EP0023357A1 - Control plate for a gas discharge display device and method of making such a control plate - Google Patents

Control plate for a gas discharge display device and method of making such a control plate Download PDF

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Publication number
EP0023357A1
EP0023357A1 EP80104435A EP80104435A EP0023357A1 EP 0023357 A1 EP0023357 A1 EP 0023357A1 EP 80104435 A EP80104435 A EP 80104435A EP 80104435 A EP80104435 A EP 80104435A EP 0023357 A1 EP0023357 A1 EP 0023357A1
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EP
European Patent Office
Prior art keywords
holes
control
plate
conductor tracks
carrier plate
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Granted
Application number
EP80104435A
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German (de)
French (fr)
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EP0023357B1 (en
Inventor
Manfred Dr.Phil. Kobale
Burkhard Littwin
Rolf Dr. Rer. Nat. Wengert
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Siemens AG
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Siemens AG
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Priority to AT80104435T priority Critical patent/ATE6712T1/en
Publication of EP0023357A1 publication Critical patent/EP0023357A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/38—Cold-cathode tubes
    • H01J17/48—Cold-cathode tubes with more than one cathode or anode, e.g. sequence-discharge tube, counting tube, dekatron
    • H01J17/49—Display panels, e.g. with crossed electrodes, e.g. making use of direct current
    • H01J17/498—Display panels, e.g. with crossed electrodes, e.g. making use of direct current with a gas discharge space and a post acceleration space for electrons

