circuit pattern of an electrical circuit board that is suitable for machining using the tool.
Es ist aus der DE-OS 23 05 883 eine elektrische Schaltungsplatte bekannt, bei der Leitungszüge sowie Anschlußstellen für Bauteile durch Schneiden einer Kupferplatte und Einspritzen des Schaltungsmusters in Kunststoff hergestellt werden. Die zum Schneiden geeigneten Werkzeuge sind dabei nicht beschrieben.It is known from DE-OS 23 05 883 an electrical circuit board in which cable runs and connection points for components are made by cutting a copper plate and injecting the circuit pattern into plastic. The tools suitable for cutting are not described here.
Es ist Aufgabe der Erfindung, ein Werkzeug zum Schneiden einer Kupferplatte entsprechend dem vorgegebenen Lay-out einer elektrischen Schatlungsplatte zu schaffen, das flexibel ist und bei dem die schneidenden Werkzeuge selbst nicht speziell auf das Schaltungsmuster zugeschnitten hergestellt werden müssen.It is an object of the invention to provide a tool for cutting a copper plate in accordance with the given layout of an electrical circuit board, which is flexible and in which the cutting tools themselves do not have to be specially tailored to the circuit pattern.
Die gestellte Aufgabe ist erfindungsgemäß durch die Merkmale des Anspruchs 1 gelöst.The object is achieved according to the invention by the features of
Bei einem derartigen Werkzeug werden weder Stempel noch Niederhalter bei der Umstellung auf ein anderes Schaltungsmuster ausgewechselt. Es brauchen deshalb also keine Spezialmatrizen und Niederhalter hergestellt zu werden. Das jeweilige geschnittene Muster wird von den Programmplatten vorgegeben, die mit großen Toleranzen behaftet ausgeführt sein können, da die Programmplatten keine selbstschneidenden Kanten haben, vielmehr nur Druck auf die einzelnen Stempel und Niederhalter ausüben.With such a tool, neither stamp nor hold-down device are exchanged when changing over to another circuit pattern. It is therefore not necessary to produce special matrices and hold-down devices. The respective cut pattern is specified by the program boards, which have large tolerances can be executed afflicted, since the program plates have no self-tapping edges, rather only exert pressure on the individual punches and hold-down devices.
Es ist an sich bekannt (DE-OS 31 09 862), Lochstempel in den Kreuzen eines Matrixmusters gegeneinander auszutauschen, um so die Lochsstempel zu versetzen für andere Lochungsmuster.It is known per se (DE-OS 31 09 862) to replace punches in the crosses of a matrix pattern with one another in order to offset the punches for other perforation patterns.
Nach einer weiteren Ausgestaltung der Erfindung ist vorgesehen, daß die Höhe bzw. Tiefe der Schaltungsmuster in den Programmplatten überwiegend etwa der halben Dicke der Kupferplatte entsprechen. Bei einer derartigen Bemessungen der Höhen und Tiefen wird sichergestellt, daß zwischen den einzelnen Leitungs- und Massezügen sowie Anschlußstellen für Bauteile nach vollzogenem Schneiden noch ein ausreichend fester Zusammenhalt besteht, so daß eine so geschnittene Kupferplatte dann sicher in eine Spritzform eingebracht werden kann.According to a further embodiment of the invention, it is provided that the height or depth of the circuit patterns in the program plates predominantly correspond to approximately half the thickness of the copper plate. With such dimensions of the heights and depths it is ensured that there is still a sufficiently firm cohesion between the individual line and ground cables as well as connection points for components after completed cutting, so that a copper plate cut in this way can then be safely introduced into an injection mold.
Nach einer weiteren Ausgestaltung der Erfindung ist vorgesehen, daß die Stempel- und Niederhalterflächen quadratisch ausgebildet sind. Eine solche quadratische Ausbildung gibt mehr Freiheit für die Gestaltung des Schaltungsmusters.According to a further embodiment of the invention it is provided that the stamp and hold-down surfaces are square. Such a square design gives more freedom for the design of the circuit pattern.
Nach einer weiteren Ausgestaltung der Erfindung ist vorgesehen, daß mehrere derartige Einzelwerkzeuge zu einem Gesamtwerkzeug zusammengefaßt sind. Hierdurch läßt sich die Außenabmessung der jeweiligen herzustellenden Schaltungsplatte den Anforderungen entsprechend gestalten.According to a further embodiment of the invention it is provided that several such individual tools are combined to form a complete tool. As a result, the outer dimensions of the respective circuit board to be produced can be designed according to the requirements.
