EP0002496B1 - Method and apparatus for aligning flat and thin workpieces - Google Patents

Method and apparatus for aligning flat and thin workpieces Download PDF

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Publication number
EP0002496B1
EP0002496B1 EP78101588A EP78101588A EP0002496B1 EP 0002496 B1 EP0002496 B1 EP 0002496B1 EP 78101588 A EP78101588 A EP 78101588A EP 78101588 A EP78101588 A EP 78101588A EP 0002496 B1 EP0002496 B1 EP 0002496B1
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EP
European Patent Office
Prior art keywords
plate
reference surface
drive
alignment
overpressure
Prior art date
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Expired
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EP78101588A
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German (de)
French (fr)
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EP0002496A1 (en
Inventor
Walter William Ficker
David E. Lonser
William Glenn Rance
Alfred Alois Stricker
Walter Vonkaenel
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International Business Machines Corp
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International Business Machines Corp
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Publication of EP0002496A1 publication Critical patent/EP0002496A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces

Definitions

  • the invention relates to a method and an apparatus for aligning a flat thin workpiece, for. B. a plate, a film element and the like.
  • the production of multilayer ceramic semiconductor packages takes place by first forming a mixture of finely divided ceramic material, a volatile solvent and a carrier mass. This mixture is spread into a thin layer using a doctor knife or a doctor blade and dried to drive off the volatile solvent. This results in a thin, flexible, paper-like film, commonly referred to as a green ceramic film. This film is cut into smaller pieces and processed further by producing through-holes, filling these holes with an electrically conductive paste and printing a line pattern. A number of film elements processed in this way are then assembled, pressed, cut and then sintered at a relatively high temperature. During this sintering process, the carrier mass and remaining binder are burned out, so that a rigid ceramic body is formed which has interconnected wiring patterns in its interior. Then appropriate matting is applied to the top and bottom of the ceramic substrate and the corresponding connections are made via the through holes previously made in the film elements. Then the electrical connections and semiconductor devices are attached and the whole is encapsulated.
  • DE-A 27 38 989 describes a device for aligning film elements in which the film stretched on a movable support is first moved horizontally and then by the wedge effect of two complementary wedge-shaped plates in a vertical direction to a printing station and is aligned with stops .
  • this method has certain shortcomings because of the manual handling required, in particular because of the risk of damage to the film elements or the conductive patterns thereon. It is therefore an object to carry out the alignment of such foil elements, so-called green ceramic foils, in a completely automatic manner in such a way that manual handling is not necessary and damage of any kind is also ruled out when the foil elements are handled automatically. This object is achieved by the method specified in claim 1.
  • a particularly suitable device for carrying out the method according to claim 1 with a conveying device for feeding the workpiece to a straightening station and for removing the aligned workpiece resting on the reference surface of the straightening station is characterized in that the reference surface of the straightening station which can serve as a support surface can be produced or removed are arranged in these retractable directional pins and that a chamber to which an overpressure can be applied is provided below the reference surface, the excess pressure serving to form the gas film.
  • the conveying device has a plate with a chamber arranged in the guide surface of the plate and optionally switchable to negative pressure and positive pressure, which plate can be aligned with the reference surface and adjustable in the direction of the normal to the reference surface by means of a horizontal drive and a lifting drive is.
  • the arrangement of one chamber for connection to negative pressure or positive pressure both in the plate of the conveying device and in the plate with the reference surface offers the advantage that the film element can first be supplied, adhering to the plate of the conveying device by means of negative pressure; By switching to overpressure both in the plate of the conveying device and in the plate of the reference surface, a gas pressure film is then formed on both sides of the film element, which enables the element to be aligned without resistance.
  • the chamber in the reference surface is switched to negative pressure, so that the film element is now placed on the reference surface with physical contact and the alignment means, e.g. B. directional pins, can be disabled or withdrawn.
  • the transport device 10 shown in FIG. 1 consists of an input station 12, an alignment station 14 and an output station 16.
  • An input conveyor device 18 is movable between the input station 12 and the alignment station 14, and an output conveyor device 20 can be moved between the alignment station 14 and the output station 16 .
  • the input and output conveyor devices 18 and 20 include rails 24 and 25 which are mounted in supports 31 and 32 and run across the aforementioned stations.
  • the input conveyor device 18 is provided for its movement between the input station and the alignment station 14 on the rails 24 and 25 with guide bushes 26 and 28 which are connected to one another by means of a yoke 29.
  • the output conveyor device 20 has guide bushes 36 and 38, which are likewise guided in a longitudinally movable manner on the rails 24 and 25 and connected to one another by means of a yoke 39 and provided for holding the output conveyor device 20.
  • a cable 41 which is attached to the yoke 29 on both sides and is guided over deflection rollers 42 and 43, is used to drive the input conveyor device 18 along the rails 24 and 25.
  • An electric motor 45 is effective via the deflection roller 43 on the cable 41 for driving the input conveyor device 18.