Definitions

  • the invention relates to a control plate for a gas discharge display device with a carrier plate made of electrically insulating material, which carries on one side as a row conductor and on the other side as a column conductor forming a matrix and each separately controllable metallic conductor tracks and together with these tracks in the crossing points of the matrix has continuous control holes.
  • Such a control plate is used in a gas discharge display device for matrix control of the individual pixels.
  • the control hole is released at the respective intersection of row conductor and column conductor.
  • electrons are transferred from the plasma of the gas discharge space behind the control plate into the one in front of the control plate Acceleration space pulled and accelerated towards the anode in this space.
  • a light spot is then formed on a phosphor layer located in front of the anode as an image of the controlled crossing point of the matrix.
  • Such a display device works on the principle of spatial separation of electron generation and electron acceleration (two-chamber principle) and is known for example from DE-OS 24 12 869 and DE-OS 26 15 721.
  • control plate The structure of a control plate is also described in these published documents. It consists of a carrier plate made of electrically insulating material, for example made of glass, with the conductor tracks (control electrode tracks) on both sides of the plate.
  • the matrix control plates are currently manufactured in such a way that the hole structures necessary for the passage of electrons are only etched into the glass after the conductor structures have been applied (on the front and back of the plate perpendicular to one another). For etching technology reasons, very thin glass plates must be used for very fine grid structures.
  • control openings into thick, metallized carrier plates made of electrically insulating material, e.g. by electron beam. or laser drilling has the disadvantage that there is no metallization in the holes and charging effects in the control holes prevent a sufficient control effect or the passage of wearers as a result of charging the hole walls is very limited.
  • the present invention has for its object to avoid these disadvantages and to provide a control plate with good mechanical stability and electrically separated row and column conductors of high geometric resolution.
  • a control plate of the type mentioned at the outset that the metallic conductor tracks extend into the control holes of the carrier plate in a defined manner, that the respective rows of holes are electrically connected to one another and that the column conductors and the row conductors are very high-impedance from one another (R ⁇ 100 M ⁇ ) or are completely separate.
  • the carrier plate is preferably made of glass or ceramic and has thicknesses between 0.3 and 2 mm.
  • a further improvement in the control properties is achieved in that the metallic conductor tracks of the column conductors fill almost the entire hole area of the associated control holes and that the metallic conductor tracks of the row conductors extend only slightly into the control holes assigned to them.
  • a line grid is exposed on masks on both sides of the board, perpendicular to one another.
  • the line structure is either selected exactly in the grid step to match the existing grid of holes and exposed in such a way that during the development process a row of holes continuous webs that are completely free of photoresist are created, or a line pattern is used that is considerably finer than the row or column grid of the perforated surface. Diffuse light always gets into the holes during exposure and any positive photoresist located there is then also removed. However, this method remains - if there is varnish in the holes - limited to the use of positive working photoresist. This limitation to "positive" is not necessary when using photoresist foils.
  • the use of the fine line pattern considerably reduces the adjustment effort required between the hole pattern and the conductor pattern.
  • the dimensioning of the conductor track grid ensures that neither two rows of holes are connected nor one row of holes remains without continuous contact. This applies equally to the front and back of the carrier plate.
  • the liberated by the development of photoresist metallic surfaces of both sides are, for example, reinforced with electroplated copper and / or nickel, to a thickness of a few / um.
  • the reinforcement also extends - in a weakened thickness - into the holes. This creates conductor tracks that are still connected to each other by the thin metal layer covered with photoresist.
  • conductor tracks remain on both sides, which are electrically separated from one another and are each plated through via the control holes.
  • the conductor tracks extending beyond the perforated surface of the carrier plate can be electrically contacted and controlled - front and back side of the plate separately.
  • control plate according to the invention has the significant advantage that the subsequent introduction of control openings in thick, metallized plates made of electrically insulating material, e.g. is avoided by electron beam or laser drilling.
  • the metallization in the holes prevents charging effects in the holes and thus achieves a sufficient control effect.
  • the passage of charge carriers through the control holes is no longer restricted due to the elimination of the charge on the hole walls.
  • the control plate shown in Fig. 1 consists of a carrier plate 4 made of electrically insulating material, preferably of photo-shaped glass.
  • a carrier plate 4 made of electrically insulating material, preferably of photo-shaped glass.
  • conductor tracks which form a matrix and which can be controlled separately in each case and which have continuous control holes 3 in the intersection points of the matrix.
  • the metallic conductor tracks 1, 2 extend into the control holes 3 of the carrier plate 4 so far that the respective rows of holes are electrically connected to one another and the column conductors 1 and the row conductors 2 are very high-impedance from one another (R ⁇ 100 M ⁇ ) or are completely separated from one another .
  • the metallic conductor tracks 1, 2 of the column conductors 1 fill almost the entire hole area of the associated control holes 3, while the row conductors 2 extend only slightly into the control holes 3 assigned to them in the carrier plate 4. With this embodiment, even better control properties are achieved.
  • FIG. 3 shows an arrangement for the vapor deposition on both sides of a 1 mm thick carrier plate 4 (80 mm ⁇ 80 mm), each with an adhesive layer (20 nm A1203) and a metal layer (300 nm Cu) at a substrate temperature of 170 ° C.
  • the maximum angle ⁇ of the vaporization beam 6 incident on the substrate is selected such that the distance 5 of the Cu layers vaporized into the holes 3 from both sides, one after the other or with two sources, is a minimum (place of greatest approximation) 0.1 mm .
  • the diameter of the circular holes 3 is 0.4 mm.
  • the substrate axis of rotation provided with the reference numeral 7 is perpendicular to the vapor-coated surface of the carrier plate 4.
  • the distance of the evaporator source from the substrate is more than five times the substrate diameter; the deviation of ⁇ across the substrate area is therefore less than 9%.
  • a mask with line pattern at 50 ⁇ m spacing serves as an exposure mask for both sides - offset by 90 °.
  • the line grid is adjusted on both sides optically via the holes 3 or the edges of the photo-shaped glass.
  • the exposed webs and the lacquer in the diffusely exposed holes 3 are removed in the developer bath.
  • the bare headers are galvanically reinforced with 3 ⁇ m copper and 1 ⁇ m nickel as corrosion protection for the copper.
  • the positive varnish is then removed by exposing the entire area to both sides and developer bath.
  • the conductor is separated by etching the exposed copper areas, for example with FeCl 3 solution.
  • a final cleaning is carried out with ultrasound in acetone and / or in aqueous acidic and basic solutions as well as water baths.
  • negative or positive resist films can also be used.
  • Fig. 4 shows a control plate manufactured according to a modified method.
  • a copper metallization is applied to the ceramic support plate 4, which sits on the surface of both sides and continuously in the holes 3.
  • Suitable methods are e.g. Vaporization at large angles ⁇ (see. Fig. 3) and currentless deposition processes.
  • the layer thickness on the surfaces of both sides is approximately 300 nm.
  • the structure is generated in the manner described in connection with FIG. 3 with a line mask.
  • the exposure times are chosen so short that the plugs 8 are not exposed to light and after double-sided exposure and development of the carrier plate 4, the wall height occupied by the plug edges is at least 100 ⁇ m, while the perforated walls are freed of photoresist from both sides up to the plugs .
  • the conductor tracks are built up by galvanic amplification according to the exemplary embodiment according to FIG. 3. Subsequently, intensive exposure is carried out on both sides, and the remaining photoresist is developed from the conductor tracks and the plugs 8 from the holes 3.
  • both the conductor tracks are separated from one another and the non-reinforced metal rings in the holes 3, which have been freed from the plugs 8, are etched away, as a result of which the metallizations on the two sides are separated from one another.
  • the final cleaning is carried out as in the embodiment described in FIG. 3.
  • a support plate 4 provided with a metallization 11 on both sides through the holes 3 is sprayed with positive-working photoresist 10 from one side (column side) and then sprayed with negative photoresist 12 on the other side.
  • the layer thicknesses are 5 ⁇ m .
  • the grid and dimensions of the carrier plate 4 correspond to the exemplary embodiment according to FIG. 3.
  • Two exposure masks are used. In the first exposure, the column side is exposed so that the individual rows of holes - and the interconnects connecting them - are exposed and at the same time the negative lacquer sprayed into the holes 3 from the row side is crosslinked at the opposite end of the holes 3. The line side is then exposed with the mask, so that the conductor tracks running in each case over the rows of holes and around the holes 3 are not exposed.
  • photoresist is available only as spacing lines of the conductor tracks and in the holes 3 only negative lacquer rings remain at the "line end" of the holes 3.
  • the exposed copper tracks via the holes 3 and the metallizations of the holes 3 connected with the column lines are galvanically reinforced.
  • the invention is not restricted to the exemplary embodiments shown.
  • photosensitive metal pastes e.g. can be applied over the entire surface by screen printing.
  • the layer protrude more or less deeply into the holes.
  • the exposure-peeling and annealing processes can then be carried out in the usual way.

Landscapes

  • Gas-Filled Discharge Tubes (AREA)
  • Physical Vapour Deposition (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A control plate for a gas discharge display device has a mechanically stable carrier plate of an electrically insulating material which has metallized column conductor tracks on one side and metallized row conductor tracks on an opposite side which in combination form a matrix of perpendicular rows and columns. The carrier plate has perforations extending through plate at points of intersection of the rows and columns. Each row and column is separately energizeable for selected transfer of electrons in the display device from one side of the plate to the other. The metallized tracks on each side extend a distance into the perforations so as to prevent charge accumulation within the perforations which would otherwise impair the control obtainable by the plate. The metallized portions of the perforations are separated by a ring of exposed carrier plate which is substantially nonconducting having a resistance of 100 megaohms or greater.

Description

Die Erfindung betrifft eine Steuerplatte für eine Gasentladungsanzeigevorrichtung mit einer Trägerplatte aus elektrisch isolierendem Material, die auf ihrer einen Seite als Zeilenleiter und auf ihrer anderen Seite als Spaltenleiter eine Matrix bildende und jeweils getrennt ansteuerbare metallische Leiterbahnen trägt und zusammen mit diesen Bahnen in den Kreuzungspunkten der Matrix durchgehende Steuerlöcher hat.The invention relates to a control plate for a gas discharge display device with a carrier plate made of electrically insulating material, which carries on one side as a row conductor and on the other side as a column conductor forming a matrix and each separately controllable metallic conductor tracks and together with these tracks in the crossing points of the matrix has continuous control holes.

