EP0099944A1 - Method of manufacturing RF slip rings - Google Patents

Method of manufacturing RF slip rings Download PDF

Info

Publication number
EP0099944A1
EP0099944A1 EP82303877A EP82303877A EP0099944A1 EP 0099944 A1 EP0099944 A1 EP 0099944A1 EP 82303877 A EP82303877 A EP 82303877A EP 82303877 A EP82303877 A EP 82303877A EP 0099944 A1 EP0099944 A1 EP 0099944A1
Authority
EP
European Patent Office
Prior art keywords
ring
electro
plastics material
alkali
less plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP82303877A
Other languages
German (de)
French (fr)
Inventor
Ernest Henry Birch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IDM Electronics Ltd
Original Assignee
IDM Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IDM Electronics Ltd filed Critical IDM Electronics Ltd
Priority to EP82303877A priority Critical patent/EP0099944A1/en
Publication of EP0099944A1 publication Critical patent/EP0099944A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/10—Manufacture of slip-rings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions

Definitions

  • This invention relates to a method of manufacturing RF slip rings particularly of the co-axial type.
  • Such RF slip rings comprise an outer ring having a pair of parallel grooves formed on the peripheral surface thereof and provided with a noble metal coating extending within the grooves, and an inner core ring having a groove formed in the periphery thereof and also provided with a noble metal coating extending within the groove, sets of brushes engaging in the grooves in the outer and inner ring members.
  • an object of the present invention is to provide a method of manufacturing an RF slip ring having an outer ring of plastics material, wherein the plastics material is capable of receiving an electro-less plating which adheres to and is retained effectively on the plastics material.
  • an RF slip ring including the steps of forming an outer ring of plastics material consisting of an epoxy resin containing an alkali filler, e.g. calcium carbonate, machining the ring to expose particles of the alkali filler on at least the outer peripheral surface of the ring, immersing the plastics ring in an etchant containing acid, e.g. hydrochloric acid, such that a reaction occurs between the alkali filler and the acid etchant to cause the peripheral surface of the ring to become pitted, and subjecting the pitted surface of the ring to an electro-less plating step such that the plating keys to the pitted surface of the ring.
  • an etchant containing acid e.g. hydrochloric acid
  • the outer ring of the RF slip ring is formed in two halves each having a semi-circular recess and formed of an alkali-filled epoxy resin.
  • the filler is calcium carbonate ⁇ CaC0 3 ).
  • the peripheral surface of the outer ring is provided with a pair of parallel V-grooves, formed one in each half of the outer ring and the copper/gold coating is required to extend within the grooves.
  • the two halves of the outer ring are machined to expose particles of the calcium carbonate filler.
  • the two halves of the outer ring are then immersed in an etchant preferably comprising 10% hydrochloric acid (HC1) solution with 596 hydrogen peroxide (H 2 0 2 ) added to increase the efficiency.
  • HC1 hydrochloric acid
  • H 2 0 2 hydrogen peroxide
  • the result of the reaction is that a micro pitted surface is formed on the plastics material, the pitting of the surface providing an excellent keying for the electro-less plating material.
  • the two halves are subjected to an electro-less plating operation in which a layer of copper is deposited on the pitted surface, the copper keying to the plastics material by virtue of the micro pitted surface.
  • a layer of a noble metal, e.g. gold is deposited on the copper plating and is deposited on the inner surface of the outer ring, the exposed portion between the two halves of the ring, the outer peripheral surface and the V-shaped grooves formed in the peripheral surface.
  • a support bung is embedded in the plastics material of the outer ring and extends within the circular air space dielectric formed by the semi-circular recess of the two halves of the outer ring.
  • a support wire is carried by the support bung and contacts the base of the inner core ring which is of square cross section.
  • the inner core ring is of square cross section and provided with the copper/gold plating of the outer ring and a V-groove.
  • any suitable alkali filler material may be used provided the filler is capable of supporting a violent reaction with the acid of the etchant sufficient to effect micro pitting of the surface of the epoxy resin to provide for keying of the electro-less plating to the plastics material.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A method of manufacturing an RF slip ring consisting of an outer ring of epoxy resin plastics material wherein the epoxy resin includes a filler of alkali material, e.g. calcium carbonate such that when the plastics material is machined to expose the alkali particles and subsequently immersed in an etchant containing acid, e.g. hydrochloric acid, a violent reaction occurs between the alkali and the acid to cause micro-pitting of the surface of the plastics material thereby providing a keying surface for an electro-less plating e.g. copper to adhere to the surface and be effectively retained thereon, the electro-less plating being overlaid with a noble metal, e.g. gold.