  • the output conveyor device 20 is also driven by an electric motor 55 by means of a cable pull 51, which is guided over deflection rollers 52 and 53.
  • the ends of the cable 51 are attached to an arm 40 of the yoke 39.
  • a toothed rack 61 is fastened to a plate 62, and with the toothed rack 61 a pinion 63 interacts, which is mounted on the yoke 29 and is driven by an electric motor 64.
  • the vertical drive for the output conveyor device 20 with respect to the alignment station 14 and the output station 16 has, in the same embodiment, a toothed rack 71 on a plate 72, with which a pinion 73 driven by an electric motor 74 interacts.
  • the input station 12 forms a flat surface for receiving foil elements to be aligned. If necessary, the input station 12 can be equipped with a carrier plate or another carrier element for receiving the film elements. The same applies to the output station 16 with regard to the reception of the now aligned film elements, for the subsequent transport to the other stations for the purpose of stacking or other processing operations.
  • the alignment station 14 has a reference surface 81, from the corner regions of which movable alignment pins 84 protrude.
  • the alignment pins 84 are used for insertion into corresponding holes in the film elements to be aligned and can be moved vertically with respect to the reference surface 81 by means of a drive device shown in FIG. 5.
  • the alignment pins 84 are attached to the top of rails 86, 87.
  • the rails 86, 87 are located below the reference surface 81, and the alignment pins 84 protrude through corresponding bores in the reference surface 81 for interaction with the film elements to be aligned. In their lower position, the alignment pins 84 are located below the reference surface 81.
  • the drive device for raising and lowering the alignment pins 84 contains a cam disk 100 with a cam surface 102 and a cam follower roller 104 cooperating therewith.
  • the cam disk 100 is driven by a motor 106 via a shaft 108.
  • the cam follower roller 104 is fastened to an angled cam follower plate 109, which accordingly executes vertical forward and return stroke movements with the motor 106 rotating.
  • the drive arm 118 is articulated at the pivot point 120 of an axis 121, while the drive arm 119 is guided in a corresponding manner at a pivot point 122 of an axis 123.
  • the outer end of the drive arm 119 is provided with a fork piece 131 which engages with a bolt 134, which in turn is guided in a bearing head 135 guided in a groove 136 in the rail 87.
  • a thrust piece 141 is located at the outer end of the drive arm 118, for engagement with a bolt (not shown) and bearing head in the groove 146 of the rail 86.
  • the plate 62 of the input conveyor 18 is provided with bores 201 in its corners for receiving the alignment pins 84 in their extended position.
  • a chamber 202 is further formed in the plate 62, which is closed against the lower surface of the plate 62 by a porous plate 204.
  • the chamber 202 is connected via a channel 206 to an overpressure / underpressure system (not shown), so that the chamber 202 can optionally be subjected to overpressure or underpressure.
  • the reference surface 82 is also covered by a porous plate 208, through which a chamber 209 is formed. This can also be subjected to overpressure or underpressure via a channel 210.
  • the pins 84 are movably guided and can be moved out of the reference surface 81 so that they protrude from it.
  • the first step in aligning a film element consists in aligning the input conveyor device 18 with the plate 62 on the input station 12 and lowering it onto the carrier plate with the film element or a multilayer film arrangement.
  • the film element is then attracted by applying negative pressure to the chamber 202, and then the input conveyor device 18 is raised and moved along the rails 24 and 25 to the alignment station 14.
  • the plate 62 is lowered onto the reference surface 81 of the alignment station 14, and as it approaches the reference surface 81, the chamber 209 is pressurized with compressed air (see FIG. 2).
  • a switch is made in the chamber 202 from negative pressure to positive pressure, with the result that a compressed air film is now effective on the film element 12 both from the top and from the bottom.
  • the air pressure effective on both sides is dimensioned in such a way that the film element 212 is "floating" in a stable position between the porous plates 204 and 208.
  • the alignment pins 84 are now moved out of the reference surface 81, as a result of the rounded design of their tips, when the corresponding holes in the film element 212 are reached, they correct the position of the film element if the position of the holes does not exactly match that of the alignment pins 84. Such a correction of the position of the film element 212 takes place without resistance due to the floating mounting of the film element. Provided that the distances between the alignment pins 84 on the one hand and the distances between the holes in the film element on the other hand are exactly the same, stress on the film element or damage to it in the course of the alignment process is therefore excluded. In addition, the pressure zones below and above the film element ensure its level guidance, so that no sagging of the central area with the resulting disadvantages must be feared.
  • the excess pressure in the chamber 209 is switched off, or the difference in pressure above the film element and below the film element is dimensioned such that the film element on the Reference surface 81 comes to rest. This process can be supported by a corresponding further downward movement of the input conveyor device 18.
  • the input conveyor device 18 is raised again and moved back to the input station 12, where it can receive another film element.
  • the output conveyor 20 is moved to the alignment station 14 and aligned with the film member, and then the plate 72 is lowered onto the film member.
  • the output conveyor device 2'0 is pressurized with vacuum, raised again and moved to the output station 16, where the film element in question, possibly on further film layers already aligned there, is deposited.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Registering Or Overturning Sheets (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Description

Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Ausrichten eines flacher dünner Werkstücks, z. B. einer Platte, eines Folienelementes und dgl.The invention relates to a method and an apparatus for aligning a flat thin workpiece, for. B. a plate, a film element and the like.

Die Verarbeitung derartiger Folienelemente spielt insbesondere in der Herstellung von mehrschichtigen keramischen Halbleiterpackungen eine wichtige Rolle. Bei dieser Art Halbleiterpackungen können innerhalb des Substrates verschiedene, aus Komponenten und Leitungsmustem bestehende Schaltungen untergebracht werden, und es besteht außerdem die Möglichkeit, auch sehr komplexe Schaltungsanordnungen herzustellen, wie sie mit den bisher bekannten Techniken des Auftragens einer Mehrzahl metallischer Schichten auf das Substrat nicht erreichbar waren.The processing of such film elements plays an important role in particular in the production of multilayer ceramic semiconductor packages. With this type of semiconductor package, various circuits consisting of components and line patterns can be accommodated within the substrate, and there is also the possibility of producing very complex circuit arrangements which cannot be achieved with the previously known techniques of applying a plurality of metallic layers to the substrate were.

Die Herstellung mehrschichtiger keramischer Halbleiterpackungen erfolgt dadurch, daß man zunächst eine Mischung aus fein verteiltem keramischen Material, einem flüchtigen Lösungsmittel und einer Trägermasse bildet. Diese Mischung wird mit Hilfe eines Abstreichmessers oder einer Rakel zu einer dünnen Schicht ausgestrichen und zum Austreiben des flüchtigen Lösungsmittels getrocknet. Das ergibt eine dünne, biegsame papierähnliche Folie, üblicherweise als grüne keramische Folie bezeichnet. Diese Folie wird in kleinere Stücke zerschnitten und durch Herstellen von durchgehenden Bohrungen, Ausfüllen dieser Bohrungen mit einer elektrisch leitenden Paste und Aufdrucken eines Leitungsmusters weiter verarbeitet. Eine Anzahl derartig verarbeiteter Folienelemente wird dann zusammengefügt, gepreßt, geschnitten und anschließend bei relativ hoher Temperatur gesintert. Während dieses Sintervorganges werden die Trägermasse und noch verbleibende Bindemittel ausgebrannt, so daß ein starrer keramischer Körper entsteht, der in seinem Innern miteinander verbundene Leitungsmuster aufweist. Dann werden auf die Oberseite und die Unterseite des keramischen Substrates entsprechende Matellisierungen aufgebracht und die entsprechenden Verbindungen über die zuvor in den Folienelementen hergestellten durchgehenden Bohrungen hergestellt. Anschließend werden die elektrischen Anschlüsse und Halbleitervorrichtungen angebracht und das ganze eingekapselt.The production of multilayer ceramic semiconductor packages takes place by first forming a mixture of finely divided ceramic material, a volatile solvent and a carrier mass. This mixture is spread into a thin layer using a doctor knife or a doctor blade and dried to drive off the volatile solvent. This results in a thin, flexible, paper-like film, commonly referred to as a green ceramic film. This film is cut into smaller pieces and processed further by producing through-holes, filling these holes with an electrically conductive paste and printing a line pattern. A number of film elements processed in this way are then assembled, pressed, cut and then sintered at a relatively high temperature. During this sintering process, the carrier mass and remaining binder are burned out, so that a rigid ceramic body is formed which has interconnected wiring patterns in its interior. Then appropriate matting is applied to the top and bottom of the ceramic substrate and the corresponding connections are made via the through holes previously made in the film elements. Then the electrical connections and semiconductor devices are attached and the whole is encapsulated.

Die Verarbeitung der einzelnen Folienelemente in der oben beschriebenen Art bereitet erhebliche Schwierigkeiten, insbesondere deshalb, weil die Folienelemente bei einer Dicke von etwa 0,2 mm relativ brüchig und im Vergleich zu ihrer Dicke sehr groß sind. Außerdem muß das Ausrichten der Folienelemente mit der Maske zur Herstellung der gewünschten Leitungsmuster und zum Ausfüllen der durchgehenden Bohrungen sehr sorgfältig durchgeführt werden, wozu man üblicherweise nahe den Kanten der Folienelemente befindliche Ausrichtlöcher verwendet. Wird das Folienelement über die Ausrichtlöcher aufgelegt, muß darauf geachtet werden, daß die Ausrichtlöcher nicht beschädigt und die Folienelemente nicht verzogen werden. Die bekannten Verfahren zum Bedrucken von Leitungsmustern auf starren Substraten gaben keine Lösung für die Bewältigung dieser Schwierigkeiten an, da die bisher verwendeten Substrate entweder starre, aus Tonerde bestehende Modulsubstrate oder aus Kunstharz bestehende Schaltungskarten waren; denn bei diesen Anwendungsgebieten ließ sich wie es durch die DE-A 25 42 047 bekannt ist, das Ausrichten eines plattenförmigen Werkstücks in einer Lage parallel zu einer Referenzfläche durch Anlegen an Anschlagflächen erreichen. Hierbei werden die Ecken oder unter einem bestimmten Winkel zueinander ausgerichtete Kanten des Werkstücks als Bezugsflächen verwendet. Dieses Verfahren kann aber bei Folienelementen nicht angewendet werden.The processing of the individual film elements in the manner described above presents considerable difficulties, in particular because the film elements are relatively fragile at a thickness of approximately 0.2 mm and are very large compared to their thickness. In addition, the alignment of the film elements with the mask must be carried out very carefully in order to produce the desired line patterns and to fill the through bores, for which purpose alignment holes usually located near the edges of the film elements are used. If the film element is placed over the alignment holes, care must be taken that the alignment holes are not damaged and the film elements are not warped. The known methods for printing line patterns on rigid substrates did not provide a solution for overcoming these difficulties, since the substrates used hitherto were either rigid, module substrates made of alumina or circuit boards made of synthetic resin; because in these fields of application, as is known from DE-A 25 42 047, the alignment of a plate-shaped workpiece in a position parallel to a reference surface could be achieved by contacting stop surfaces. The corners or edges of the workpiece aligned at a certain angle to one another are used as reference surfaces. However, this method cannot be used for film elements.