Eine derartige Steuerplatte dient bei einer Gasentladungsanzeigevorrichtung zur Matrixansteuerung der einzelnen Bildpunkte. Durch Ansteuern einer Zeilenleiterbahn und einer Spaltenleiterbahn wird das Steuerloch an dem jeweiligen Kreuzungspunkt von Zeilenleiter und Spaltenleiter freigegeben. Dadurch werden Elektronen aus dem Plasma des hinter der Steuerplatte liegenden Gasentladungsraumes in den vor der Steuerplatte liegenden Beschleunigungsraum gezogen und in diesem Raum auf die Anode hin beschleunigt. Am Aufschlagsort entsteht dann auf einer der Anode vorgelagerten Leuchtstoffschicht, ein Lichtpunkt als Abbild des angesteuerten Kreuzungspunktes der Matrix. Mit entsprechender Matrixansteuerung nach zeitlichem Ablauf und Stärke lassen sich auf dem Leuchtschirm Zeichen und Bilder darstellen. Eine solche Anzeigevorrichtung arbeitet nach dem Prinzip der räumlichen Trennung von Elektronenerzeugung und Elektronenbeschleunigung (Zweikammerprinzip) und ist beispielsweise aus der DE-OS 24 12 869 und aus der DE-OS 26 15 721 bekannt.Such a control plate is used in a gas discharge display device for matrix control of the individual pixels. By driving a row conductor track and a column conductor track, the control hole is released at the respective intersection of row conductor and column conductor. As a result, electrons are transferred from the plasma of the gas discharge space behind the control plate into the one in front of the control plate Acceleration space pulled and accelerated towards the anode in this space. At the point of impact, a light spot is then formed on a phosphor layer located in front of the anode as an image of the controlled crossing point of the matrix. With appropriate matrix control according to the time sequence and strength, characters and pictures can be displayed on the fluorescent screen. Such a display device works on the principle of spatial separation of electron generation and electron acceleration (two-chamber principle) and is known for example from DE-OS 24 12 869 and DE-OS 26 15 721.

In diesen Offenlegungsschriften ist auch der Aufbau einer Steuerplatte beschrieben. Sie besteht aus einer Trägerplatte aus elektrisch isolierendem Material, beispielsweise aus Glas, mit den Leiterbahnen (Steuerelektrodenbahnen) auf beiden Plattenseiten.The structure of a control plate is also described in these published documents. It consists of a carrier plate made of electrically insulating material, for example made of glass, with the conductor tracks (control electrode tracks) on both sides of the plate.

Die Matrix-Steuerplatten werden derzeit so hergestellt, daß erst nach dem Aufbringen der Leiterstrukturen (auf der Vorder- und Rückseite der Platte senkrecht zueinander) die für den Elektronendurchlaß notwendigen Lochstrukturen in das Glas geätzt werden. Aus ätztechnisehen Gründen muß bei sehr feinen Rasterstrukturen von sehr dünnen Glasplatten ansgegangen werden.The matrix control plates are currently manufactured in such a way that the hole structures necessary for the passage of electrons are only etched into the glass after the conductor structures have been applied (on the front and back of the plate perpendicular to one another). For etching technology reasons, very thin glass plates must be used for very fine grid structures.

Das nachträgliche Einbringen von Steueröffnungen in fertig metallisierte dicke Trägerplatten aus elektrisch isolierendem Material, z.B. durch Elektronenstrahl- . oder Laserbohren hat den Nachteil, daß in den Löchern keine Metallisierung ist und Aufladungseffekte in den Steuerlöchern eine ausreichende Steuerwirkung verhindern bzw. ein Durchtritt von hadungsträgern infolge Aufladung der Lochwände sehr eingeschränkt wird.The subsequent introduction of control openings into thick, metallized carrier plates made of electrically insulating material, e.g. by electron beam. or laser drilling has the disadvantage that there is no metallization in the holes and charging effects in the control holes prevent a sufficient control effect or the passage of wearers as a result of charging the hole walls is very limited.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, diese Nachteile zu vermeiden und eine Steuerplatte mit guter mechanischer Stabilität sowie elektrisch voneinander getrennten Zeilen- und Spaltenleitern hoher geometrischer Auflösung zu schaffen. Zur Lösung dieser Aufgabe wird bei einer Steuerplatte der eingangs genannten Art erfindungsgemäß vorgeschlagen, daß die metallischen Leiterbahnen in die Steuerlöcher der Trägerplatte definiert hineinreichen, daß die jeweiligen Lochreihen miteinander elektrisch verbunden sind und daß die Spaltenleiter und die Zeilenleiter voneinander sehr hochohmig (R ≥ 100 MΩ ) oder völlig voneinander getrennt sind. Die Trägerplatte besteht dabei vorzugsweise aus Glas oder Keramik und weist Dicken zwischen 0,3 und 2 mm auf.The present invention has for its object to avoid these disadvantages and to provide a control plate with good mechanical stability and electrically separated row and column conductors of high geometric resolution. To solve this problem, it is proposed according to the invention in a control plate of the type mentioned at the outset that the metallic conductor tracks extend into the control holes of the carrier plate in a defined manner, that the respective rows of holes are electrically connected to one another and that the column conductors and the row conductors are very high-impedance from one another (R ≥ 100 MΩ ) or are completely separate. The carrier plate is preferably made of glass or ceramic and has thicknesses between 0.3 and 2 mm.

Eine weitere Verbesserung der Steuereigenschaften wird dadurch erreicht, daß die metallischen Leiterbahnen der Spaltenleiter fast den ganzen Lochbereich der zugeordneten Steuerlöcher ausfüllen und daß die metallischen Leiterbahnen der Zeilenleiter nur geringfügig in die diesen zugeordneten Steuerlöcher reichen.A further improvement in the control properties is achieved in that the metallic conductor tracks of the column conductors fill almost the entire hole area of the associated control holes and that the metallic conductor tracks of the row conductors extend only slightly into the control holes assigned to them.

