EA044258B1 - COMPUTING DEVICE - Google Patents

Description

Field of technology

This invention relates to the field of data processing and, in particular, to a computing device with increased security.

State of the art

A computing device is an electronic device for high-speed computing, such as an electronic device configured to implement a particular algorithm and communicate with a remote server to obtain corresponding virtual money. Progress in modern industry is driving the development of automation and intelligent data processing in computing devices, resulting in various replacement products being introduced one after another. However, many designs of existing computing devices still have exposed connecting wires, which negatively affects not only their safety, but also their appearance.

The essence of the invention

An object of the present invention is to provide a computing device with increased security.

To solve the above object, the computing device described in the present invention includes a frame, a computing module, a control module, a power supply module and a heat dissipation module, wherein the computing module is located in the frame, the power supply module, the control module and the heat dissipation module are externally attached. frame, and the computing module includes a power supply interface, and the power supply module includes a connecting end of the power supply. The computing device also includes a connection box located on the top of the frame and a power supply module, wherein the power supply interface extends into the connection box from the top end of the frame, the power supply connection end extends into the connection box, and the power supply interface and the connection end power sources are connected in a junction box using a conductive busbar.

In one embodiment of the above-described computing device, the computing module includes a signal interface, the control module includes a signal connection end, the control module is located in a connection box, and the signal interface and the signal connection end are connected in the connection box via a signal wire.

In one embodiment of the computing device described above, the junction box includes a top skin sheet and a bottom skin body, wherein the top skin sheet covers the bottom skin body to seal the junction box.

In one embodiment of the computing device described above, the frame is an aluminum piece formed in one piece.

In one embodiment of the computing device described above, the frame includes a first side wall, a second side wall, a top wall, and a bottom wall. The first side wall and the second side wall are supported between the upper wall and the lower wall.

In one embodiment of the above-described computing device, the outer portion of the first side wall has a power supply guide rail disposed transversely, the power supply module holder is coupled to the first side wall via the power supply guide slide, and the power supply module is attached to the power supply module holder.

In one embodiment of the above-described computing device, the bottom wall has a lower computing board guide rail located transversely, and the computing module is configured to slide into or out of the frame along the lower computing board guide rail.

In one embodiment of the computing device described above, the computing module includes a heat sink having a groove configured to engage with a lower guide rail of the computing board.

In one embodiment of the above-described computing device, there is a transverse groove on the top wall, the power supply interface of the computing module projects above the frame through the groove and extends into the junction box, and the signal interface of the computing module projects above the frame through the groove and extends into the junction box.

In one embodiment of the above-described computing device, the upper wall has an upper computing board guide rail corresponding to a lower computing board guide rail, and the upper computing board guide rail is formed by extruding an aluminum material on the groove side.

In one embodiment of the above-described computing device, a plurality of computing modules are arranged in parallel, and a conductive bus is configured to connect the plurality of computing modules in series.

In one embodiment of the computing device described above, the heat dissipation module includes a first fan and a second fan. The frame is hollow at the front and

- 1 044258 rear ends. The first fan and the second fan are connected to the front end and the rear end of the frame, respectively, covering the front end and the rear end of the frame.

The present invention also provides a computing device including a frame, a computing module, a control module, a power supply module and a heat dissipation module, wherein the computing module is located in the frame and includes a power supply interface, and the power supply module includes a connecting end power supply. The computing device also includes a connection box connected to the frame, the power supply interface extending into the connection box from the frame, the power supply connection end extending into the connection box, the power supply interface and the power supply connection end being connected in the connection box by a conductive busbar, and the junction box has an access window connected to the frame.

In one embodiment of the above-described computing device, the frame has an access side for extending or retracting the entire computing module, and a junction box is located on the access side or on a side of the frame different from the access side.

In one embodiment of the computing device described above, a power supply module, a control module, and a heat dissipation module are located in a frame, or at least one of a power supply module, a control module, and a heat dissipation module forms part of the frame.

The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, which should not be construed as limiting the present invention.

Brief description of drawings

In fig. 1 is a three-dimensional design diagram of a computing device according to one embodiment of the present invention.

In fig. 2 is an exploded view of FIG. 1.

In fig. 3 is a three-dimensional diagram of a computing device structure with an open junction box top skin according to one embodiment of the present invention.

In fig. 4 is a three-dimensional diagram of a computing device structure with the junction box top skin removed, in accordance with one embodiment of the present invention.

In fig. 5 is a three-dimensional diagram of a computing device frame structure according to one embodiment of the present invention.

In fig. 6 is a three-dimensional diagram of the structure of a computing module of a computing device coupled to a frame according to one embodiment of the present invention.

