EP0230675A3 - Ceramic wiring substrate and process for producing the same - Google Patents

Ceramic wiring substrate and process for producing the same Download PDF

Info

Publication number
EP0230675A3
EP0230675A3 EP86118173A EP86118173A EP0230675A3 EP 0230675 A3 EP0230675 A3 EP 0230675A3 EP 86118173 A EP86118173 A EP 86118173A EP 86118173 A EP86118173 A EP 86118173A EP 0230675 A3 EP0230675 A3 EP 0230675A3
Authority
EP
European Patent Office
Prior art keywords
producing
same
wiring substrate
ceramic wiring
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP86118173A
Other versions
EP0230675B1 (en
EP0230675A2 (en
Inventor
Gyozo Toda
Takashi Kuroki
Shousaku Ishihara
Tsuyoshi Fujita
Naoya Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP0230675A2 publication Critical patent/EP0230675A2/en
Publication of EP0230675A3 publication Critical patent/EP0230675A3/en
Application granted granted Critical
Publication of EP0230675B1 publication Critical patent/EP0230675B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
EP86118173A 1986-01-27 1986-12-31 Ceramic wiring substrate and process for producing the same Expired - Lifetime EP0230675B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13809/86 1986-01-27
JP61013809A JPH0632355B2 (en) 1986-01-27 1986-01-27 Ceramic wiring board and manufacturing method thereof

Publications (3)

Publication Number Publication Date
EP0230675A2 EP0230675A2 (en) 1987-08-05
EP0230675A3 true EP0230675A3 (en) 1990-04-25
EP0230675B1 EP0230675B1 (en) 1993-03-24

Family

ID=11843599

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86118173A Expired - Lifetime EP0230675B1 (en) 1986-01-27 1986-12-31 Ceramic wiring substrate and process for producing the same

Country Status (6)

Country Link
US (1) US4734233A (en)
EP (1) EP0230675B1 (en)
JP (1) JPH0632355B2 (en)
KR (1) KR900003151B1 (en)
CN (1) CN1005957B (en)
DE (1) DE3688130T2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0610927B2 (en) * 1985-04-05 1994-02-09 株式会社日立製作所 Ceramic substrate manufacturing method
US4835039A (en) * 1986-11-26 1989-05-30 Ceramics Process Systems Corporation Tungsten paste for co-sintering with pure alumina and method for producing same
DE3744124A1 (en) * 1987-12-24 1989-07-06 Thomson Brandt Gmbh CONNECTOR
US4894258A (en) * 1988-03-21 1990-01-16 Ag Communication Systems Corporation Chip resistor
JPH01264105A (en) * 1988-04-15 1989-10-20 Hitachi Ltd Mullite paste and wiring substrate using said paste
US5209874A (en) * 1989-04-26 1993-05-11 Shell Oil Company Liquid surface active compositions
US5215683A (en) * 1989-04-26 1993-06-01 Shell Oil Company Highly concentrated liquid surface active compositions containing alcohol ethoxylate and alcohol ethoxysulfate
US5139489A (en) * 1991-01-07 1992-08-18 Smiths Industries Medical Systems, Inc. Needle protection device
JPH06296084A (en) * 1993-02-12 1994-10-21 Ngk Spark Plug Co Ltd Thermal conductor of high conductivity, wiring board provided therewith and manufacture thereof
US5856235A (en) * 1995-04-12 1999-01-05 Northrop Grumman Corporation Process of vacuum annealing a thin film metallization on high purity alumina
JP3528610B2 (en) * 1998-07-09 2004-05-17 ウシオ電機株式会社 Ceramic discharge lamp

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB980975A (en) * 1962-09-17 1965-01-20 M O Valve Co Ltd Improvements in or relating to methods of forming metallized surfaces on ceramic bodies
DE1471415B2 (en) * 1962-12-07 1971-05-06 Siemens AG, 1000 Berlin u 8000 München PROCESS FOR THE PRODUCTION OF A METAL COATING ON A CERAMIC BODY
EP0131242A2 (en) * 1983-07-04 1985-01-16 Hitachi, Ltd. Multi-layer ceramic substrate and method for the production thereof
EP0132740A2 (en) * 1983-07-29 1985-02-13 International Business Machines Corporation Method of forming a dielectric substrate
EP0083834B1 (en) * 1981-12-09 1986-05-07 Ngk Insulators, Ltd. Metal ceramics composites and a method for producing said composites
EP0196670A2 (en) * 1985-04-05 1986-10-08 Hitachi, Ltd. Ceramic substrates for microelectronic circuits and process for producing same
EP0265231A2 (en) * 1986-10-21 1988-04-27 Ngk Insulators, Ltd. A metallizing paste and a process for metallizing ceramic articles by using such a metallizing paste

