EP0191785A1 - Method for fabricating a measuring probe intended to measure the temperature or the mass of a flowing medium - Google Patents
Method for fabricating a measuring probe intended to measure the temperature or the mass of a flowing mediumInfo
- Publication number
- EP0191785A1 EP0191785A1 EP85903654A EP85903654A EP0191785A1 EP 0191785 A1 EP0191785 A1 EP 0191785A1 EP 85903654 A EP85903654 A EP 85903654A EP 85903654 A EP85903654 A EP 85903654A EP 0191785 A1 EP0191785 A1 EP 0191785A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- measuring
- temperature
- carrier film
- recess
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000523 sample Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims description 27
- 239000013039 cover film Substances 0.000 claims description 7
- 230000001419 dependent effect Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 238000002485 combustion reaction Methods 0.000 claims 2
- 239000000446 fuel Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 230000008901 benefit Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
- G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
- G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
- G01F1/692—Thin-film arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49085—Thermally variable
Definitions
- Yerfaliren for producing a measuring probe for use in measuring the temperature or mass of a flowing medium.
- the invention relates to a method for producing a measuring probe according to the preamble of the main claim.
- a measuring probe is known from DE-OS 23 02 61.
- a temperature-dependent elek ⁇ tric resistance for a measuring probe is described-, which has a preferably from Gol 'd existing coating as a temperature-dependent measuring resistor.
- the shape of the resistor is made by masking on a thin plastic film.
- the film is fastened to a support body which has a recess spanned by the film in the region of the film opposite the resistance layer.
- the method according to the invention with the characterizing feature of claim 1 and claim 2 provides the advantage that the sensitive film lies over the entire surface of the substrate during the application of the metal layer and, if appropriate, the cover film and thus against damage caused by pressure and the like ⁇ same is better protected than in the known arrangement, in which the recess in the supporting body is made before the film is attached to it. Moreover, a measuring probe manufactured according to the proposed method is mechanically very stable, so that even when used in rapidly flowing media there are no deformations of the resistance layer which could result in undesired changes in resistance.
- FIG. 1 shows a section through a probe for measuring the temperature or mass of a flowing medium
- FIG. 2 shows a plan view of the measuring probe according to FIG. 1 with the cover film omitted.
- the probe illustrated in the Figures has a Sus ⁇ sheet 1 of heat resistant polymer, beispiels ⁇ example of polyimide, .with single or dual layer of fluoro-carbons and a cover sheet 2 of the same "material.
- the measuring probe has a supporting body 3, on the surface of which the film 1 is attached by welding or gluing.
- the support body 3 is a flat plate, which consists of a metallic material, preferably a CuBe alloy.
- the thickness of the plate is of the order of about 0.3 mm.
- the plate has a recess h in the form of a window-like, rectangular opening, which will be discussed in more detail below.
- the film 1 is metallized after its attachment to the supporting body 3 with a layer system 5, 6 made of resistance materials by vacuum coating over the entire surface.
- a group of temperature-dependent resistors 7, temperature-independent resistors 8 and conductor tracks 9 is then formed from this full-surface coating, as can be seen from FIG. 2, using a mask etching process, the temperature-independent resistors 8 being based on tantalum and the temperature-dependent resistors 7 being based on nickel can.
- a resistance comparison can also be carried out by removing 7 constituents from the resistors by cutting away material, in the case of the temperature-independent layer anodic oxidation or the like.
- the cover film 2 is then placed on and tightly and firmly connected to the carrier film 1, for example by welding and / or by a chemical reaction, the contact connection points 10 and likewise the connections 11 on the conductor tracks 9 being left free.
- the recess k is then produced on the supporting body 3 by means of a mask etching process. This creates a frame-like structure in the exemplary embodiment, which carries the measuring probe and gives it mechanical .. stability.
- the recess h extends over a region of the film 1 opposite the measuring resistors 7 S 8, which has the advantage that between the resistors and the support body, as the medium flow changes, table no more heat flow takes place, whereby the probe has a high response speed when changing the mass and / or temperature of the medium flow. With the recess k, a good thermal decoupling of the measuring resistors 7 5 8 against one another and against their mechanical holder is achieved.
