EP0225111A2 - Herstellen von Trägerhorde für Scheiben und Produkt - Google Patents

Herstellen von Trägerhorde für Scheiben und Produkt Download PDF

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Publication number
EP0225111A2
EP0225111A2 EP86308991A EP86308991A EP0225111A2 EP 0225111 A2 EP0225111 A2 EP 0225111A2 EP 86308991 A EP86308991 A EP 86308991A EP 86308991 A EP86308991 A EP 86308991A EP 0225111 A2 EP0225111 A2 EP 0225111A2
Authority
EP
European Patent Office
Prior art keywords
end plate
hemicylinder
mounting
rail
tabs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP86308991A
Other languages
English (en)
French (fr)
Other versions
EP0225111A3 (de
Inventor
Richard A. Seilheimer
Ronald J. Macklin
Carl S. Brooks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anicon Inc
Original Assignee
Anicon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anicon Inc filed Critical Anicon Inc
Publication of EP0225111A2 publication Critical patent/EP0225111A2/de
Publication of EP0225111A3 publication Critical patent/EP0225111A3/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • C30B31/14—Substrate holders or susceptors
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/12—Substrate holders or susceptors

Definitions

  • This invention relates to the manufacture of quartz accessories used in the coating of semiconductor wafers in chemical vapor deposition devices.
  • this invention relates to the manufacture and assembly of precision quartz articles which meet the requirements of advanced CVD vapor deposition boats and similar complex quartz articles, and the products produced thereby.
  • Quartz glassware for CVD systems is manufactured by glass blowers, that is, glass craftsmen who have been trained in glass shaping and fabrication. Quartz glass, being pure, differs from most glass mixtures in melting characteristics. At very high temperatures at which it can be shaped or welded, it flows or "slumps", and each glass article thus has dimensions which differ from others made by an identical process. Dimensional tolerances required for CVD boats which are suitable for the vertical CVD reactors can be achieved only by close inspection and the rejection of a majority of boats, even when manufactured with the greatest level of skill and care.
  • the object of this invention is to provide a method for manufacturing and fabricating wafer boats from prefabricated pieces which are made with a higher level of original precision and have new shapes and configurations which facilitate their assembly and joining with simplified fixtures.
  • the high precision chemical vapor deposition wafer boats of this invention are constructed from upper and lower hemicylinders, upper and lower end closure plates and wafer mounting rails. At least one of the hemicylinder and end closure plates has at least two substantially rectangular end plate mounting slots in the edge thereof, and the other of the hemicylinder and end closure plate has at least two end plate mounting tabs with substantially rectangular cross-sections. Each end plate mounting tab is positioned to engage one of said end plate mounting slots, and the end plate mounting slots and tabs are preferably dimensioned to provide a spacing of less than 0.6 mm between opposing surfaces when the tabs and slots are engaged.
  • the lower wafer boat hemicylinder component has rail mounting holes in the walls thereof, and the wafer support rails have substantially rectangular rail mounting tabs positioned for engaging said mounting holes.
  • the rail mounting tabs and the rail mounting holes are preferably dimensioned to provide a spacing of less than 0.6 mm between opposing surfaces when the rail mounting tabs are placed in the rail mounting holes.
  • the rail mounting holes can be either circular or rectangular in cross-section.
  • kit of these components, the assembly of these components, and the welded assembly of the components are different aspects of this invention.
  • the process of this invention for manufacturing high precision wafer boats from quartz comprises the following steps.
  • Substantially rectangular end plate mounting slots are laser cut in either the ends of hemicylinders or the edges of the end plates.
  • Substantially rectangular rail mounting holes are laser cut in the wall of the lower hemicylinder.