Eine erfindungsgemäße Steuerplatte wird vorzugsweise nach folgendem Verfahren hergestellt:

  • Als Lochplatten dienen glasige oder keramische Platten oder Platten eines anderen isolierenden Materials,zweckmäßig mit Dicken zwischen 0,3 und 2 mm. Die Platten sind entweder plan oder in einer Richtung gekrümmt und Tragen das für die Durchsteuerung elektrischer Ladungsträger nötige Lochraster hoher Auflösung (Lochzahl/cm > 100) mit beliebiger Form und Größe von Raster und Löchern. Die stabile hochplatte (Trägerplatte) wird beidseitig ganzflächig metallisiert, und zwar so, daß die beiden Metallisierungen zumindest teilweise in die Löcher hineinreichen, ein Kontakt der beiden Seiten über die Löcher aber vermieden wird oder der Kontakt, über sehr dünne Schichten, sehr hochohmig ist (R > 100 MΩ ). Die Metallisierung erfolgt z.B. durch Bedampfung mit Kupfer (ca. 300 nm), wobei als Haftschicht z.B. Aluminiumoxid oder Titan (ca. 20 nm) dient und zur Erzielung hoher Haftfestigkeiten eine Substratheizung über 130 °C und/oder ein Beglimmen erfolgt. Beide Seiten werden unter einem schrägen Winkel und gleichzeitiger Substratdrehung um eine Achse senkrecht zur Substratoberfläche bedampft, so daß in den Löchern der Trägerplatte die geforderten elektrischen Trenneigenschaften erreicht werden. Die Metallisierung kann auch so erfolgen, daß beide Seiten zusammenhängen. Die Trennung in den Steuerlöchern erfolgt dann nachträglich. Nach dem beidseitigen Metallisieren der Trägerplatte werden beide Metalloberflächen mit Fotolack beschichtet. Es spielt keine Rolle, ob Fotolack in die Löcher gelangt oder nicht (Sprühen, Rollercoating, Folientechnik). In den meisten Fällen wird positiv arbeitender (bei Belichtung löslicher) Fotolack aufgesprüht; aber auch die Verwendung von Negativ-Lack ist möglich.
A control plate according to the invention is preferably produced using the following method:
  • Glass or ceramic plates or plates of another insulating material are used as perforated plates, expediently with thicknesses between 0.3 and 2 mm. The plates are either flat or curved in one direction and carry the high resolution hole pattern required for controlling electrical charge carriers (number of holes / cm> 100) with any shape and size of grid and holes. The stable high plate (carrier plate) is metallized on both sides over the entire surface, in such a way that the two metallizations extend at least partially into the holes, but contact between the two sides via the holes is avoided or contact, via very thin layers, is very high-resistance ( R> 100 MΩ). The metallization is carried out, for example, by vapor deposition with copper (approx. 300 nm), with aluminum oxide or titanium (approx. 20 nm) serving as the adhesive layer and substrate heating above 130 ° C. and / or gluing to achieve high adhesive strengths. Both sides are vaporized at an oblique angle and simultaneous substrate rotation about an axis perpendicular to the substrate surface, so that the required electrical separation properties are achieved in the holes in the carrier plate. The metallization can also be done in such a way that both sides are connected. The separation in the control holes is then done subsequently. After metallizing the carrier plate on both sides, both metal surfaces are coated with photoresist. It does not matter whether photoresist gets into the holes or not (spraying, roller coating, film technology). In most cases, positive working (soluble when exposed) photoresist is sprayed on; but the use of negative lacquer is also possible.

Zur Erzeugung der Leiterbahn-Struktur wird jeweils auf beiden Seiten der Platte, zueinander senkrecht stehend, ein Linien-Raster über Masken aufbelichtet. Die Linien-Struktur wird entweder im Rasterschritt genau passend zum vorhandenen Lochraster gewählt und so aufbelichtet, daß bei der Entwicklung jeweils über eine Lochreihe ver-laufende, durchgehend von Fotolack befreite Bahnen entstehen, oder es wird ein Strichmuster verwendet, das erheblich feiner ist als das Zeilen- bzw. Spalten-Raster der gelochten Fläche. Damit gelangt in die Löcher beim Belichten immer diffuses Licht und eventuell dort befindlicher positiv arbeitender Fotolack wird anschließend mit abgelöst. Diese Methode bleibt jedoch - wenn sich in den Löchern Lack befindet - auf die Verwendung positiv arbeitenden Fotolackes beschränkt. Bei Verwendung von Fotoresist-Folien ist diese Beschränkung auf "positiv" nicht nötig. Die Verwendung des feinen Strichmusters vermindert den nötigen Justieraufwand zwischen Lochraster und Leitungsbahnmuster erheblich. In jedem Fall wird durch die Bemessung des Leitungsbahnrasters sichergestellt, daß weder zwei Lochreihen zusammenhängen noch eine Lochreihe ohne durchgehenden Kontakt bleibt. Das gilt gleichermaßen für Vorder- und Rückseite der Trägerplatte. Die durch die Entwicklung von Fotolack befreiten metallischen Oberflächen beider Seiten werden, z.B. galvanisch mit Cu und/oder Nickel, bis zu einer Dicke von einigen /um verstärkt. Die Verstärkung reicht auch - in abgeschwächter Dicke - in die Löcher hinein. Es entstehen Leiterbahnen, die noch durch die Fotolack-bedeckte dünne Metallschicht miteinander verbunden sind..Nach Entfernung des Fotolackes und Abätzung der dünnen Metallschicht bleiben auf beiden Seiten Leiterbahnen stehen, die voneinander elektrisch getrennt sind und jeweils über die Steuerlöcher durchkontaktiert sind. Die über die Lochfläche der Trägerplatte hinausreichenden Leiterbahnen können - Vorder- und Bückseite der Platte getrennt - elektrisch kontaktiert und gesteuert werden.To create the conductor track structure, a line grid is exposed on masks on both sides of the board, perpendicular to one another. The line structure is either selected exactly in the grid step to match the existing grid of holes and exposed in such a way that during the development process a row of holes continuous webs that are completely free of photoresist are created, or a line pattern is used that is considerably finer than the row or column grid of the perforated surface. Diffuse light always gets into the holes during exposure and any positive photoresist located there is then also removed. However, this method remains - if there is varnish in the holes - limited to the use of positive working photoresist. This limitation to "positive" is not necessary when using photoresist foils. The use of the fine line pattern considerably reduces the adjustment effort required between the hole pattern and the conductor pattern. In any case, the dimensioning of the conductor track grid ensures that neither two rows of holes are connected nor one row of holes remains without continuous contact. This applies equally to the front and back of the carrier plate. The liberated by the development of photoresist metallic surfaces of both sides are, for example, reinforced with electroplated copper and / or nickel, to a thickness of a few / um. The reinforcement also extends - in a weakened thickness - into the holes. This creates conductor tracks that are still connected to each other by the thin metal layer covered with photoresist. After removing the photoresist and etching off the thin metal layer, conductor tracks remain on both sides, which are electrically separated from one another and are each plated through via the control holes. The conductor tracks extending beyond the perforated surface of the carrier plate can be electrically contacted and controlled - front and back side of the plate separately.