- the recess k is formed in the support body 3 only when the measuring probe is finished. This means that the entire, uninterrupted surface of the support body 3 is initially available as a support for the carrier film 1, on which it can be supported during the manufacture of the sensor arrangement until it is finished and when the cover film 2 is applied. This effectively prevents damage to the resistors and the foils due to mechanical influences during the manufacturing process and also simplifies the manufacturing process as such.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Measuring Volume Flow (AREA)
Abstract
Selon le procédé pour la fabrication d'une sonde de mesure destinée à la mesure de la température ou de la masse d'un fluide en écoulement on réalise dans un support (3) un évidement (4) recouvert par une feuille (1) portant un système de couches (5, 6) constituées de matériaux résistifs, seulement après l'achèvement des résistances (7, 8) et pistes conductrices (9) formées du système de couches ainsi qu'éventuellement après avoir déposé sur la feuille portant le système de couches (1) une feuille de protection (2) de ces couches.According to the method for manufacturing a measurement probe intended for measuring the temperature or the mass of a flowing fluid, a recess (4) is covered in a support (3) covered by a sheet (1) carrying a system of layers (5, 6) made of resistive materials, only after the completion of the resistors (7, 8) and conductive tracks (9) formed of the layer system as well as possibly after having deposited on the sheet carrying the system of layers (1) a protective sheet (2) of these layers.
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3430075 | 1984-08-16 | ||
DE19843430075 DE3430075A1 (en) | 1984-08-16 | 1984-08-16 | METHOD FOR PRODUCING A MEASURING PROBE FOR USE IN MEASURING THE TEMPERATURE OR MASS OF A FLOWING MEDIUM |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0191785A1 true EP0191785A1 (en) | 1986-08-27 |
Family
ID=6243145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP85903654A Ceased EP0191785A1 (en) | 1984-08-16 | 1985-07-19 | Method for fabricating a measuring probe intended to measure the temperature or the mass of a flowing medium |
Country Status (5)
Country | Link |
---|---|
US (1) | US4708769A (en) |
EP (1) | EP0191785A1 (en) |
JP (1) | JPS61503049A (en) |
DE (1) | DE3430075A1 (en) |
WO (1) | WO1986001290A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2179748B (en) * | 1985-08-20 | 1989-09-06 | Sharp Kk | Thermal flow sensor |
DE3606851A1 (en) * | 1986-03-03 | 1987-09-10 | Vdo Schindling | ARRANGEMENT FOR MEASURING THE FLOW RATE |
DE3842399C2 (en) * | 1988-12-16 | 1997-07-31 | Fisher Rosemount Gmbh & Co Ges | Micro flow sensor for gases |
DE4036109C2 (en) * | 1989-11-17 | 1997-01-09 | Murata Manufacturing Co | Resistance temperature sensor |
FR2658915A1 (en) * | 1990-02-27 | 1991-08-30 | Bosch Gmbh Robert | Sensor for simultaneously measuring the compositions of gas mixtures and the speed of gases |
GB9026034D0 (en) * | 1990-11-29 | 1991-01-16 | Rolls Royce Plc | A fluid temperature measuring device |
TW375744B (en) * | 1996-12-10 | 1999-12-01 | Heraeus Electro Nite Int | Resistor having at least two coupled contact springs arranged on a ceramic base and process for the same |
DE19904419B4 (en) * | 1998-02-08 | 2008-06-26 | Paul Rüster & Co. Inhaber Uwe Nowak GmbH | Slot resistance thermometers |
EP0964230A3 (en) * | 1998-06-09 | 2000-01-26 | Heraeus Electro-Nite International N.V. | Electrical resistor with at least two contact fields on a ceramic substrate and method of making it |