In der DE-A 27 38 989 ist eine Vorrichtung zum Ausrichten von Folienelementen beschrieben, bei der die auf einen beweglichen Träger aufgespannte Folie zunächst in waagrechter und dann durch die Keilwirkung zweier komplementärer keilförmiger Platten in senkrechter Richtung zu einer Druckstation verfahren und an Anschlägen ausgerichtet wird. Diese Methode ist jedoch wegen der erforderlichen manuellen Handhabung mit gewissen Mängeln behaftet, und zwar insbesondere wegen der Gefahr der Beschädigung der Folienelemente oder der darauf befindlichen leitenden Muster. Es besteht daher die Aufgabe, die Ausrichtung derartiger Folienelemente, sogenannter grüner keramischer Folien, auf vollständig automatische Weise so durchzuführen, daß eine manuelle Handhabung nicht erforderlich ist und auch bei der automatischen Handhabung der Folienelemente eine Beschädigung irgendwelcher Art ausgeschlossen ist. Diese Aufgabe wird durch das im Patentanspruch 1 angegebene Verfahren gelöst.DE-A 27 38 989 describes a device for aligning film elements in which the film stretched on a movable support is first moved horizontally and then by the wedge effect of two complementary wedge-shaped plates in a vertical direction to a printing station and is aligned with stops . However, this method has certain shortcomings because of the manual handling required, in particular because of the risk of damage to the film elements or the conductive patterns thereon. It is therefore an object to carry out the alignment of such foil elements, so-called green ceramic foils, in a completely automatic manner in such a way that manual handling is not necessary and damage of any kind is also ruled out when the foil elements are handled automatically. This object is achieved by the method specified in claim 1.

Durch die DE-A 25 20 201 ist zwar eine Vorrichtung zum Positionieren von flachen Vorlagen, z. B. in Geräten zur photographischen Reproduktion von Bildern, bekannt, bei der gleichfalls Richtelemente in Form von beweglichen Stiften zum Ausrichten Verwendung finden, jedoch handelt es sich hier um eine Anordnung, bei der die Werkstücke auf einer horizontalen Führungsbahn zugeführt werden. Dort bietet sich somit ohne weiteres die Möglichkeit, von der Oberseite eine Platte mit entsprechenden Richtstiften zuzuführen. Beim erfindungsgemäßen Verfahren werden hingegen die einzelnen Werkstücke in der Ausrichtstation von der Oberseite zugeführt und auf den Gasfilm der als Ablagefläche benutzten Referenzfläche abgesetzt.From DE-A 25 20 201 a device for positioning flat templates, for. B. in devices for photographic reproduction of images, known, also used in the directional elements in the form of movable pins for alignment, but this is an arrangement in which the workpieces are fed on a horizontal track. There, there is thus the possibility of feeding a plate with corresponding directional pins from the top. In the method according to the invention, however, the individual workpieces are fed into the alignment station from the top and placed on the gas film of the reference surface used as a storage surface.

Eine besonders geeignete Vorrichtung zur Ausführung des Verfahrens nach Patentanspruch 1 mit einer Fördervorrichtung zur zufuhr des Werkstücks zu einer Richtstation sowie zur Entnahme des ausgerichteten, auf der Referenzfläche der Richtstation aufliegenden Werkstücks zeichnet sich dadurch aus, daß aus der als Auflagefläche dienenden Referenzfläche der Richtstation ausfabrbare bzw. in diese zurückziehbare Richtstifte angeordnet sind und daß unterhalb der Referenzfläche eine mit Überdruck beaufschlagbare Kammer vorgesehen ist, wobei der Überdruck zur Bildung des Gasfilms dient.A particularly suitable device for carrying out the method according to claim 1 with a conveying device for feeding the workpiece to a straightening station and for removing the aligned workpiece resting on the reference surface of the straightening station is characterized in that the reference surface of the straightening station which can serve as a support surface can be produced or removed are arranged in these retractable directional pins and that a chamber to which an overpressure can be applied is provided below the reference surface, the excess pressure serving to form the gas film.

Von besonderem Vorteil ist es, wenn die Fördervorrichtung eine Platte mit einer in der Führungsfläche der Platte angeordneten, wahlweise auf Unterdruck und Überdruck umschaltbaren Kammer aufweist, welche Platte mittels eines horizontalen Antriebes und eines Hubantriebes zur Referenzfläche ausrichtbar und in Richtung der Normalen, zur Referenzfläche verstellbar ist. Die Anordnung je einer Kammer zur Anschaltung an Unterdruck oder Überdruck sowohl in der Platte der Fördervorrichtung als auch in der Platte mit der Referenzfläche bietet den Vorteil, daß das Fclienelement zunächst, mittels Untendruck an der Platte der Fördervorrichtung haftend, zugeführt werden kann; durch Umschaltung auf Überdruck sowohl in der Platte der Fördervorrichtung als auch in der Platte der Referenzfläche wird sodann beiderseits des Folienelements ein Gasdruckfilm gebildet, der ein widerstandsfreies Ausrichten des Elements ermöglicht. Nach dem Ausrichten wird die Kammer in der Referenzfläche auf Unterdruck umgeschaltet, so daß das Folienelement nun mit physischem Kontakt auf die Referenzfläche aufgelegt wird und die Ausrichtmittel, z. B. Richtstifte, unwirksam gemacht bzw. Zurückgezogen werden können.It is particularly advantageous if the conveying device has a plate with a chamber arranged in the guide surface of the plate and optionally switchable to negative pressure and positive pressure, which plate can be aligned with the reference surface and adjustable in the direction of the normal to the reference surface by means of a horizontal drive and a lifting drive is. The arrangement of one chamber for connection to negative pressure or positive pressure both in the plate of the conveying device and in the plate with the reference surface offers the advantage that the film element can first be supplied, adhering to the plate of the conveying device by means of negative pressure; By switching to overpressure both in the plate of the conveying device and in the plate of the reference surface, a gas pressure film is then formed on both sides of the film element, which enables the element to be aligned without resistance. After alignment, the chamber in the reference surface is switched to negative pressure, so that the film element is now placed on the reference surface with physical contact and the alignment means, e.g. B. directional pins, can be disabled or withdrawn.