Die erfindungsgemäße Steuerplatte hat den wesentlichen Vorteil, daß das nachträgliche Einbringen von Steueröffnungen in fertig metallisierte dicke Platten aus elektrisch isolierendem Material, z.B. durch Elektronenstrahl- oder Laser-Bohren vermieden wird. Durch die Metallisierung in den Löchern werden Aufladungseffekte in den Löchern vermieden und damit eine ausreichende Steuerwirkung erzielt. Darüberhinaus ist der Durchtritt von Ladungsträgern durch die Steuerlöcher aufgrund der Beseitigung der Aufladung der Lochwände nicht mehr beschränkt.The control plate according to the invention has the significant advantage that the subsequent introduction of control openings in thick, metallized plates made of electrically insulating material, e.g. is avoided by electron beam or laser drilling. The metallization in the holes prevents charging effects in the holes and thus achieves a sufficient control effect. In addition, the passage of charge carriers through the control holes is no longer restricted due to the elimination of the charge on the hole walls.

Weitere Einzelheiten der Erfindung sollen an Hand von in den Figuren der Zeichnung dargestellten Ausführungsbeispielen näher erläntert werden. Dabei sind lediglich Schnitte durch eine Steuerplatte dargestellt. Zum Verständnis ihrer Funktion für die Gasentladungsanzeigevorrichtung sei auf die eingangs genannten deutschen Offenlegungsschriften verwiesen.Further details of the invention will be explained in more detail with reference to exemplary embodiments shown in the figures of the drawing. Only sections through a control plate are shown. For an understanding of their function for the gas discharge display device, reference is made to the aforementioned German published documents.

In den Figuren sind einander entsprechende Teile mit den gleichen .Bezugszeichen versehen.Corresponding parts in the figures are provided with the same reference numerals.

Es zeigen:

  • Fig. 1 und 2 einen Schnitt durch eine Steuerlochreihe einer schematisch dargestellten Steuerplatte gemäß der Erfindung,
  • Fig. 3 ein Ausführungsbeispiel für die Bedampfung der Steuerplatte,
  • Fig. 4 die Fotolackfüllung bei einem Herstellungsverfahren der Steuerplatte und
  • Fig. 5 schematisch im Schnitt ein weiteres Ausführungsbeispiel einer erfindungsgemäßen Steuerplatte beim Herstellungsprozeß.
Show it:
  • 1 and 2 is a section through a row of control holes of a schematically illustrated control plate according to the invention,
  • 3 shows an embodiment for the vapor deposition of the control plate,
  • Fig. 4, the photoresist filling in a manufacturing process of the control plate and
  • Fig. 5 shows schematically in section a further embodiment of a control plate according to the invention in the manufacturing process.

Die in Fig. 1 dargestellte Steuerplatte besteht aus einer Trägerplatte 4 aus elektrisch isolierendem Material, vorzugsweise aus Fotoformglas. Auf einer Seite der Trägerplatte 4 sind als Zeilenleiter 2 und auf der anderen Seite als Spaltenleiter 1 eine Matrix bildende und jeweils getrennt aussteuerbare Leiterbahnen aufgebracht, die in den Kreuzungspunkten der Matrix durchgehende Steuerlöcher 3 haben. Die metallischen Leiterbahnen 1, 2 reichen in die Steuerlöcher 3 der Trägerplatte 4 definiert so weit hinein, daß die jeweiligen Lochreihen miteinander elektrisch verbunden sind und die Spaltenleiter 1 und die Zeilenleiter 2 voneinander sehr hochohmig (R ≥ 100 M Ω) oder völlig voneinander getrennt sind.The control plate shown in Fig. 1 consists of a carrier plate 4 made of electrically insulating material, preferably of photo-shaped glass. On one side of the carrier plate 4, as a row conductor 2 and on the other side as a column conductor 1, there are applied conductor tracks which form a matrix and which can be controlled separately in each case and which have continuous control holes 3 in the intersection points of the matrix. The metallic conductor tracks 1, 2 extend into the control holes 3 of the carrier plate 4 so far that the respective rows of holes are electrically connected to one another and the column conductors 1 and the row conductors 2 are very high-impedance from one another (R Ω 100 M Ω) or are completely separated from one another .

Bei dem in Fig. 2 dargestellten Ausfuhrungsbeispiel füllen die metallischen Leiterbahnen 1, 2 der Spaltenleiter 1 fast den ganzen Lochbereich der zugeordneten Steuerlöcher 3 aus, während die Zeilenleiter 2 nur geringfügig in die diesen zugeordneten Steuerlöcher 3 in der Trägerplatte 4 hineinreichen. Mit dieser Ansführungsform werden noch bessere Steuereigenschaften erzielt.In the exemplary embodiment shown in FIG. 2, the metallic conductor tracks 1, 2 of the column conductors 1 fill almost the entire hole area of the associated control holes 3, while the row conductors 2 extend only slightly into the control holes 3 assigned to them in the carrier plate 4. With this embodiment, even better control properties are achieved.