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3615763A (en) * 1969-06-04 1971-10-26 Gen Motors Corp High-alumina ceramic body and method of making same
US3857923A (en) * 1972-06-20 1974-12-31 Ibm Mullite package for integrated circuit devices
DE2727364A1 (en) * 1977-06-16 1979-01-04 Siemens Ag METHOD FOR MANUFACTURING CERAMIC SUBSTRATES
JPS5820160B2 (en) * 1978-06-17 1983-04-21 日本碍子株式会社 Ceramic body with metallized layer
US4313900A (en) * 1980-06-26 1982-02-02 International Business Machines Corp. Method of forming a ceramic article with a glassy surface
US4345955A (en) * 1980-10-28 1982-08-24 E. I. Du Pont De Nemours And Company Process for manufacturing multilayer ceramic chip carrier modules
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
US4510000A (en) * 1983-11-30 1985-04-09 International Business Machines Corporation Method for palladium activating molybdenum metallized features on a ceramic substrate
JPS60136294A (en) * 1983-12-23 1985-07-19 株式会社日立製作所 Ceramic multilayer wiring circuit board
JPS60221358A (en) * 1984-04-13 1985-11-06 日本碍子株式会社 Ceramic composition for electric insulator
US4521449A (en) * 1984-05-21 1985-06-04 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof
JPS60250686A (en) * 1984-05-25 1985-12-11 日本碍子株式会社 Methd of producing ceramic circuit board
US4632846A (en) * 1984-09-17 1986-12-30 Kyocera Corporation Process for preparation of glazed ceramic substrate and glazing composition used therefor
US4695504A (en) * 1985-06-21 1987-09-22 Matsushita Electric Industrial Co., Ltd. Thick film resistor composition
US4684446A (en) * 1985-09-26 1987-08-04 General Electric Company Secondary metallization by glass displacement in ceramic substrate
US4678683A (en) * 1985-12-13 1987-07-07 General Electric Company Process for cofiring structure comprised of ceramic substrate and refractory metal metallization

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB980975A (en) * 1962-09-17 1965-01-20 M O Valve Co Ltd Improvements in or relating to methods of forming metallized surfaces on ceramic bodies
DE1471415B2 (en) * 1962-12-07 1971-05-06 Siemens AG, 1000 Berlin u 8000 München PROCESS FOR THE PRODUCTION OF A METAL COATING ON A CERAMIC BODY
EP0083834B1 (en) * 1981-12-09 1986-05-07 Ngk Insulators, Ltd. Metal ceramics composites and a method for producing said composites
EP0131242A2 (en) * 1983-07-04 1985-01-16 Hitachi, Ltd. Multi-layer ceramic substrate and method for the production thereof
EP0132740A2 (en) * 1983-07-29 1985-02-13 International Business Machines Corporation Method of forming a dielectric substrate
EP0196670A2 (en) * 1985-04-05 1986-10-08 Hitachi, Ltd. Ceramic substrates for microelectronic circuits and process for producing same
EP0265231A2 (en) * 1986-10-21 1988-04-27 Ngk Insulators, Ltd. A metallizing paste and a process for metallizing ceramic articles by using such a metallizing paste

Also Published As

Publication number Publication date
KR870007644A (en) 1987-08-20
JPS62172784A (en) 1987-07-29
EP0230675B1 (en) 1993-03-24
CN1005957B (en) 1989-11-29
US4734233A (en) 1988-03-29
JPH0632355B2 (en) 1994-04-27
DE3688130D1 (en) 1993-04-29
CN87100572A (en) 1987-08-26
KR900003151B1 (en) 1990-05-09
EP0230675A2 (en) 1987-08-05
DE3688130T2 (en) 1993-09-16

Similar Documents

Publication Publication Date Title
GB2226707B (en) Ceramic substrate for hybrid microcircuits and method of making the same
EP0260857A3 (en) Multilayer wiring substrate
YU15686A (en) Process for producing ceramic complex structure
EP0243006A3 (en) Block-graft copolymers and process for producing the same
EP0131242A3 (en) Multi-layer ceramic substrate and method for the production thereof
EP0553859A3 (en) Semiconductor substrate and process for producing the same
GB2185437B (en) Ceramic coated laminate and process for producing the same
GB8712769D0 (en) Making substrates
EP0266210A3 (en) Electronic apparatus comprising a ceramic substrate electronic apparatus comprising a ceramic substrate
AU588700B2 (en) Semiconductor device and method for producing the same
EP0232182A3 (en) Process for producing bases
AU3017989A (en) Electroconductive integrated substrate and process for producing the same
EP0257657A3 (en) Substrate for high-frequency circuit and process for making the same
AU579612B2 (en) Semiconductor device and process for producing the same
EP0196670A3 (en) Ceramic substrates for microelectronic circuits and process for producing same
EP0233085A3 (en) Ceramic wiring substrate
GB8716571D0 (en) Producing electrode substrate
EP0230675A3 (en) Ceramic wiring substrate and process for producing the same
AU1346088A (en) Ceramic substrate with conductively-filled vias and method for producing
EP0270098A3 (en) Process for manufacturing ceramics for use in electronic components
HUT55727A (en) Process for producing ceramic shapes
GB8625262D0 (en) Producing lines on ceramic products
GB2227124B (en) Wiring board and process for producing the same
EP0260994A3 (en) Process for producing integrated circuit
GB8719148D0 (en) Composite substrate

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19861231

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): DE FR GB

17Q First examination report despatched

Effective date: 19910403

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REF Corresponds to:

Ref document number: 3688130

Country of ref document: DE

Date of ref document: 19930429

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20041125

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20041202

Year of fee payment: 19

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20041206

Year of fee payment: 19

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060701

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20051231

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060831

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20060831