Die Erfindung wird im folgenden an Hand der Zeichnungen in einem Ausführungsbeispiel beschrieben. Es zeigen:

  • Fig. 1 in schaubildlicher Darstellung eine Gesamtanordnung einer Vorrichtung zum Transport und zum Ausrichten von Folienelementen,
  • Fign 2 bis 4 schematische Darstellungen des Ausrichtvorganges in der Ausrichtstation gemäß Fig. 1, in aufeinanderfolgenden Phasen und,
  • Fig. 5 eine schematische, schaubildliche Darstellung der Antriebsvorrichtung für die Richtstifte der Ausrichtstation gemäß den Fign. 1 bis 4.
The invention is described below with reference to the drawings in one embodiment. Show it:
  • 1 shows a diagram of an overall arrangement of a device for transporting and aligning film elements,
  • 2 to 4 are schematic representations of the alignment process in the alignment station according to FIG. 1, in successive phases and,
  • 5 shows a schematic, diagrammatic illustration of the drive device for the alignment pins of the alignment station according to FIGS. 1 to 4.

Die in Fig. 1 dargestellte Transporteinrichtung 10 besteht aus einer Eingabestation 12, einer Ausrichtstation 14 und einer Ausgabestation 16. Eine Eingabefördervorrichtung 18 ist zwischen der Eingabestation 12 und der Ausrichtstation 14 beweglich, und eine Ausgabefördervorrichtung 20 ist zwischen der Ausrichtstation 14 und der Ausgabestation 16 verfahrbar. Zu den Eingabe- und Ausgabefördervorrichtungen 18 und 20 gehören Schienen 24 und 25, die in Trägern 31 und 32 gelagert sind und quer über die vorgenannten Stationen verlaufen.The transport device 10 shown in FIG. 1 consists of an input station 12, an alignment station 14 and an output station 16. An input conveyor device 18 is movable between the input station 12 and the alignment station 14, and an output conveyor device 20 can be moved between the alignment station 14 and the output station 16 . The input and output conveyor devices 18 and 20 include rails 24 and 25 which are mounted in supports 31 and 32 and run across the aforementioned stations.

Die Eingabefördervorrichtung 18 ist zu ihrer bewegung zwischen der Eingabestation und der Ausrichtstation 14 auf den Schienen 24 und 25 mit Führungsbuchsen 26 und 28 versehen, die mittels eines Joches 29 untereinander verbunden sind. In entsprechender Weise weist die Ausgabefördervorrichtung 20 Führungsbuchsen 36 und 38 auf, die gleichfalls auf den Schienen 24 und 25 längsbeweglich geführt und mittels eines Joches 39 untereinander verbunden und zur Halterung der Ausgabefördervorrichtung 20 vorgesehen sing.The input conveyor device 18 is provided for its movement between the input station and the alignment station 14 on the rails 24 and 25 with guide bushes 26 and 28 which are connected to one another by means of a yoke 29. In a corresponding manner, the output conveyor device 20 has guide bushes 36 and 38, which are likewise guided in a longitudinally movable manner on the rails 24 and 25 and connected to one another by means of a yoke 39 and provided for holding the output conveyor device 20.

Zum Antrieb der Eingabefördervorrichtung 18 längs der Schienen 24 und 25 dient ein Seilzug 41, der beiderseits am Joch 29 befestigt und über Umlenkrollen 42 und 43 geführt ist. Ein Elektromotor 45 ist über die umlenkrolle 43 auf den Seilzug 41 zum Antrieb der Eingabefördervorrichtung 18 wirksam.A cable 41, which is attached to the yoke 29 on both sides and is guided over deflection rollers 42 and 43, is used to drive the input conveyor device 18 along the rails 24 and 25. An electric motor 45 is effective via the deflection roller 43 on the cable 41 for driving the input conveyor device 18.

In der gleichen Weise, wie zuvor in Bezug auf die Eingabefördervorrichtung 18 beschrieben, wird auch die Ausgabefördervorrichtung 20 mittels eines Seilzuges 51, welcher über Umlenkrollen 52 and 53 geführt ist, von einem Elektromotor 55 angetrieben. Die Enden des Seilzuges 51 sind an einem Arm 40 des Joches 39 befestigt.In the same way as previously described with respect to the input conveyor device 18, the output conveyor device 20 is also driven by an electric motor 55 by means of a cable pull 51, which is guided over deflection rollers 52 and 53. The ends of the cable 51 are attached to an arm 40 of the yoke 39.

Zur vertikalen Verstellbewegung der Eingabefördervorrichtung 18 ist eine Zahnstange 61 an einer Platte 62 befestigt, und mit der Zahnstange 61 wirkt ein Ritzel 63 zusammen, welches am Joch 29 gelagert ist und mittels eines Elektromotors 64 angetrieben wird. Der Vertikalantrieb für die Ausgabefördervorrichtung 20 in Bezug auf die Ausrichtstation 14 und die Ausgabestation 16 weist in gleicher Ausführung eine Zahnstange 71 an einer Platte 72 auf, mit der ein von einem Elektromotor 74 angetriebenes Ritzel 73 zusammenwirkt.For the vertical adjustment movement of the input conveyor device 18, a toothed rack 61 is fastened to a plate 62, and with the toothed rack 61 a pinion 63 interacts, which is mounted on the yoke 29 and is driven by an electric motor 64. The vertical drive for the output conveyor device 20 with respect to the alignment station 14 and the output station 16 has, in the same embodiment, a toothed rack 71 on a plate 72, with which a pinion 73 driven by an electric motor 74 interacts.