Fig. 3 zeigt eine Anordnung für die beidseitige Bedampfung einer 1 mm dicken Trägerplatte 4 (80 mm x 80 mm) mit je einer Haftschicht (20 nm A1203) und einer Metallschicht (300 nm Cu) bei 170 °C Substrattemperatur. Der maximale Winkel α des auf das Substrat einfallenden Bedampfungsstrahles 6 ist so gewählt, daß der Abstand 5 der in die Löcher 3 von beiden Seiten - nacheinander oder mit zwei Quellen - gedampften Cu-Schichten minimal (Stelle der größten Annäherung) 0,1 mm beträgt. Der Durchmesser der kreisrund ausgebildeten Löcher 3 beträgt 0,4 mm. Die mit dem Bezugszeichen 7 versehene Substrat-Drehachse steht senkrecht zur bedampften Oberfläche der Trägerplatte 4. Der Abstand der Verdampferquelle vom Substrat beträgt mehr als das fünffache des Substratdorcbmessers; damit liegt die Abweichung von α über die Substratfläche unter 9%.3 shows an arrangement for the vapor deposition on both sides of a 1 mm thick carrier plate 4 (80 mm × 80 mm), each with an adhesive layer (20 nm A1203) and a metal layer (300 nm Cu) at a substrate temperature of 170 ° C. The maximum angle α of the vaporization beam 6 incident on the substrate is selected such that the distance 5 of the Cu layers vaporized into the holes 3 from both sides, one after the other or with two sources, is a minimum (place of greatest approximation) 0.1 mm . The The diameter of the circular holes 3 is 0.4 mm. The substrate axis of rotation provided with the reference numeral 7 is perpendicular to the vapor-coated surface of the carrier plate 4. The distance of the evaporator source from the substrate is more than five times the substrate diameter; the deviation of α across the substrate area is therefore less than 9%.

Nach der Bedampfung wird beidseitig positiv arbeitender Fotolack in einer Dicke von ca. 5 µm auf die Oberfläche aufgesprüht; die Löcher 3 werden mitbesprüht., sind aber dünner mit Fotolack belegt.After vapor deposition, positive-working photoresist with a thickness of approx. 5 µm is sprayed onto the surface; the holes 3 are also sprayed, but are thinner with photoresist.

Eine Maske mit Linienmuster im 50 µm-Abstand dient für beide Seiten - 90° versetzt - als Belichtungsmaske. Die beidseitige Justierung des Linienrasters erfolgt optisch über die Löcher 3 oder die Kanten des Fotoformglases. Die belichteten Bahnen und der Lack in den diffus belichteten Löchern 3 werden im Entwicklerbad abgelöst.A mask with line pattern at 50 µm spacing serves as an exposure mask for both sides - offset by 90 °. The line grid is adjusted on both sides optically via the holes 3 or the edges of the photo-shaped glass. The exposed webs and the lacquer in the diffusely exposed holes 3 are removed in the developer bath.

Die blanken Kopferstellen werden galvanisch mit 3 µm Kupfer und 1 µm Nickel als Korrosionsschutz für das Kupfer verstärkt. Der Positivlack wird anschließend durch nochmaliges ganzflächiges beidseitiges Belichten und Entwicklerbad entfernt. Die Leiterbahntrennung erfolgt durch Abätzen der freigelegten Kupferflächen z.B. mit FeCl3-Lösung.The bare headers are galvanically reinforced with 3 µm copper and 1 µm nickel as corrosion protection for the copper. The positive varnish is then removed by exposing the entire area to both sides and developer bath. The conductor is separated by etching the exposed copper areas, for example with FeCl 3 solution.

Eine AbschluBreinigung wird mit Ultraschall in Aceton und/oder in wässrigen sauren und basischen Lösungen sowie Wasser-Bädern durchgeführt.A final cleaning is carried out with ultrasound in acetone and / or in aqueous acidic and basic solutions as well as water baths.

Außer mit kreisrund ausgebildeten Löchern 3 ist die Durchführung mit elliptischen, quadratischen und rechteckigen Löchern 3 ebenso möglich. Zur Berechnung des maximalen Bedampfungswinkels α wird dann die Lochdiagonale herangezogen.In addition to circular holes 3, the implementation with elliptical, square and rectangular holes 3 is also possible. The hole diagonal is then used to calculate the maximum vaporization angle α.

An Stelle von gesprühten Fotolackschichten kann auch mit negativ oder positiv arbeitenden Resist-Folien gearbeitet werden.Instead of sprayed photoresist layers, negative or positive resist films can also be used.

Fig. 4 zeigt eine nach einem abgewandelten Verfahren hergestellte Steuerplatte. Auf die aus Keramik bestehende Trägerplatte 4 wird eine Kupfer-Metallisierung aufgebracht, die auf der Oberfläche beider Seiten und durchgehend in den Löchern 3 sitzt. Als Verfahren eignen sich z.B. Bedampfungen unter großen Winkeln α (she. Fig. 3) und stromlose Abscheidsprozesse. Die Schichtdicke auf den Oberflächen beider Seiten beträgt etwa 300 nm.Fig. 4 shows a control plate manufactured according to a modified method. A copper metallization is applied to the ceramic support plate 4, which sits on the surface of both sides and continuously in the holes 3. Suitable methods are e.g. Vaporization at large angles α (see. Fig. 3) and currentless deposition processes. The layer thickness on the surfaces of both sides is approximately 300 nm.