Ein Schaltungsmuster für das Werkzeug muß sich nach den Gestaltungsmöglichkeiten des Werkzeuges richten. Dementsprechend ist nach einer weiteren Ausgestaltung der Erfindung vorgesehen, daß alle Leiterformen des Musters und alle Zwischenbereiche zwischen ihnen im Matrixmuster aus Teilflächen, die den Stempel- und Niederhalterflächen entsprechen, zusammengesetzt sind. In weiterer Ausgestaltung der Erfindung ist dabei vorgesehen, daß die Anschlußpunkte für Bauelemente aus mehreren, zu einer Gruppe zusammengefaßten Stempel- und Niederhalterflächen und die Leitungs- und Massezüge aus aneinandergereihten Stempel- und Niederhalterflächen aufgebaut sind. Ein derartiger Aufbau ist ohne weiteres möglich und darüber hinaus auch sinnvoll.A circuit pattern for the tool must be based on the design options of the tool. Accordingly, according to a further embodiment of the invention, it is provided that all conductor shapes of the pattern and all intermediate areas between them in the matrix pattern are composed of partial areas which correspond to the stamp and hold-down areas. In a further embodiment of the invention, it is provided that the connection points for components are constructed from a plurality of stamp and hold-down surfaces combined to form a group, and the cable and ground cables are constructed from stamp and hold-down surfaces which are lined up in a row. Such a structure is easily possible and also useful.
Die Erfindung wird anhand des in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert. Es zeigen:
- Fig. 1 Stempel- und Niederhalter-Einheiten eines Schneidwerkzeuges, bestehend aus vielen im Matrixraster angeordneten Einzelstempeln bzw. Einzel-Niederhaltern, zum Schneiden von Kupferplatten entsprechend vorgegebenen elektrischen Schaltungszugmustern,
- Fig. 2 eine Programmplatte für das Werkzeug in Ansicht von der Schaltungsmusterseite her,
- Fig. 2a die Verteilung verschiedener Programmebenen auf der Schaltungsmusterseite nach Fig. 2,
- Fig. 3 eine Programmplatte für die Niederhalterseite des Werkzeuges von der Schaltungsmusterseite her,
- Fig. 3a die Verteilung verschiedener Programmebenen auf der Schaltungsmusterseite nach Fig. 3,
- Fig. 4 das Werkzeug mit Stempeln, Niederhaltern, zwei Programmplatten und einer Kupferplatte als Werkstück vor dem Schneidvorgang im auseinandergerückten Zustand,
- Fig. 5 das Werkzeug nach Fig. 4 nach dem Schneiden der Kupferplatte im zusammengefahrenen Zustand,
- Fig. 6 ein Schaltungsmuster, das mit Hilfe des Werkzeuges nach den Fig. 1 bis 5 aus einer Kupferplatte schneidbar ist.
- 1 stamp and hold-down units of a cutting tool, consisting of many individual punches or hold-down devices arranged in the matrix grid, for cutting copper plates according to predetermined electrical circuit tension patterns,
- 2 is a program plate for the tool in view from the circuit pattern side,
- 2a shows the distribution of different program levels on the circuit pattern side according to FIG. 2,
- 3 shows a program plate for the hold-down side of the tool from the circuit pattern side,
- 3a shows the distribution of different program levels on the circuit pattern side according to FIG. 3,
- 4 shows the tool with stamps, hold-down devices, two program plates and a copper plate as a workpiece before the cutting process in the disassembled state,
- 5 shows the tool according to FIG. 4 after cutting the copper plate in the retracted state,
- Fig. 6 is a circuit pattern that can be cut from a copper plate using the tool of FIGS. 1 to 5.