Wie weiterhin Fig. 1 zeigt, bildet die Eingabestation 12 eine flache Oberfläche zur Aufnahme von auszurichtenden Folienelementen. Wenn erforderlich, kann die Eingabestation 12 mit einer Trägerplatte oder einem anderen Trägerelement zur Aufnahme der Folienelemente ausgestattet werden. Das gleiche gilt für die Ausgabestation 16 in Bezug auf die Aufnahme der nun ausgerichteten Folienelemente, für den nachfolgenden Transport zur anderen Stationen zum Zwecke des Aufeinanderschichtens oder anderer Bearbeitungsvorgänge.As further shown in FIG. 1, the input station 12 forms a flat surface for receiving foil elements to be aligned. If necessary, the input station 12 can be equipped with a carrier plate or another carrier element for receiving the film elements. The same applies to the output station 16 with regard to the reception of the now aligned film elements, for the subsequent transport to the other stations for the purpose of stacking or other processing operations.

Die Ausrichtstation 14 weist eine Referenzfläche 81 auf, aus deren Eckbereichen bewegliche Richtstifte 84 herausragen. Die Richtstifte 84 dienen zum Einführen in entsprechende Löcher der auszurichtenden Folienelemente und sind bezüglich der Referenzfläche 81. mittels einer in Fig. 5 dargestellten Antriebseinrichtung vertikal bewegbar.The alignment station 14 has a reference surface 81, from the corner regions of which movable alignment pins 84 protrude. The alignment pins 84 are used for insertion into corresponding holes in the film elements to be aligned and can be moved vertically with respect to the reference surface 81 by means of a drive device shown in FIG. 5.

Wie Fig. 5 zeigt, sind die Richtstifte 84 auf der Oberseite von Schienen 86, 87 befestigt. Die Schienen 86, 87 befinden sich unterhalb der Referenzfläche 81, und die Richtstifte 84 ragen durch entsprechende Bohrungen in der Referenzfläche 81 hindurch zur Zusammenwirkung mit den auszurichtenden Folienelementen. In ihrer unteren Stellung befinden sich die Richtstifte 84 unterhalb der Referenzfläche 81.As shown in FIG. 5, the alignment pins 84 are attached to the top of rails 86, 87. The rails 86, 87 are located below the reference surface 81, and the alignment pins 84 protrude through corresponding bores in the reference surface 81 for interaction with the film elements to be aligned. In their lower position, the alignment pins 84 are located below the reference surface 81.

Die Antriebsvorrichtung zum Anheben und Absenken der Richtstifte 84 enthält eine Nockenscheibe 100 mit einer Nockenfläche 102 und einer damit zusammenwirkenden Nockenfolgerolle 104. Die Nockenscheibe 100 wird von einem Motor 106 über eine Welle 108 angetrieben. Die Nockenfolgerolle 104 ist an einer abgewinkelt ausgebildeten Nockenfolgeplatte 109 befestigt, die demnach bei umlaufendem Motor 106 vertikale Vor- und Rückhubbewegungen ausführt. An der Nockenfolgeplatte 109 befinden sich Stege 111 und 112, mit denen Gabelstücke 114 bzw. 115 an Antriebsarmen 118 bzw. 119 formschlüssig gekoppelt sing. Der Antriebsarm 118 ist gelenkig am Drehpunkt 120 einer Achse 121 gelagert, während der Antriebsarm 119 in entsprechender Weise an einem Drehpunkt 122 einer Achse 123 geführt ist.The drive device for raising and lowering the alignment pins 84 contains a cam disk 100 with a cam surface 102 and a cam follower roller 104 cooperating therewith. The cam disk 100 is driven by a motor 106 via a shaft 108. The cam follower roller 104 is fastened to an angled cam follower plate 109, which accordingly executes vertical forward and return stroke movements with the motor 106 rotating. On the cam follower plate 109 there are webs 111 and 112 with which fork pieces 114 and 115 are coupled to drive arms 118 and 119 in a form-fitting manner. The drive arm 118 is articulated at the pivot point 120 of an axis 121, while the drive arm 119 is guided in a corresponding manner at a pivot point 122 of an axis 123.

Das äußere Ende des Antriebsarms 119 ist mit einem Gabelstück 131 versehen, das mit einem Bolzen 134 im Eingriff steht, welcher seinerseits in einem in einer Nut 136 der schiene 87 geführten Lagerkopf 135 geführt ist. In entsprechender Weise befindet sich am äußeren Ende des Antriebsarms 118 ein Gabestück 141, zum Eingriff mit einem (nicht gezeigten) Bolzen und Lagerkopf in der Nut 146 der Schiene 86.The outer end of the drive arm 119 is provided with a fork piece 131 which engages with a bolt 134, which in turn is guided in a bearing head 135 guided in a groove 136 in the rail 87. In a corresponding manner, a thrust piece 141 is located at the outer end of the drive arm 118, for engagement with a bolt (not shown) and bearing head in the groove 146 of the rail 86.

Zur Betätigung der in Fig. 5 gezeigten Anordnung führen bei Einschaltung des Motors 106 die Welle 108 und mit ihr die Nockenscheibe 100 und die Nockehfläche 102 eine Drehbewegung aus, mit der Folge, daß über die Nockenfolgerolle 104 die Nockenfolgeplatte 109 eine Aufwärts- bzw. Abwärtsbewegung ausführt. Diese Bewegung der Nockenfolgeplatte 109 wird auf die Antriebsarme 118, 119 übertragen, und infolgedessen führen die Schienen 86 und 87 eine entgagengerichtete Vertikalbewegung aus. Das Anheben der Nockenfolgeplatte 109 hat somit ein Absenken der Richtstifte 84 zur Folge, und umgekehrt werden die Richtstifte 84 in ihre ausgefahrene Stellung verstellt, wenn die Nockenfolgeplatte 109 eine Abwärtsbewegung ausführt.To actuate the arrangement shown in FIG. 5, when the motor 106 is switched on, the shaft 108 and with it the cam disk 100 and the cam surface 102 perform a rotary movement, with the result that the cam follower plate 109 moves up and down via the cam follower roller 104 executes. This movement of the cam follower plate 109 is transmitted to the drive arms 118, 119 and, as a result, the rails 86 and 87 perform a counter-directed vertical movement. Raising the cam follower plate 109 thus results in a lowering of the alignment pins 84, and conversely the alignment pins 84 are moved into their extended position when the cam follower plate 109 executes a downward movement.