Es wird von einer Seite sehr naß Positiv-Fotolack aufgesprüht, der sich aufgrund der Kapillarkräfte zum großen Teil in die Löcher 3 bewegt und an der Oberfläche - in noch flüssigem Zustand - entfernt wird (z.B. Gummikante). Die Sprührichtung ist durch Pfeile 9 angedeutet. Nach waagrechter Trocknung der Trägerplatte 4 bildet sich in den Löchern 3 eine Pfropfenstruktur 8. Die Dicke der Pfropfen 8 beträgt in der Mitte minimal ca. 100/um, maximal ca. 300 µm. Anschließend wird beidseitig 5 µm dick Positiv-Fotolack aufgesprüht.It is sprayed on from one side very wet positive photoresist, which largely moves into the holes 3 due to the capillary forces and is removed on the surface - while still liquid (eg rubber edge). The spray direction is indicated by arrows 9. By horizontal drying of the support plate 4, a plug structure is formed in the holes 3 8. The thickness of the plug 8 is in the middle of minimally about 100 / um, a maximum of about 300 microns. Then 5 µm thick positive photoresist is sprayed on both sides.

Die Strukturerzeugung erfolgt in der im Zusammenhang mit Fig. 3 beschriebenen Weise mit einer Linien-Maske. Die Belichtungszeiten werden so kurz gewählt, daß die Pfropfen 8 nicht durchbelichtet werden und nach beidseitiger Belichtung und Entwicklung der Trägerplatte 4 die von den Pfropfenrändern belegte Wandhöhe mindestens noch 100 µm beträgt, während die Lochwände von beiden Seiten her bis zu den Pfropfen von Fotolack befreit sind.The structure is generated in the manner described in connection with FIG. 3 with a line mask. The exposure times are chosen so short that the plugs 8 are not exposed to light and after double-sided exposure and development of the carrier plate 4, the wall height occupied by the plug edges is at least 100 μm, while the perforated walls are freed of photoresist from both sides up to the plugs .

Durch galvanische Verstärkung nach dem Ausführungsbeispiel nach Fig. 3 werden die Leiterbahnen aufgebaut. Anschließend wird beidseitig sehr intensiv belichtet und der restliche Fotolack von den Leiterbahnen und die Pfropfen 8 aus den Löchern 3 abentwickelt.The conductor tracks are built up by galvanic amplification according to the exemplary embodiment according to FIG. 3. Subsequently, intensive exposure is carried out on both sides, and the remaining photoresist is developed from the conductor tracks and the plugs 8 from the holes 3.

Durch die darauffolgende Kupferätzung mit FeCl3-Lösung werden sowohl die Leiterbahnen voneinander getrennt als auch die von den Pfropfen 8 befreiten, nicht verstärkten Metallringe in den Löchern 3 abgeätzt, wodurch die Metallisierungen der beiden Seiten voneinander getrennt werden. Die Abschlußreinigung erfolgt wie in dem in Fig. 3 beschriebenen Ausführungsbeispiel.As a result of the subsequent copper etching with FeCl 3 solution, both the conductor tracks are separated from one another and the non-reinforced metal rings in the holes 3, which have been freed from the plugs 8, are etched away, as a result of which the metallizations on the two sides are separated from one another. The final cleaning is carried out as in the embodiment described in FIG. 3.

Bei dem in Fig. 5 dargestellten Ausführungsbeispiel wird eine durch die Löcher 3 durchgehend beidseitig mit einer Metallisierung 11 versehene Trägerplatte 4 von einer Seite (Spaltenseite) mit positiv arbeitendem Fotolack 10 besprüht und anschließend auf der anderen Seite mit Negativ-Fotolack 12 besprüht. Die Schichtdicken betragen jeweils 5/um. Raster und Abmessungen der Trägerplatte 4 entsprechen dem Ausführungsbeispiel nach Fig. 3. Es werden zwei Belichtungsmasken verwendet. In der ersten Belichtung wird die Spaltenseite belichtet, so daß die einzelnen Lochreihen - und die sie verbindenden Leiterbahnen - belichtet werden und gleichzeitig der von der Zeilenseite her in die Löcher 3 gesprühte Negativ-Lack am gegenüberliegenden Ende der Löcher 3 vernetzt wird. Anschließend wird mit der Maske die Zeilenseite belichtet, so daß die jeweils über die Lochreihen und um die Löcher 3 herumlaufenden Leiterbahnen nicht belichtet werden.In the exemplary embodiment shown in FIG. 5, a support plate 4 provided with a metallization 11 on both sides through the holes 3 is sprayed with positive-working photoresist 10 from one side (column side) and then sprayed with negative photoresist 12 on the other side. The layer thicknesses are 5 µm . The grid and dimensions of the carrier plate 4 correspond to the exemplary embodiment according to FIG. 3. Two exposure masks are used. In the first exposure, the column side is exposed so that the individual rows of holes - and the interconnects connecting them - are exposed and at the same time the negative lacquer sprayed into the holes 3 from the row side is crosslinked at the opposite end of the holes 3. The line side is then exposed with the mask, so that the conductor tracks running in each case over the rows of holes and around the holes 3 are not exposed.

Nach Entwicklung beider Fotolack-Systeme steht Fotolack nur noch als Abstandslinien der Leiterbahnen und in den Löchern 3 bleiben nur noch Negativ-Lack-Ringe am "Zeilenende" der Löcher 3 stehen. Die freigelegten Kupferbahnen über die Löcher 3 und die mit den Spaltenleitungen zusammenhängenden Metallisierungen der Löcher 3 werden galvanisch verstärkt.After developing both photoresist systems, photoresist is available only as spacing lines of the conductor tracks and in the holes 3 only negative lacquer rings remain at the "line end" of the holes 3. The exposed copper tracks via the holes 3 and the metallizations of the holes 3 connected with the column lines are galvanically reinforced.

Nach Entfernung aller Fotolackreste und der dadurch freigelegten Cu-Reste auf Bahnen und in Löchern ist die Trennung der Leiterbahnen voneinander sowie die Trennung der Metallisierungen von Spaltenseite und Zeilenseite sichergestellt.After removal of all photoresist residues and the resulting Cu residues on tracks and in holes, the separation of the conductor tracks from one another and the separation of the metallizations from the column side and row side is ensured.