In Fig. 1 sind ein Stempel 1 und ein Niederhalter 3 eines Werkzeuges zum Schneiden eines Schaltungsmustes einer elektrischen Schaltungsplatte dargestellt. Der Stempel 1 und der Niederhalter 3 bestehen aus einer Vielzahl von Einzelstempeln 1a und Einzel-Niederhaltern 3a mit gleichen quadratischen Stempelflächen 1b bzw. Niederhalterflächen 3b. Die Stempelflächen 1b und die Niederhalterflächen 3b der Einzelstempel 1a und Einzel-Niederhalter 3b liegen in einem Matrixraster nebeneinander, wobei jeder Einzelstempel 1a mit einem Einzel-Niederhalter 3a fluchtet. Die in Fig. 1 schaubildlich dargestellten Stempel 1 und Niederhalter 3 werden geführt in einem Werkzeugrahmen, der der Einfachheit und Übersichtlichkeit wegen nicht dargestellt ist.1 shows a
Die Stempel 1 und die Niederhalter 3 werden betätigt von Programmplatten 4 und 6, die in Fig. 2 und 3 von ihrer programmgebenden Seite 5, 7 her dargestellt sind. Auf der programmgebenden Seite sind die Programmplatten 4, 6 reliefartig mit drei Programmebenen versehen, die sich aus dem in Fig. 2 dargestellten Schaltungsmuster ergeben. Die Ebene 2.1 ist dabei weiß gehalten, die Ebene 2.2 gepunktet und die Ebene 2.3 schräg schraffiert (Fig. 2a). Entsprechendes gilt für die Programmplatte 3, in der, diesmal umgekehrt, die Ebene 3.1 schräg schraffiert, die Ebene 3.2 gepunktet und die Ebene 3.3 weiß ausgeführt sind. Dementsprechend ergibt sich auf der Programmseite 5 der Programmplatte 4 ebenso wie auf der Programmseite 7 der Programmplatte 6 ein Schaltungsmusterrelief. Dieses Schaltungsmusterrelief ist in der Programmplatte 4 für die Stempel 1 überwiegend positiv hervorstehend und in der Programmplatte 6 für die Niederhalter 3 überwiegend negativ eingelassen ausgebildet; beide Programmseiten sind spiegelbildlich zueinander. Die Ränder 10 des Schaltungsmusters bzw. des Reliefs sind vorzugsweise etwas zurückgenommen oder angefast, damit die gegenseitige Bewegung der Einzelstempel oder Einzel-Niederhalter nicht beeinträchtigt wird. Es kommt bei der Ausbildung der Programmseiten nur darauf an, daß die Einzelstempel bzw. Einzel-Niederhalter sicher beaufschlagt werden.The
Die Fig. 4 und 5 zeigen die Programmplatten 4 und 6 im Schnitt längs der Linie IV-IV nach Fig. 2 und 3, wobei jeweils die drei Programmebenen 2.1 bis 2.3 und 3.1 bis 3.3 erkennbar sind.4 and 5 show the
Anhand der Fig. 4 und 5 wird nun die Wirkungsweise des Werkzeuges dargestellt. In einem nicht dargestellten Werkzeughalter befinden sich auf gleichmäßiger Höhe alle Stempel 1a, wobei die Stempelflächen 1b einer (vernickelten) Kupferplatte 8 zugewandt sind. Auf der von den Stempelflächen 1b abliegenden Seite der Stempel 1a ist die Programmplatte 4 nach Fig. 2 mit ihrer Programmseite 5 angeordnet. Diese Programmplatte 4 ist gegen die Stempel 1 fahrbar. Die Niederhalter 3a liegen mit ihren Schneidflächen 3b der (vernickelten) Kupferplatte 8 auf der anderen Seite gegenüber. Auch die Niederhalter 3a sind in einem nicht dargestellten Werkzeughalter geführt. Auf der von den Niederhalterflächen 3b abliegenden Seiten der Niederhalter befindet sich die Programmplatte 6 nach Fig. 3 mit ihrer Programmseite 7.4 and 5, the operation of the tool will now be shown. All punches 1 a are located at a uniform height in a tool holder (not shown), the
Nach dieser Arbeitsvorbereitung durch das Zwischenschieben der Kupferplatte 8 und das Auflegen der Programmplatten 4 und 6 sind die vorbereiteten Arbeitsvorgänge vor dem Schneiden der Kupferplatte 8 abgeschlossen. Wie Fig. 5 zeigt, werden dann die Programmplatten 4 und 6 in Richtung der Pfeile 9 gegeneinander gefahren, wobei sich die Stempel 1 und die Niederhalter 3 aufgrund der spiegelbildlichen Ausbildung der Programmflächen 5 und 7 verschieben. Die Kupferplatte 8 wird dabei zerschnitten in Plattenteile 8.1, 8.2, 8.3 und 8.4. Sind die Höhenverhältnisse des Schaltungsmusterreliefs so gehalten, daß sie die halbe Dicke der Kupferplatte an den meisten Stellen nicht überschreiten, dann bleibt die Kupferplatte auch nach dem tchneiden noch als, wenn auch in der Struktur aufgelöste Platte bestehen. Das Abstreifen nach dem Schneiden erfolgt durch eine ebene "Programmplatte" auf beiden Seiten.After this work preparation by inserting the