Gemäß Fig. 2 ist die Platte 62 der Eingabefördervorrichtung 18 mit Bohrungen 201 in ihren Ecken zur Aufnahme der Richtstifte 84 in deren ausgefahrener Stellung versehen. In der Platte 62 ist weiterhin eine Kammer 202 gebildet, welche gegen die untere Fläche der Platte 62 durch eine poröse Platte 204 verschlossen ist. Die Kammer 202 ist über einen Kanal 206 mit einem (nicht dargestellten) Überdruck- /Unterdruck-system verbunden, so daß die Kammer 202 wahlweise mit Überdruck oder Unterdruck beaufachlagbar ist.2, the plate 62 of the input conveyor 18 is provided with bores 201 in its corners for receiving the alignment pins 84 in their extended position. A chamber 202 is further formed in the plate 62, which is closed against the lower surface of the plate 62 by a porous plate 204. The chamber 202 is connected via a channel 206 to an overpressure / underpressure system (not shown), so that the chamber 202 can optionally be subjected to overpressure or underpressure.

Wie Fig. 2 weiter zeigt, ist die Referenzfläche 82 gleichfalls durch eine poröse Platte 208 abgedeckt, durch welche eine Kammer 209 gebildet ist. Diese Kann über einen Kanal 210 gleichfalls mit Überdruck oder mit Unterdruck beaufschlagt werden. Wie bereits erwähnt, sing die Stifte 84 beweglich geführt und können aus der Referenzfläche 81 ausgefahren werden, so daß sie aus dieser herausragen.As FIG. 2 further shows, the reference surface 82 is also covered by a porous plate 208, through which a chamber 209 is formed. This can also be subjected to overpressure or underpressure via a channel 210. As already mentioned, the pins 84 are movably guided and can be moved out of the reference surface 81 so that they protrude from it.

Der erste Arbeitsschritt zur Ausrichtung eines Folienelements besteht darin, die Eingabefördervorrichtung 18 mit der Platte 62 auf die Eingabestation 12 auszurichten und auf die Trägerplatte mit dem Folienelement oder einer mehrschichtigen Folienanordnung abzusenken. Durch Anlegen von Unterdruck an die Kammer 202 wird sodann das Folienelement angezogen, und anschließend wird die Eingabefördervorrichtung 18 angehoben und längs den Schienen 24 und 25 zur Ausrichtstation 14 bewegt.The first step in aligning a film element consists in aligning the input conveyor device 18 with the plate 62 on the input station 12 and lowering it onto the carrier plate with the film element or a multilayer film arrangement. The film element is then attracted by applying negative pressure to the chamber 202, and then the input conveyor device 18 is raised and moved along the rails 24 and 25 to the alignment station 14.

Nun wird die Platte 62 auf die Referenzfläche 81 der Ausrichtstation 14 abgesenkt, und während sie sich der Referenzfläche 81 nähert, wird die Kammer 209 mit Druckluft beaufschlagt (vergl. Fig. 2). Gleichzeitig wird in der Kammer 202 von Unterdrück auf Überdruck umgeschaltet, mit der Folge, daß nun sowohl von der Oberseite als auch von der Unterseite ein Druckluftfilm auf das Folienelement 12 wirksam ist. Der beiderseits wirksame Luftdruck wird hierbei so bemessen, daß sich das Folienelement 212 in einer stabilen Lage "schwimmend" zwischen den porösen Platten 204 und 208 befindet. Werden nun die Richtstifte 84 aus der Referenzfläche 81 ausgefahren, so bewirken diese infolge der abgerundeten Gestaltung ihrer Spitzen beim Erreichen der entsprechenden Löcher im Folienelement 212 eine Korrektur der Lage des Folienelements, wenn die Lage der Löcher nicht genau mit derjenigen der Richtstifte 84 übereinstimmt. Eine derartige Korrektur der Lage des Folienelements 212 erfolgt infolge der schwimmenden Lagerung des Folienelements widerstandsfrei. Unter der Voraussetzung einer genauen Übereinstimmung der Abstände der Richtstifte 84 einerseits und der Abstände der Löcher im Folienelement andererseits ist daher eine Beanspruchung des Folienelements oder eine Beschädigung desselben im Verlauf des Ausrichtvorganges ausgeschlossen. Darüber hinaus gewährleisten die Druckzonen unterhalb und oberhalb des Folienelements dessen ebene Führung, so daß kein Durchhängen des Zentralbereiches mit den daraus resultierenden Nachteilen befürchtet werden muß.Now the plate 62 is lowered onto the reference surface 81 of the alignment station 14, and as it approaches the reference surface 81, the chamber 209 is pressurized with compressed air (see FIG. 2). At the same time, a switch is made in the chamber 202 from negative pressure to positive pressure, with the result that a compressed air film is now effective on the film element 12 both from the top and from the bottom. The air pressure effective on both sides is dimensioned in such a way that the film element 212 is "floating" in a stable position between the porous plates 204 and 208. If the alignment pins 84 are now moved out of the reference surface 81, as a result of the rounded design of their tips, when the corresponding holes in the film element 212 are reached, they correct the position of the film element if the position of the holes does not exactly match that of the alignment pins 84. Such a correction of the position of the film element 212 takes place without resistance due to the floating mounting of the film element. Provided that the distances between the alignment pins 84 on the one hand and the distances between the holes in the film element on the other hand are exactly the same, stress on the film element or damage to it in the course of the alignment process is therefore excluded. In addition, the pressure zones below and above the film element ensure its level guidance, so that no sagging of the central area with the resulting disadvantages must be feared.

