Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/02—Arrangements of circuit components or wiring on supporting structure
  • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/02—Arrangements of circuit components or wiring on supporting structure
  • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
  • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Definitions

• This invention relates, generally , to chip carrier sockets and , more particularly , to a chip carrier socket housing which facilitates zero insertion force for a chip carrier.
• the present invention teaches and as an object of the present invention a ZI F socket for chip carriers , comprising a chip carrier having conductive pads or areas, thereon , chip carrier contacts for providing electrical communication from the conductive pads or areas through the contacts , and a chip carrier socket housing having the chip carrier contacts disposed therein and being profiled to receive the chip carrier therein , characterized in that the walls of the housing are inwardly compressible towards the chip carrier so as to urge the chip carrier contacts into engagement with the conductive pads or areas contained on the chip carrier.
• FIGURE 1 is an exploded isometric view of the apparatus of the present invention
• FICU RE 2 is a cross-sectional view prior to chip carrier insertion
• FIGU RE 3 is a cross-sectional view showing the assembled invention
• FIGURE 4 is a cr ⁇ ss-sectro ⁇ ai view taken through a portion of Figure 1 .
• FIG. 1 there is shown an exploded isometric view of the present invention. Shown is a plastic retainer or lid 10 which cooperates with a chip carrier socket housing shown generally at 12 to retain the chip carrier 1 . in the cfiip carrier socket housing 12. Contacts shown generally at 16 reside in the housing and make electrical contact with conductive strips 34* which are contained on the printed circuit board 18.
• the contacts 16 in the preferred embodiment of the present invention are those described in U . S . Patent Application given Serial No . 584 ,274 entitled " Contact for Chip Carriers and Method of Inserting Same into a Housing” , filed February 27, 1984, and which is incorporated by reference herein .
• the retainer or lid 10 has a retainer latch mechanism 20 disposed on the outside and which is shown more clearly in Figures 2 and 1.
• the chip carrier 14 has conductive pads or areas at 22 disposed thereon which engage portions of the contacts 16 (shown more clearly in Figures 2 and 3 ) .
• the chip carrier socket housing 1 2 is preferably made from plastic and is comprised of movable socket walls 24 which are separated by slits 30 which are disposed adjacent each of the housing corners or corner portions 28.
• the movable socket walls 24 have contact spacing barriers 32 disposed on the inside thereof for separating , aligning and retaining each of the contacts 16.
• an X-shaped standoff Disposed on the floor of the chip carrier socket housing 12 is an X-shaped standoff which provides some rigidity to the entire housing structure 12 as well as vertically spacing the chip carrier 14 in the housing 1 2.
• Tabs 26 are disposed along the exterior portions of the movable socket walls 24 and resiliently engage the retainer latches 20 (shown more clearly in Figures 2 and 3) .
• Channels 51 are disposed alongside each of the movable walls 24 and extend through the bottom or base 13 of the socket housing 1 2. This thereby allows the movable walls 24 to pivot about the movable wall pivot portions 52 disposed adjacent each of the slits 30 and at each end of the movable socket walls 24- since the movable wall pivot portions 52 are the only means of interconnecting the housing corners 28 with the movable socket walls 24.
• FIG. 2 there is shown a cross-sectional view taken through a portion of the present invention prior to full assembly of the entire device.
• the printed circuit board 18 having conductive strips 34 thereon electrically interconnects with the contact shown generally at 16.
• the movable socket wall 24 has a contact retaining member 44 disposed therein which aids in resiliently holding the contact 16.
• the contact 16 has a knee portion 46 which engages the upper portion of the chip carrier conductive pads 22 as well as a contact pivot arm 48 and a front beam pivot elbow 50.
• the tabs 26 perform a cam-like function (as shown- ore clearly in Figure 3) and have- a- housing.
• the retainer or lid 10 is comprised of a retainer top portion 35 , a retainer sidewall 36 , and the retainer inclined plane portion and retainer latching or engaging portion 38 , 40 respectively , as previously mentioned .
• FIG. 3 there is shown a view similar to that of Figure 2 with the device of the present invention completely assembled .
• the chip carrier 14 is placed into the chip carrier socket housing 12 between the contacts 16.
• the retainer or lid 10 is placed over the chip carrier socket housing 12 and the chip carrier 14 and is urged downwards such that the retainer latching or engaging portion 40 begins to slide along the inclined surface of the tab 26.
• the movable socket walls 24 are urged inwards toward the chip carrier 14 with the movable socket walls 24 pivoting about the movable wall pivot portions 52.
• the knee portion 46 of the 5 contact 16 engages the conductive pads 22 1 the. contact pivot arm 48 and the front beam pivot elbow 50 of the contact 16 begin to flex while the rear beam portion 49 of the contact 16 also flexes as can be readily seen by comparing the movement of the rear beam portion 48 between Figures 2 and 3.
• the retainer or lid 10 the housing latching or engaging portion 42 fully engages the retainer latching or engaging portion 40 which thereby resiliently holds the lid 10 onto the housing 12.
• This therefore, causes the chip carrier 14 to be fully seated and rigidly held in the chip carrier socket housing 12 while
• FIG. 4 there is shown a cross-sectional view taken through a portion of Figure 1 showing the housing 1 2 prior to placement of the retainer or lid 10 as well as after placement of the retainer or lid 10 (shown in phantom) .
• the movable wall pivot portion 52 allows the movable socket wall 24 to be pivoted inward .
• the present invention teaches a device which is very inexpensive to manufacture, easy to utilize , accomplishes easy replacement as well as facilitating automatic insertion methods . Additionally , tight space requirements and high contact mating forces are also practiced .

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Connecting Device With Holders (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=24513406

Family Applications (1)

Country Status (6)

Families Citing this family (1)

Family Cites Families (6)

• 1985
  • 1985-05-31 WO PCT/US1985/001013 patent/WO1986000777A1/en not_active Application Discontinuation
  • 1985-05-31 BR BR8506809A patent/BR8506809A/pt not_active IP Right Cessation
  • 1985-05-31 JP JP60502408A patent/JPS61502648A/ja active Granted
  • 1985-05-31 EP EP85902906A patent/EP0185708A1/en not_active Ceased
  • 1985-05-31 KR KR1019860700128A patent/KR860700335A/ko not_active Application Discontinuation
  • 1985-07-01 ES ES1985296073U patent/ES296073Y/es not_active Expired

Non-Patent Citations (1)

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