EA200601429A1 - METHOD OF LASER CUTTING OF FRAGILE TRANSPARENT NONMETALLIC MATERIALS - Google Patents
METHOD OF LASER CUTTING OF FRAGILE TRANSPARENT NONMETALLIC MATERIALSInfo
- Publication number
- EA200601429A1 EA200601429A1 EA200601429A EA200601429A EA200601429A1 EA 200601429 A1 EA200601429 A1 EA 200601429A1 EA 200601429 A EA200601429 A EA 200601429A EA 200601429 A EA200601429 A EA 200601429A EA 200601429 A1 EA200601429 A1 EA 200601429A1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- cut
- laser beam
- glass
- thickness
- mirror
- Prior art date
Links
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
Изобретение относится к способу резки хрупких прозрачных неметаллических материалов, например стекла, лазерным лучом и может быть использовано в стекольной, электронной и других отраслях народною хозяйства. Сущность изобретения состоит в том, что резку хрупких прозрачных неметаллических материалов проводят путем воздействия на разрезаемый материал сфокусированным лазерным лучом или другим источником излучения с использованием отражающей излучение подложки, причем в разрезаемом материале создают два соосно фокусирующих излучения при многократном прохождении лазерного луча за счет двух вогнутых зеркал, расположенных асимметрично на противоположных сторонах материала. Расстояние между фокусами изменяют в зависимости от толщины разрезаемого материала. Нижнее и верхнее зеркала соединяют друг с другом через диэлектрический материал в единую систему посредством использования магнита или электромагнита. Нижнее и верхнее зеркала соединяют друг с другом в единую систему посредством использования магнита или электромагнита. Кроме этого, нижнее зеркало снабжено скользящей системой или роликами, позволяющими зеркалу при движении верхнего зеркала перемещаться соосно с ним. Изобретение позволяет во всем диапазоне толщин разрезаемого материала, например стекла толщиной 0,1-30 мм, получить более высокие точности реза до 50 мкм, более высокое качество (до 12 класса чистоты) разделяемых поверхностей на всех участках разрезаемого материала, как в массиве, так и на его краях.The invention relates to a method of cutting fragile transparent non-metallic materials, such as glass, laser beam and can be used in glass, electronic and other sectors of the national economy. The essence of the invention is that cutting brittle transparent non-metallic materials is carried out by exposing the material being cut with a focused laser beam or other radiation source using a substrate reflecting radiation, and in the material being cut two coaxially focusing radiation is created with repeated passage of the laser beam by two concave mirrors arranged asymmetrically on opposite sides of the material. The distance between the foci change depending on the thickness of the material being cut. The lower and upper mirrors are connected to each other through a dielectric material into a single system through the use of a magnet or an electromagnet. The lower and upper mirrors are connected to each other into a single system through the use of a magnet or an electromagnet. In addition, the lower mirror is equipped with a sliding system or rollers that allow the mirror to move coaxially with it when the upper mirror moves. The invention allows in the whole range of thickness of the material being cut, for example, glass with a thickness of 0.1-30 mm, to obtain higher cutting precisions up to 50 microns, higher quality (up to 12th grade of cleanliness) of the divided surfaces in all parts of the material being cut, both in the array and in and at its edges.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EA200601429A EA012311B1 (en) | 2006-08-16 | 2006-08-16 | Method for cutting brittle transparent non-metal materials by laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EA200601429A EA012311B1 (en) | 2006-08-16 | 2006-08-16 | Method for cutting brittle transparent non-metal materials by laser |
Publications (2)
Publication Number | Publication Date |
---|---|
EA200601429A1 true EA200601429A1 (en) | 2008-02-28 |
EA012311B1 EA012311B1 (en) | 2009-08-28 |
Family
ID=40848985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA200601429A EA012311B1 (en) | 2006-08-16 | 2006-08-16 | Method for cutting brittle transparent non-metal materials by laser |
Country Status (1)
Country | Link |
---|---|
EA (1) | EA012311B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU209801U1 (en) * | 2021-11-29 | 2022-03-23 | Валерий Иванович Ревенко | Device for laser cutting a sample of brittle non-metallic material |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6123592A (en) * | 1984-07-13 | 1986-02-01 | Akebono Brake Chuo Gijutsu Kenkyusho:Kk | Co2 laser processing |
US6211488B1 (en) * | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
WO2002048059A1 (en) * | 2000-12-15 | 2002-06-20 | Lzh Laserzentrum Hannover E.V. | Method for cutting components made of glass, ceramic, glass ceramic or the like by generating thermal ablation on the component along a cut zone |
RU2237622C2 (en) * | 2002-06-07 | 2004-10-10 | Кондратенко Владимир Степанович | Method for cutting of frangible non-metallic materials |
-
2006
- 2006-08-16 EA EA200601429A patent/EA012311B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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EA012311B1 (en) | 2009-08-28 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): AM AZ KZ KG MD TJ TM |
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MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): BY |
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PC4A | Registration of transfer of a eurasian patent by assignment | ||
PD4A | Registration of transfer of a eurasian patent in accordance with the succession in title | ||
MM4A | Lapse of a eurasian patent due to non-payment of renewal fees within the time limit in the following designated state(s) |
Designated state(s): RU |