EP0987529A1 (en) | 1998-09-14 | 2000-03-22 | Heraeus Electro-Nite International N.V. | Electrical resistance with at least two contact fields on a substrate with at least one recess, and process for manufacturing the same |
DE19934109C1 (en) * | 1999-07-21 | 2001-04-05 | Bosch Gmbh Robert | Temperature sensor and process for its manufacture |
DE10219011B4 (en) * | 2002-04-27 | 2004-07-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Temperature sensor for an application in parting lines |
GB0313703D0 (en) * | 2003-06-13 | 2003-07-16 | Ceramaspeed Ltd | Temperature sensor assembly for an electrical heating arrangement |
ATE367573T1 (en) † | 2004-02-24 | 2007-08-15 | Electrovac | TEMPERATURE PROBE |
DE102004034185B3 (en) * | 2004-07-15 | 2006-01-05 | Zitzmann, Heinrich, Dr. | Temperature sensor and method for its production |
TWI370708B (en) * | 2006-10-20 | 2012-08-11 | Ind Tech Res Inst | Architecture of complement of a mirrored design of a embedded planar resistor |
DE102012204817B4 (en) * | 2012-03-12 | 2020-09-10 | PGT Thermprozesstechnik GmbH | Temperature sensor |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3115423A (en) * | 1955-06-13 | 1963-12-24 | Ass Elect Ind Manchester Ltd | Manufacture of printed electrical circuits |
DE2352073A1 (en) * | 1973-10-17 | 1975-04-30 | Vdo Schindling | TEMPERATURE MEASURING OR SWITCHING DEVICE |
DE2507731C3 (en) * | 1975-02-22 | 1978-09-07 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Measuring resistor for resistance thermometer and process for its manufacture |
US4129848A (en) * | 1975-09-03 | 1978-12-12 | Raytheon Company | Platinum film resistor device |
US4134095A (en) * | 1977-12-05 | 1979-01-09 | The Bendix Corporation | Fast response temperature sensor |
JPS58204176A (en) * | 1982-05-24 | 1983-11-28 | Kangiyou Denki Kiki Kk | Chemical etching method |
DE3327389A1 (en) * | 1983-07-29 | 1985-02-07 | Siemens AG, 1000 Berlin und 8000 München | TEMPERATURE MEASURING PROBE |
US4481049A (en) * | 1984-03-02 | 1984-11-06 | At&T Bell Laboratories | Bilevel resist |
US4543153A (en) * | 1984-05-17 | 1985-09-24 | Psi Star | Process and apparatus for etching copper masked by a nickel-gold mask |
US4599136A (en) * | 1984-10-03 | 1986-07-08 | International Business Machines Corporation | Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials |
US4581099A (en) * | 1985-01-30 | 1986-04-08 | Canon Kabushiki Kaisha | Method for preparation of a photosensor |
US4595298A (en) * | 1985-05-01 | 1986-06-17 | The United States Of America As Represented By The Secretary Of The Air Force | Temperature detection system for use on film cooled turbine airfoils |
-
1984
- 1984-08-16 DE DE19843430075 patent/DE3430075A1/en active Granted
-
1985
- 1985-07-19 EP EP85903654A patent/EP0191785A1/en not_active Ceased
- 1985-07-19 JP JP60503284A patent/JPS61503049A/en active Pending
- 1985-07-19 US US06/852,808 patent/US4708769A/en not_active Expired - Fee Related
- 1985-07-19 WO PCT/DE1985/000247 patent/WO1986001290A1/en not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO8601290A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE3430075A1 (en) | 1986-02-27 |
JPS61503049A (en) | 1986-12-25 |
US4708769A (en) | 1987-11-24 |
DE3430075C2 (en) | 1992-01-02 |
WO1986001290A1 (en) | 1986-02-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19860315 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): CH DE FR GB IT LI NL |
|
17Q | First examination report despatched |
Effective date: 19880203 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 19890325 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: MOELKNER, THOMAS Inventor name: FRIEDRICH, HEINZ Inventor name: BURGER, KURT Inventor name: SCHOETTLE, PETER |