Fig. 6 zeigt ein Schaltungsmuster, welches speziell für das Werkzeug mit dem Matrixraster der Stempel und Niederhalter geeignet ist. Das Schaltungsmuster nach Fig. 6 besteht aus nur beispielhaft angezogenen Leiterbahnen 11, 12, 13, 14, 15, 16, 17, 18 usw.. Die Leitungszüge sind jeweils an ihren mit Durchbrüchen 20 versehenen Enden zu Lötanschlußstellen 21 erweitert. In der Darstellung nach Fig. 6 liegen einige Leiterbahnen Kante auf Kante aneinander an. Dies ist deswegen möglich, weil nach dem Schneiden der Kupferplatte 8 diese aufgelöste Kupferplatte in eine Spritzform eingebracht wird. Im Hohlraum der nicht dargestellten Spritzform werden die Leitungszüge mittels nicht dargestellter Stifte des Werkzeuges in unterschiedliche Ebenen gedrückt. Diese unterschiedlichen Ebenen liegen weiter auseinander als die Ebenen 2.1 bis 2.3 oder 3.1 bis 3.3 des Schaltungsmusterreliefs auf den Programmseiten 5 und 7 der Programmplatten 4 und 6. Die später in die verschiedenen Ebenen gedrückten Leitungszüge, die auch masseführend sein können, werden vollständig beim Spritzen in Kunststoff eingebettet. Frei bleiben nur die Anschlußstellen für Bauelemente und beispielsweise Anschlußnasen 22, die zur Kontaktierung herausführbar sind.FIG. 6 shows a circuit pattern which is particularly suitable for the tool with the matrix grid of the punches and hold-down devices. The circuit pattern according to FIG. 6 consists of conductor tracks 11, 12, 13, 14, 15, 16, 17, 18, etc., which are only shown as examples. The cable runs are expanded at their ends with
Nicht alle Züge des Schaltungsmusters werden zur Stromführung benötigt. Die nicht benötigten Leitungszüge können der Wärmeableitung und Versteifung dienen.Not all trains of the circuit pattern are required to carry the current. The cable runs that are not required can be used for heat dissipation and stiffening.
Das Prinzip des Schaltungsmusters nach Fig. 6 ist darin zu sehen, daß die einzelnen Leitungszüge gebildet sind aus aneinander gereihten einzelnen Stempel- oder Niederhalterflächen. Als Beispiel sei der Leitungszug 18 herausgegriffen. Dieser wird aus Teilflächen 3c der Niederhalter 3a gebildet, die in Fig. 1 schräg gestrichelt sind. Bei den Stempeln sind die entsprechenden Stempelflächen 1c mit Sternchen angedeutet, wobei Voraussetzung ist, daß die Kanten 24a und 24b parallel zueinander geführt werden, ebenso wie die Kanten 25a und 25b. Anhand des Leitungszuges 18 in Fig. 6 in Verbindung mit Fig. 1 ist zu erkennen, daß der Leitungszug selbst aus einer Aneinanderreihung von quadratischen Stempel- oder Niederhalterflächen 1b und 3b gebildet ist. Die Anschlußstelle 27 wird aus zu einer Gruppe zusammengefaßten quadratischen Stempel- oder Niederhalterflächen gebildet.The principle of the circuit pattern according to FIG. 6 can be seen in the fact that the individual cable runs are formed from individual stamp or hold-down surfaces which are arranged in a row. The
In Fig. 6 ist der Teil des Schaltungsmusters, der sich in dem Werkzeug nach den Fig. 1 bis 5 wiederfindet, dick strichpunktiert umrandet. Um zu der Gesamtschaltungsplatte zu kommen, werden mehrere solche Werkzeuge nebeneinander zum Einsatz gebracht.In Fig. 6, the part of the circuit pattern which is found in the tool according to Figs. 1 to 5 is outlined in thick dash lines. In order to arrive at the overall circuit board, several such tools are used side by side.
Claims (7)
- A tool for manufacturing a circuit pattern of an electrical circuit board having conductor and mass tracks as well as connection areas for components according to a given layout through cutting of a copper plate by means of punches and dies associated with the punches along the edges of the tracks and connection areas, with the following characteristics:- the tool parts positioned on either side of the copper plate (8) entirely consist of individual punches (1a) and adjustable individual dies (3a) provided with consecutively arranged punch and die surfaces (1b, 3b) of uniformly rectangular cross-section and are arranged next to one another in a matrix raster,- program plates (4, 6) are arranged at the punch and die ends facing away from the copper plate (8),- the program plates (4, 6) have circuit pattern reliefs (5, 7) arranged as mirrored images relative to the punches (1) and dies (3), respectively, so that, when the program plates (4, 6) are pressed against each other, the copper plate (8) is cut between the moving punches (1) and the dies (3) in accordance with the relief (5, 7).