Description

  • This invention relates to a method of manufacturing RF slip rings particularly of the co-axial type.
  • Such RF slip rings comprise an outer ring having a pair of parallel grooves formed on the peripheral surface thereof and provided with a noble metal coating extending within the grooves, and an inner core ring having a groove formed in the periphery thereof and also provided with a noble metal coating extending within the groove, sets of brushes engaging in the grooves in the outer and inner ring members.
  • In the past, it has been necessary to construct the whole of the outer ring of non-ferrous metal, but to reduce raw material costs and to eliminate machining of the non-ferrous metal, and to considerably reduce the weight of the outer ring, it would be advantageous to mould the outer ring of plastics material.
  • However in order to achieve such advantages, it is necessary to ensure that the plastics material can be plated satisfactorily, for instance with an electro-less plating of copper, and that the electro-less plating will adhere to and be retained on the plastics ring.
  • Thus, an object of the present invention is to provide a method of manufacturing an RF slip ring having an outer ring of plastics material, wherein the plastics material is capable of receiving an electro-less plating which adheres to and is retained effectively on the plastics material.
  • According to the present invention there is provided a method of manufacturing an RF slip ring including the steps of forming an outer ring of plastics material consisting of an epoxy resin containing an alkali filler, e.g. calcium carbonate, machining the ring to expose particles of the alkali filler on at least the outer peripheral surface of the ring, immersing the plastics ring in an etchant containing acid, e.g. hydrochloric acid, such that a reaction occurs between the alkali filler and the acid etchant to cause the peripheral surface of the ring to become pitted, and subjecting the pitted surface of the ring to an electro-less plating step such that the plating keys to the pitted surface of the ring.
  • In a preferred embodiment of the invention, the outer ring of the RF slip ring is formed in two halves each having a semi-circular recess and formed of an alkali-filled epoxy resin. Preferably the filler is calcium carbonate{CaC03).
  • It is required to coat the inner surface of the two halves of the outer ring and also the peripheral surface of the outer ring with an electro-less plating of copper overlaid with a noble metal, e.g. gold. The peripheral surface of the outer ring is provided with a pair of parallel V-grooves, formed one in each half of the outer ring and the copper/gold coating is required to extend within the grooves.
  • Accordingly, the two halves of the outer ring are machined to expose particles of the calcium carbonate filler. The two halves of the outer ring are then immersed in an etchant preferably comprising 10% hydrochloric acid (HC1) solution with 596 hydrogen peroxide (H202) added to increase the efficiency.
  • The immersion of the plastics material in the etchant causes the calcium carbonate and the hydrochloric acid to react violently, the reaction being as follows:-
    Figure imgb0001
  • The result of the reaction is that a micro pitted surface is formed on the plastics material, the pitting of the surface providing an excellent keying for the electro-less plating material.
  • Thus, after the pitting of the surface, the two halves are subjected to an electro-less plating operation in which a layer of copper is deposited on the pitted surface, the copper keying to the plastics material by virtue of the micro pitted surface. A layer of a noble metal, e.g. gold is deposited on the copper plating and is deposited on the inner surface of the outer ring, the exposed portion between the two halves of the ring, the outer peripheral surface and the V-shaped grooves formed in the peripheral surface.
  • Preferably a support bung is embedded in the plastics material of the outer ring and extends within the circular air space dielectric formed by the semi-circular recess of the two halves of the outer ring.
  • A support wire is carried by the support bung and contacts the base of the inner core ring which is of square cross section. The inner core ring is of square cross section and provided with the copper/gold plating of the outer ring and a V-groove.
  • Although reference has been made to calcium carbonate as the filler material of the epoxy resin, it will be appreciated that any suitable alkali filler material may be used provided the filler is capable of supporting a violent reaction with the acid of the etchant sufficient to effect micro pitting of the surface of the epoxy resin to provide for keying of the electro-less plating to the plastics material.