  • Substantially rectangular end plate mounting tabs are laser cut on the edges of the hemicylinder or end plate, depending upon which component has the end plate mounting slots.
  • the hemicylinders, end closures and rails are assembled with the end plate mounting tabs engaging the end plate mounting slots and the rail mounting tabs engaging the rail mounting slots. Then the opposing edge surfaces of the end plate mounting slots and tabs and the rail mounting tabs and holes are welded.
  • the slots and holes are precision laser cut, and the distances between the opposing surfaces of the engaging tabs and slots and of the engaging tabs and holes are preferably less than 0.6 mm.
  • Figures 1-3 illustrate an example of a quartz wafer boat with which the manufacturing process and product of this invention are concerned.
  • Figure 1 is a side view of a cylinderical wafer boat
  • Figure 2 is a cross-sectional view taken along the line 2-2 in Figure 1.
  • the central axis of the cylindrical wafer boat 2 is substantially horizontal, and the wafers are supported therein in an upright orientation for coating.
  • the inner surfaces of the cylinder walls have the shape of and conform to the outer edges of the individual wafers being coated, being precisely spaced from the edges of the wafers.
  • the cylindrical wafer boat 2 comprises an upper hemicylindrical section 4 and a lower hemicylindrical section 6 having mutually engaging opposed surfaces which join in a horizontal plane approximately through the central axis of the cylinder 2.
  • the ends 8 and 10 of the upper hemicylinder 2 and ends 12 and 14 of the lower hemicylinder 6 are semicircular plates which are joined to the ends of the hemicylinders by welds as is described in greater detail hereinafter.
  • Leg projections 16 and 18 extend from the lower surface of hemicylinder 6 and are preferably integral therewith.
  • the lower surface 20 of the hemicylinder 6 can be a flat section to conform to and accommodate the flat lower indexing edge typically present on a semiconductor wafer.
  • gas flow passageways 22 and 26 are provided in the walls of the hemicylinders, and gas flow passageways 23 are provided in the end plates 8 and 10 joined to the upper hemicylinder 4.
  • the end plates 12 and 14 for the lower hemicylinder 6 have a recessed edge 27 which together with the end edge of the hemicylinder define a curved gas flow opening.
  • Bottom rails 32 and 34 and side rails 30 and 36 are mounted on and joined to the inner wall surface of the lower hemicylinder 6 by welds as described hereinafter. Together, the rails support the wafers in an upright orientation, precisely spaced with respect to the end closure plates and to adjacent wafers to provide controlled gas flow to the wafer surfaces and precise coating.
  • the support legs 17 and 18 are stabilized by horizontal element 28 welded thereto.
  • Figure 3 is a fragmentary cross-sectional view of a wafer boat with wafers loaded in a front-to-back position.
  • the end plate 80 is precisely spaced from the wafers 84 at a distance "a" which is set for the particular wafer diameter to be coated and the coating process, and is selected to permit the desired gas flow between the surface of the first wafer and the end plates.
  • the front surfaces 86 are the coating surfaces and are facing to the right in this representation.
  • the inlet passageways 88 can be adjacent the back surfaces 90 of the wafers 84, and are precisely positioned to provide gas diffusion through the hemicylinder walls to the wafers.
  • the precision and uniformity of the distance "b" between the outer edges of the wafers 84 and the inner surface 92 of the hemicylinder 82 is also critically important for coating uniformity.
  • the end plate 94 and inner surface 96 of the lower hemicylinder are correspondingly spaced (dimensions "a” and "b") from the outer edges of the wafers 84.
  • the relationship between the gas flow passageways in the upper and lower hemicylinders and the positions of the wafers can be selected to provide the optimum coating uniformity for each process.
  • the gas inlet passageways 98 in the lower hemicylinder wall 99 can be positioned adjacent to the back surfaces 90 of the wafers and at a maximum distance from the front wafer surfaces 86.
  • the wafers 84 rest in slots 100 in bottom rails 102 and are maintained in a predetermined wafer-to-wafer spacing by the slots 104 in the side rails 106.