Sind die Richtstifte 84 ausgefahren und der Ausrichtvorgang beendet, so wird der Überdruck in der Kammer 209 abgestellt, oder die Differenz des druckes oberhalb des Folienelements und unterhalb des Folienelements so bemessen, daß das Folienelement auf der Referenzfläche 81 zu liegen kommt. Dieser Vorgang kann unterstützt werden durch eine entsprechende weitere Abwärtsbewegung der Eingabefördervorrichtung 18. Wenn das Folienelement 212 auf der Referenzfläche 81 aufliegt, wird die Eingabefördervorrichtung 18 wieder angehoben und zur Eingabestation 12 zurückgefahren, wo sie ein weiteres Folienelement aufnehmen kann.When the alignment pins 84 have been extended and the alignment process has ended, the excess pressure in the chamber 209 is switched off, or the difference in pressure above the film element and below the film element is dimensioned such that the film element on the Reference surface 81 comes to rest. This process can be supported by a corresponding further downward movement of the input conveyor device 18. When the film element 212 rests on the reference surface 81, the input conveyor device 18 is raised again and moved back to the input station 12, where it can receive another film element.

Gleichzeitig wird die Ausgabefördervorrichtung 20 zur Ausrichtstation 14 bewegt und auf das Folienelement ausgerichtet, und sodann wird die Platte 72 auf das Folienelement abgesenkt. Nun wird die Ausgabe förder vorrichtung 2'0 mit Unterdruck beaufschlagt, wieder angehoben und zur Ausgabestation 16 bewegt, wo das betreffende Folienelement, ggf. auf dort bereits ausgerichtet aufliegende weitere Folienschichten, abgelegt wird.At the same time, the output conveyor 20 is moved to the alignment station 14 and aligned with the film member, and then the plate 72 is lowered onto the film member. Now the output conveyor device 2'0 is pressurized with vacuum, raised again and moved to the output station 16, where the film element in question, possibly on further film layers already aligned there, is deposited.

Claims (8)

1. Method of aligning a flat, thin element, e.g. a plate, a foil etc., which first is positioned in parallel to a reference surface and suspended, at a small distance from that surface, over a gas film, characterized in that while the gas film is maintained alignment pins that can be moved into and out of the reference surface are inserted into corresponding openings in the element, that subsequently, by reducing the overpressure, the element is brought into physical contact with the reference surface acting as a support, and that the alignment units are then withdrawn and thus disengaged from the element.
2. Device for carrying out the method as claimed in claim 1, comprising a transport device (18, 20) to transport the element (212) to an alignment station (14) and to remove the aligned element (212) positioned on the reference surface (81) of the alignment station (14), characterized in that alignment pins (84) are provided that can be moved into and out of the reference surface (81) of the alignment station (14) that is used as a support, and that under the reference surface (81) a chamber (209) that can be applied with overpressure is provided, the overpressure being used to produce the gas film.
3. Device as claimed in claim 2, characterized in that the transport device (18; 20) comprises a plate (62; 72) with a chamber (202; 209) arranged in the guide face of the plate (62; 71) and selectively switchable to underpressure and overpressure, which plate, by means of a horizontal drive (36, 38 to 43, 45; 51 to 53, 55) and a stroke drive (61 to 64; 71 to 74), is alignable to the reference surface (81) and adjustable in the direction of the normal to the reference surface (81).
4. Device as claimed in claim 3, characterized in that the horizontal drive for the plate is designed as a yoke (29; 39) shiftable on rails (24, 25) by means of guide bushings (26, 28; 36, 38), with a pulley drive (41 to 43, 45; 51 to 53, 55).
5. Device as claimed in claims 3 and 4, characterized in that the stoke drive of the plate (62; 72) is designed as a rack drive (61 to 64; 71 to 74) arranged at the yoke (29; 39).
6. Device as claimed in claim 2 and 3, characterized in that the guide surface of the plate (62, 72) is designed as a porous plate (204; 208) arranged between chamber (202; 209) and plate surface.
7. Device as claimed in claim 2, characterized in that for operating the alignment pins (84) a cam drive (100 to 124) is provided which acts on parallel bars (86, 87) carrying the alignment pins (84).
8. Device as claimed in claim 7, characterized in that the cam drive comprises a cam follower plate (109) co-acting with a cam disk (100), the cam follower plate having coupled to its horizontal flanges (111, 112) fork portions (114, 115) in rotatable supported drive arms (118, 119) connected on their other side with the bars (86, 87).
EP78101588A 1977-12-12 1978-12-07 Method and apparatus for aligning flat and thin workpieces Expired EP0002496B1 (en)

Applications Claiming Priority (2)

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US05/859,777 US4186918A (en) 1977-12-12 1977-12-12 Method and apparatus for locating and aligning flimsy sheets
US859777 1977-12-12

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EP0002496A1 EP0002496A1 (en) 1979-06-27
EP0002496B1 true EP0002496B1 (en) 1982-05-26

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EP0002496A1 (en) 1979-06-27
US4186918A (en) 1980-02-05
JPS5484269A (en) 1979-07-05
DE2861869D1 (en) 1982-07-15
JPS5644600B2 (en) 1981-10-20

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