Claims (5)

1. A method of manufacturing an RF slip ring including the steps of forming an outer ring of plastics material consisting of an epoxy resin containing an alkali filler, e.g. calcium carbonate, machining the ring to expose particles of the alkali filler on at least the outer peripheral surface of the ring, immersing the plastics ring in an etchant containing acid, e.g. hydrochloric acid, such that a reaction occurs between the alkali filler and the acid etchant to cause the peripheral surface of the ring to become pitted, and subjecting the pitted surface of the ring to an electro-less plating step such that the plating keys to the pitted surface of the ring.
2. A method of manufacturing an RF slip ring as claimed in claim 1 wherein the alkali filler material is calcium carbonate and the etchant material includes hydrochloric acid to provide pitting of the surface of the plastics material in response to the following reaction:-
Figure imgb0002
3. A method as claimed in claim 1 or 2 wherein the electro-less plating material is copper.
4. A method as claimed in any preceding claim wherein the electro-less plating is overlaid with a noble metal, e.g. gold.
5. An RF slip ring including an outer ring of plastics material plated with an electro-less plating by the method claimed in claim 1.
EP82303877A 1982-07-22 1982-07-22 Method of manufacturing RF slip rings Withdrawn EP0099944A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP82303877A EP0099944A1 (en) 1982-07-22 1982-07-22 Method of manufacturing RF slip rings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP82303877A EP0099944A1 (en) 1982-07-22 1982-07-22 Method of manufacturing RF slip rings

Publications (1)

Publication Number Publication Date
EP0099944A1 true EP0099944A1 (en) 1984-02-08

Family

ID=8189723

Family Applications (1)

Application Number Title Priority Date Filing Date
EP82303877A Withdrawn EP0099944A1 (en) 1982-07-22 1982-07-22 Method of manufacturing RF slip rings

Country Status (1)

Country Link
EP (1) EP0099944A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100448139C (en) * 2006-07-19 2008-12-31 殷建伟 Processing technology for copper end collar
CN105121868A (en) * 2013-04-09 2015-12-02 格拉贝特股份有限公司 Device and method for forming an adhesive connection between an article and a support

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0034232A2 (en) * 1980-02-15 1981-08-26 I.D.M. Electronics Limited Improvements in and relating to a method of manufacturing slip rings and to slip rings produced thereby
EP0039248A1 (en) * 1980-04-30 1981-11-04 Polyplastics Co., Ltd. Method for surface treatment of polyacetal resins

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0034232A2 (en) * 1980-02-15 1981-08-26 I.D.M. Electronics Limited Improvements in and relating to a method of manufacturing slip rings and to slip rings produced thereby
EP0039248A1 (en) * 1980-04-30 1981-11-04 Polyplastics Co., Ltd. Method for surface treatment of polyacetal resins

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100448139C (en) * 2006-07-19 2008-12-31 殷建伟 Processing technology for copper end collar
CN105121868A (en) * 2013-04-09 2015-12-02 格拉贝特股份有限公司 Device and method for forming an adhesive connection between an article and a support

Similar Documents

Publication Publication Date Title
US4088544A (en) Composite and method for making thin copper foil
CA1338186C (en) Circuit board material and electroplating bath for the production thereof
CN106848538B (en) Shell manufacturing method and mobile terminal
US4023998A (en) Method for the production of through holes in a laminate
CN106816687B (en) Shell manufacturing method and mobile terminal
CN1044211A (en) Hollow jewellery objects and manufacture method thereof
US3219557A (en) Method of producing a rotary coupling
EP0099944A1 (en) Method of manufacturing RF slip rings
US3699018A (en) Method of electrodepositing coral copper on copper foil
JPH04234192A (en) Method and device for using permanent mandrel for manufacture of electric circuit
US2934479A (en) Process for masking printed circuits before plating
WO1982004072A1 (en) A method for chemically stripping platings including palladium and at least one of the metals copper and nickel and a bath intended to be used for the method
US6544584B1 (en) Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate
CN1378607A (en) Method for producing electrolytically coated cold rolled strip, preferably for use in production of battery sheaths, and battery sheath produced according to said method
CN1301130A (en) Binding treatment of copper sheet with improved binding strength and bottom cutting resistant
US3541083A (en) Electrolytic strip-marking roll
US3228861A (en) Electroplating method for producing watch dial indicia
JP3381598B2 (en) Manufacturing method of molded substrate
US3729388A (en) Method of preparing at least one conductive form
US3433719A (en) Plating process for printed circuit boards
JP3960655B2 (en) Electrolytic stripping solution for tin or tin alloy and electrolytic stripping method
JPH04130792A (en) Manufacture of circuit board
JPH01108798A (en) Manufacture of printed wiring board
ES269127U (en) Use of spherical packings for galvanic baths and process for the production of such packings and of anode cages.
SU1463411A1 (en) Method of producing shaped electrode-tool

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19820727

AK Designated contracting states

Designated state(s): CH DE FR GB LI SE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 19840808

RIN1 Information on inventor provided before grant (corrected)

Inventor name: BIRCH, ERNEST HENRY