  • the wafer-to-wafer spacing "c" corresponds to the distance "d" between slots 104. To maintain the accuracy of this spacing, precise location of the slots in the lower rails is critical.
  • FIG 4 is a top view of a lower hemicylinder wall of a wafer boat according to one embodiment of this invention
  • Figure 5 is a side view thereof.
  • the lower hemicylinder wall 110 has rows of gas flow openings 112 in the walls, drilled or cut with precise dimensions and locations.
  • Lower end plate mounting slot 114 is positioned along edge 116 of the hemicylinder 110
  • lower end plate mounting slot 118 is positioned along edge 120 of the hemicylinder 110.
  • Two sides of one upper end plate mounting slot are formed by adjoining edges 122 and 124 which intersect at a right angle adjacent one corner of edge 116, and two sides of a second opposite upper end plate mounting slot are formed by adjoining edges 126 and 128 which intersect at a right angle adjacent the opposite corner of edge 1.16.
  • Two sides of an opposite upper end plate mounting slot are formed by adjoining edges 130 and 132 which intersect at a right angle adjacent one corner of edge 120, and two sides of a second opposite upper end plate mounting slot are formed by adjoining edges 134 and 136 which intersect at a right angle adjacent the opposite corner of edge 120.
  • Rail mounting holes are provided in the hemicylinder wall 110.
  • the rows of bottom rail mounting holes 146 and 148 and the rows of side rail mounting holes 158 and 160 are substantially rectangular holes.
  • the term "rectangular”, as used herein, is defined to identify a hole configuration as having a rectangular cross-sectional shape comprising parallel, opposing edges and corners with right angles, and includes all holes meeting this definition including squares wherein adjacent edges have the same length and holes wherein adjacent edges have different lengths. Since the hemicylinder walls are circular arcs in cross-section, the shapes of the edges in planes perpendicular to the axis of the hemicylinder are arcs of a circle.
  • Positioning notches 164 and 165 are provided at the ends of the edge 116 and positioning notches 166 and 167 are provided at the ends of the edge 120 to receive corresponding positioning tabs in the upper hemicylinder. These notches are precision cut to precisely engage and index the hemicylinders in a precise relationship.
  • FIG 6 is a front view of an end closure plate for a lower hemicylinder of this invention.
  • the end closure plate 170 is precision cut from quartz plate. It has a top edge 172 which abuts a corresponding straight edge of an end plate for the upper hemicylinder element (shown in Figure 11).
  • Mounting tabs 174, 176 and 178 are precision cut to engage corresponding, respective mounting surfaces 122 and 124, slot 114 and surfaces 126 and 128 in edge 116 or mounting surfaces 130 and 132, slot 118 and mounting surfaces 134 and 136 in edge 120 of hemicylinder 110 in Figures 4 and 5.
  • Edges 180 and 182 are precision cut to precisely conform to and engage the inner surface of the hemicylinder 110.
  • Edges 184 and 186 are precision cut to maintain a distance from the inner surface of the hemicylinder 110 to provide an arcuate gas flow passageway such as the curved passageway shown in Figure 2 defined by edge 27 and the inner surface of the lower hemicylinder 6.
  • Figure 7 is a view of a wafer support side rail shaped according to this invention.
  • the slots 190 in the upper edge 192 of the side rail have initial angular surfaces 194 which intersect to form an angle to guide placement of the wafer and a precision notch 196 having parallel opposing surfaces which are dimensioned to set and maintain the wafer in a precise orientation and position.
  • the lower edge 198 is precision cut to conform to the inner surface of the lower hemicylinder 110 and has extending therefrom, a plurality of mounting tabs 204 which are precision cut to have a substantially rectangular cross-section to engage rail mounting holes 158 or 160 of the hemicylinder 110 ( Figures 4 and 5).
  • Figure 8 is a view of a wafer support bottom rail shaped according to this invention.
  • the slots 208 in the upper edge 210 of the bottom rail have angular surfaces 214 which intersect to form an angle to guide placement of the wafer and have a rounded bottom 216.