Die Erfindung ist auf die dargestellten Ausführungsbeispiele nicht beschränkt. Insbesondere bei dem Herstellungsverfahren der Steuerplatte kann es vorteilhaft sein, fotosensitive Metallpasten zu verwenden, die z.B. durch Siebdruck ganzflächig aufgebracht werden können. Je nach angewandtem Unterdruck ist es dabei möglich, die Schicht mehr oder weniger tief in die Löcher hineinragen zu lassen. Die Belichtungs-Ablöse- und Temperprozesse können dann in der üblichen Weise vorgenommen werden.The invention is not restricted to the exemplary embodiments shown. In the control plate manufacturing process in particular, it may be advantageous to use photosensitive metal pastes, e.g. can be applied over the entire surface by screen printing. Depending on the negative pressure applied, it is possible to let the layer protrude more or less deeply into the holes. The exposure-peeling and annealing processes can then be carried out in the usual way.

Claims (4)

1. Steuerplatte für eine Gasentladungsanzeigevorrichtung mit einer Trägerplatte aus elektrisch isolierendem Material, die auf ihrer einen Seite als Zeilenleiter und auf ihrer anderen Seite als Spaltenleiter eine Matrix bildende und jeweils getrennt ansteuerbare Metallische Leiterbahnen trägt und zusammen mit diesen Bahnen in den Kreuzungspunkten der Matrix durchgehende Steuerlöcher hat, dadurch gekennzeichnet , daß die metallischen Leiterbahnen (1, 2) in die Steuerlöcher (3) der Trägerplatte (4) definiert hineinreichen, daß die jeweiligen Lochreihen miteinander elektrisch verbunden sind und daß die Spaltenleiter (1) und die Zeilenleiter (2) voneinander sehr hochohmig (R ≥ 100 M Ω) oder völlig voneinander getrennt sind.1. Control plate for a gas discharge display device with a carrier plate made of electrically insulating material, which carries on one side as a row conductor and on the other side as a column conductor, forming a matrix-forming and in each case separately controllable metallic conductor tracks and, together with these tracks, through-going control holes in the intersection points of the matrix , characterized in that the metallic conductor tracks (1, 2) extend into the control holes (3) of the carrier plate (4) in a defined manner, that the respective rows of holes are electrically connected to one another and that the column conductors (1) and the row conductors (2) from one another are very high-impedance (R ≥ 100 M Ω) or completely separated from each other. 2. Steuerplatte nach Anspruch 1, dadurch gekennzeichnet , daß die metallischen Leiterbahnen (1, 2) der Spaltenleiter (1) fast den ganzen Lochbereich der zugeordneten Steuerlöcher (3) ausfüllen und daß die metallischen Leiterbahnen (1, 2) der Zeilenleiter (2) nur geringfügig in die diesen zugeordneten Steuerlöcher (3) reichen.2. Control plate according to claim 1, characterized in that the metallic conductor tracks (1, 2) of the column conductor (1) fill almost the entire hole area of the associated control holes (3) and that the metallic conductor tracks (1, 2) of the row conductor (2) extend only slightly into the control holes (3) assigned to them. 3. Steuerplatte nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Trägerplatte (4) aus Glas oder Keramik besteht und Dicken zwischen 0,3 und 2 mm aufweist.3. Control plate according to claim 1 or 2, characterized in that the carrier plate (4) consists of glass or ceramic and has thicknesses between 0.3 and 2 mm. 4. Verfahren zum Herstellen einer Steuerplatte nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet , daß die mit Steuerlöchern (3) versehene Trägerplatte (4) beidseitig ganzflächig metallisiert wird, daß die Metalloberflächen mit Fotolack beschichtet werden, daß zur Erzeugung der Struktur der Leiterbahnen (1, 2) jeweils auf beiden Seiten der Trägerplatte (4), zueinander senkrecht stehend, ein Linien-Raster über Masken aufbelichtet wird, daß die bei der Entwicklung vom Fotolack befreiten metallischen Oberflächen beider Seiten der Trägerplatte (4) galvanisch mit Kupfer und/oder Nickel bis zu einer Stärke von einigen µm verstärkt werden und daß anschließend der restliche Fotolack entfernt und die restliche dünne Metallschicht abgeätzt werden, so daß auf beiden Seiten der Trägerplatte (4) die Leiterbahnen (4) stehen, die voneinander elektrisch getrennt sind und zumindest teilweise in die Steuerlöcher (3) hineinreichen.4. A method for producing a control plate according to one of claims 1 to 3, characterized characterized in that the support plate (4) provided with control holes (3) is metallized on both sides over the entire surface, that the metal surfaces are coated with photoresist, that to produce the structure of the conductor tracks (1, 2) on each side of the support plate (4) standing vertically, a line grid is exposed over masks, that the metallic surfaces freed from the photoresist during development are galvanically reinforced with copper and / or nickel up to a thickness of a few microns and then the rest Photoresist is removed and the remaining thin metal layer is etched away, so that on both sides of the carrier plate (4) are the conductor tracks (4), which are electrically separated from one another and at least partially extend into the control holes (3).
EP80104435A 1979-07-31 1980-07-28 Control plate for a gas discharge display device and method of making such a control plate Expired EP0023357B1 (en)

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AT80104435T ATE6712T1 (en) 1979-07-31 1980-07-28 CONTROL PLATE FOR A GAS DISCHARGE INDICATOR AND METHOD OF MAKING SUCH CONTROL PLATE.

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DE19792931077 DE2931077A1 (en) 1979-07-31 1979-07-31 CONTROL PANEL FOR A GAS DISCHARGE DISPLAY DEVICE
DE2931077 1979-07-31

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US4340838A (en) 1982-07-20
ATE6712T1 (en) 1984-03-15
EP0023357B1 (en) 1984-03-14
DE2931077A1 (en) 1981-02-05

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