- A tool as claimed in Claim 1, characterized in that the respective heights and depths of the circuit patterns in the program plates (4, 6) substantially correspond to half the thickness of the copper plate (8).
- A tool as claimed in Claim 1, characterized in that the surfaces of punches (1b) and dies (3b) are of square shape.
- A tool as claimed in Claims 1 to 3, characterized in that several of such individual tools are combined into an integrated tool.
- A circuit pattern for a tool as claimed in any one of Claims 1 to 4, characterized in that all the conductor shapes (11 to 18) of the pattern and all the intermediate areas between them in the matrix pattern are composed of subsurfaces corresponding to the surfaces of the punches (1b) and dies (3b).
- A circuit pattern as claimed in Claim 5, characterized in that the connection points (21) for components are composed of several surfaces of punches and dies combined into a group.
- A circuit pattern as claimed in Claim 5, characterized in that the conductor and mass tracks (11 to 18) are composed of consecutively arranged punch (1b) and die (3b) surfaces.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3642039 | 1986-12-09 | ||
DE19863642039 DE3642039A1 (en) | 1986-12-09 | 1986-12-09 | TOOL FOR MAKING A CIRCUIT PATTERN OF AN ELECTRICAL CIRCUIT BOARD BY CUTTING A COPPER PLATE AND CIRCUIT PATTERN OF AN ELECTRICAL CIRCUIT BOARD SUITABLE FOR MACHINING WITH THE TOOL |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0271164A2 EP0271164A2 (en) | 1988-06-15 |
EP0271164A3 EP0271164A3 (en) | 1989-02-08 |
EP0271164B1 true EP0271164B1 (en) | 1991-09-18 |
Family
ID=6315801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP87202441A Expired - Lifetime EP0271164B1 (en) | 1986-12-09 | 1987-12-07 | Tool for manufacturing a circuit pattern of an electrical circuit board by cutting of a copper plate and the circuit pattern of an electric circuit board which is suitable for work with the tool |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0271164B1 (en) |
JP (1) | JPS63220595A (en) |
DE (2) | DE3642039A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04167586A (en) * | 1990-10-31 | 1992-06-15 | Hitachi Cable Ltd | Manufacture of molded circuit board |
JPH0818197A (en) * | 1995-02-10 | 1996-01-19 | Hitachi Cable Ltd | Production of molded circuit board |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB821841A (en) * | 1955-01-18 | 1959-10-14 | Robert James Malcolm | Method of manufacturing electrical circuit components |
FR1598182A (en) * | 1968-11-08 | 1970-07-06 | ||
DE2505667A1 (en) * | 1975-02-11 | 1976-08-19 | Pkm Planungsgesellschaft Fuer | Tool set for multiple stamping - using interchangeable pressure pads to actuate punches in accordance with a program |
DE2612257C3 (en) * | 1976-03-23 | 1979-06-07 | Westfaelische Metall Industrie Kg, Hueck & Co, 4780 Lippstadt | Process and device for the production of printed circuit boards |
US4053348A (en) * | 1976-06-16 | 1977-10-11 | Jerobee Industries, Inc. | Die and method of making the same |
DE3109862C2 (en) * | 1981-03-14 | 1985-05-02 | Loewe Opta Gmbh, 8640 Kronach | Cutting tool with several punches for punching plate-shaped workpieces at the same time |
-
1986
- 1986-12-09 DE DE19863642039 patent/DE3642039A1/en active Granted
-
1987
- 1987-12-07 EP EP87202441A patent/EP0271164B1/en not_active Expired - Lifetime
- 1987-12-07 DE DE8787202441T patent/DE3773144D1/en not_active Expired - Lifetime
- 1987-12-08 JP JP62308836A patent/JPS63220595A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE3773144D1 (en) | 1991-10-24 |
JPS63220595A (en) | 1988-09-13 |
DE3642039C2 (en) | 1989-07-13 |
EP0271164A2 (en) | 1988-06-15 |
EP0271164A3 (en) | 1989-02-08 |
DE3642039A1 (en) | 1988-06-23 |
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