  • the rounded bottom 216 precisely positions the wafers, automatically compensating for the variable wafer edge cross-sectional shapes resulting from the wafer polishing process.
  • the lower edge 218 is precision cut to conform to the inner surface of the lower hemicylinder 110. Extending from the bottom edge 218 are a plurality of mounting tabs 214 which are precision cut to have a substantially rectangular cross-section to engage rail mounting holes 146 or 148 of the hemicylinder 110 ( Figures 4 and 5).
  • Figure 9 is a top view of an inverted upper hemicylinder wall and Figure 10 is a side view thereof.
  • the upper hemicylinder wall 230 has gas flow openings 232 in the walls, drilled or cut with precise dimensions and locations.
  • End plate mounting slots 234, 236 and 238 (slots 234 and 236 are hidden in Figure 9 by positioning tabs 256 and 258) are provided on edge 240.
  • End plate mounting slots 242, 244 and 246 are provided on the opposite edge 248 of hemicylinder 230.
  • Positioning tabs 256 and 258 are provided at the ends of the edge 240 and positioning tabs 260 and 262 are provided at the ends of the edge 248. These are precision cut and positioned to engage the corresponding positioning notches 164, 165, 166 and 167 shown in Figures 4 and 5, precisely positioning the respective positions of the engaging hemicylinders.
  • FIG 11 is a front view of an end closure plate for an upper hemicylinder of this invention.
  • the end closure plate 270 is precision cut from quartz plate. It has a bottom edge 272 which abuts a corresponding straight edge 172 of an end plate for the upper hemicylinder element (shown in Figure 6).
  • Mounting tabs 274, 276 and 278 are precision cut to engage corresponding, respective mounting slots 234, 236 and 238 in edge 240 and mounting slots 242, 244 and 246 in edge 248 of the upper hemicylinder ( Figures 9 and 10).
  • Edges 280 and 282 are precision cut to precisely conform to the inner surface of the hemicylinder 110.
  • Optional gas flow passageways 283 can be provided for boats used in processes requiring gas diffusion through the boat ends for optimum coating.
  • Figure 12 is a partial schematic view illustrating representative hemicylinder end plate mounting slot and end plate mounting tab assemblies before welding.
  • the requirements for precision for the illustrated joints are representative of all of the joints in the wafer boat assemblage.
  • End plate tab 176 and slot 114 are precision cut to provide a spacing between opposing walls "a" and "b" of preferably less than 0.6 mm and optimally less than 0.4 mm.
  • Figure 13 is a schematic view of a wafer support rail tab and rail mounting hole assembly according to the embodiment of the invention shown in Figures 4 , 5, 7 and 8 before welding.
  • Wafer supporting rail mounting tab 214 and the respective mounting hole in wall 220 are also precision cut to provide spacings between opposing walls "e" and "f" of preferably less than 0.6 mm and optimally less than 0.4 mm.
  • Figure 14 is a top view of a lower hemicylinder wall of another embodiment of a wafer boat according to this invention and Figure 15 is a side view of the lower hemicylinder wall shown in Figure 1 4 .
  • the edge of the end plate has mounting slots (described in greater detail hereinafter with respect to Figure 16), and the ends of the hemicylinder have mounting tabs dimensioned to engage the end plate mounting slots.
  • the lower hemicylinder wall 300 has rows of gas flow openings 302 in the walls, drilled or cut with precise dimensions and locations. End plate mounting tabs 304 are positioned along edge 306 of the hemicylinder 300, and end plate mounting tabs 308 are positioned along edge 310 of the hemicylinder 300.
  • Rows of substantially circular rail mounting holes 312, 314, 316 and 318 are provided in the hemicylinder wall 300.
  • Positioning notches 326 and 328 are positioned at the ends of the edge 322, and positioning notches 330 and 332 are positioned at the ends of the edge 324 to receive corresponding positioning tabs in the upper hemicylinder. These notches are precision cut to engage and index the hemicylinders in a precise relationship.
  • Figure 16 is a front view of an end closure plate suitable for the embodiment of the lower hemicylinder wall shown in Figure 14.
  • the end closure plate 340 is precision cut from quartz plate. It has a top edge 342 which abuts a corresponding straight edge of an end plate for the upper hemicylinder element (shown in Figure 11).
  • Mounting slots 344, 346 and 348 are precision cut to engage corresponding, respective mounting tabs 304 or 308 of the hemicylinder 300 shown in Figures 14 and 15.
  • Optional gas flow passageways 350 can be provided for use in processes where gas diffusion through end plate openings is required for optimum coating precision.
  • Edges 352 and 354 are precision cut to conform to and engage the inner surface of the hemicylinder 300.
  • the bottom edge 356 is flattened to conform to the flattened bottom of the hemicylinder surface, which in turn, conforms to the flat index edge of the semiconductor wafer.
  • FIG 17 is a schematic view of a wafer support rail tab and rail mounting hole assembly according to the embodiment of the invention with the lower hemicylinder shown in Figures 14 and 15 before welding.
  • the wafer supporting rail mounting tabs 220 are rectangular in cross-section, and the mounting holes 314 are circular in cross-section. Both the tab 220 and holes 314 are preferably precision laser-cut in the hemicylinder wall.
  • the distance between the corner edges of the tab 220 and the adjacent wall surface of the hole 314, "g" is preferably less than 0.6 mm and optimally less than 0.4 mn.
  • the round rail mounting holes are provided in the lower hemicylinder walls, presenting less risk of introducing stress cracks around the mounting holes during the welding operation.
  • the elements are joined by welding opposing surfaces of precision cut tab and slot, or tab and hole combinations, rather than the major edges of the components. Furthermore, the pieces are formed to exact tolerances, preferably.by laser cutting all curved and all tab, slot and hole joint elements. Laser cutting techniques permit cutting the components to tolerances of + 0.05 mm. With this precision, the distances between opposing surfaces of the tabs and slots and tabs and holes can be preferably maintained at less than 0.6 mn and optimally less than 0.4 mm.
  • the components are assembled and held in the assembled relationship during welding, and to the extent necessary, with a jig which stabilizes the pieces against movement and fixes the distances between all elements of each piece to the desired precision.
  • the joints are then welded from the exterior of the hemicylinders.
  • Conventional gas flames and quartz welding rods commonly used for quartz welding are suitable, but the gas flame is applied to only the small area of each set of opposed surfaces, quickly fusing the surfaces and filling spaces with quartz.
  • the area of glass fusion is restricted to a small area adjacent to the closely fitting pieces, and heating of the positioning jigs and physical distortion or change of the major elements or their relationship is minimized.
  • the wafer boat hemicylinders are annealed in an furnace until all stresses have been relieved.
  • the annealing temperature is sufficiently high to effect stress relief but is insufficient to allow permanent dimensional changes.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Laser Beam Processing (AREA)
EP86308991A 1985-11-18 1986-11-18 Herstellen von Trägerhorde für Scheiben und Produkt Withdrawn EP0225111A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79923385A 1985-11-18 1985-11-18
US799233 1985-11-18

Publications (2)

Publication Number Publication Date
EP0225111A2 true EP0225111A2 (de) 1987-06-10
EP0225111A3 EP0225111A3 (de) 1989-08-02

Family

ID=25175372

Family Applications (1)

Application Number Title Priority Date Filing Date
EP86308991A Withdrawn EP0225111A3 (de) 1985-11-18 1986-11-18 Herstellen von Trägerhorde für Scheiben und Produkt

Country Status (4)

Country Link
EP (1) EP0225111A3 (de)
JP (1) JPS62126629A (de)
KR (1) KR870005439A (de)
AU (1) AU6519986A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1046608C (zh) * 1992-01-29 1999-11-17 索尼公司 采用加权信号量化位分配进行数据压缩的装置和方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4582020A (en) * 1984-05-04 1986-04-15 Anicon, Inc. Chemical vapor deposition wafer boat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1046608C (zh) * 1992-01-29 1999-11-17 索尼公司 采用加权信号量化位分配进行数据压缩的装置和方法

Also Published As

Publication number Publication date
JPS62126629A (ja) 1987-06-08
AU6519986A (en) 1987-05-21
EP0225111A3 (de) 1989-08-02
KR870005439A (ko) 1987-06-08

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