In fig. 7 is a three-dimensional design diagram of a computing device according to one embodiment of the present invention.

In fig. 8 is a three-dimensional diagram of the structure of a computing module of a computing device coupled to a frame according to one embodiment of the present invention.

Item numbers:

100 - frame;

110 - first side wall;

111 - power supply guide;

120 - second side wall;

130 - upper wall;

131 - groove;

132 - upper guide slide of the computing board;

140 - bottom wall;

141 - lower guide slide of the computing board;

200 - computing module;

210 - power supply interface;

220 - signal interface;

230 - heat sink;

231 - groove;

232 - groove;

240 - computing board;

300 - control module;

310 - signal connecting end;

400 - power supply module;

410 - connecting end of the power source;

500 - heat dissipation module;

510 - first fan;

520 - second fan;

- 2 044258

600 - junction box;

600S - access window;

610 - upper skin sheet;

620 - lower casing body;

700 - conductive bus;

800 - power supply module holder;

900 - signal wire;

X - transverse direction;

S1, S2, S3, S4 - side.

Carrying out the invention

The technical solutions according to the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments in order to better understand the objects, solutions and effects of the present invention, but are not intended to limit the scope of the appended claims in the present invention.

References herein are to the terms one embodiment, another embodiment, this embodiment, and the like. mean that the described embodiment may include specific features, structures, or characteristics, but each of the embodiments does not necessarily include those specific features, structures, or characteristics. Moreover, such expressions do not refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described within an embodiment, whether or not it is explicitly described, it will be clear to one of ordinary skill in the art to include such feature, structure, or characteristic in other embodiments. .

Certain terms are used in the specification and claims that follow to refer to specific assemblies or components, and it will be apparent to one skilled in the art that technically skilled users or manufacturers may refer to the same assembly or component using different terms. In the present specification and in the following claims, assemblies or components are distinguished not based on their name, but on the basis of the functions of such assemblies or components. The terms includes and contains, as used herein and in the following claims, are open-ended terms and, thus, should be interpreted as including, without limitation. In addition, the term connection as used herein includes any direct or indirect means of connection.

It should be noted that in the description of the present invention, the relative direction or location is indicated by a term such as transverse, longitudinal, on, under, in front, behind, left, right, vertical, horizontal, above, below, inside, outside and the like. refer to the relative direction or location shown in the accompanying drawings and are intended solely for convenience of describing the present invention and to simplify this description, but are not intended to indicate or imply that said apparatus or element must necessarily have a particular direction and is designed and operated in specific direction. Thus, relative direction or location should not be construed as limiting the present invention. For convenience and clarity of description, the order terms first, second, third, fourth, etc., referred to herein are used to distinguish an element, region or component from another identical or similar element, region or component, and not limitations of that element, area, or component.

In fig. 1 and fig. 2 is a three-dimensional structural diagram and an exploded view of a computing device, respectively, according to one embodiment of the present invention. The computing device according to the present invention includes a frame 100, a computing module 200, a control module 300, a power supply module 400, and a heat dissipation module 500. The computing module 200 is housed in the frame 100. The power supply module 400, the control module 300, and the heat dissipation module 500 are attached to the outside of the frame 100. For example, the power supply module 400 is attached to the side of the frame 100; the heat dissipation unit 500 is attached to the front end and the rear end or one of the ends of the frame 100; The control module 300 is housed in a sealed box on the top side of the frame 100.

The computing device according to the present invention also includes a junction box 600 mounted on the frame 100 and on the top side of the power supply module 400.

Preferably, the top of frame 100 is flush with the top of power supply module 400 to facilitate placement of junction box 600.

Preferably, as shown in FIG. 1, the left side S1 and the right side S2 of the junction box 600 are aligned, respectively, with the left side of the frame 100 and the right side of the power supply module 400. The front side S3 and the rear side S4 of the connection box 600 are aligned with the front side and the rear side of the power supply module 400, respectively. The overall design of a computing device is strictly defined.

As shown in FIG. 2 and fig. 3, in fig. 3 is a three-dimensional diagram of a computing device structure with an open junction box top skin according to one embodiment of the present invention. The control module 300 is located in a junction box 600 of the frame 100. The computing module 200 includes a power supply interface 210 that extends into the junction box 600 from an upper end of the frame 100. The power supply module 400 includes a power supply connection end 410 that extends into the junction box box 600 on its top side. The power supply connecting end 410 of the power supply module 400 and the power supply interface 210 of the computing module 200 are connected in the junction box 600 via a conductive bus 700.

As shown in FIG. 3 and fig. 4, in fig. 4 is a three-dimensional diagram of the design of a computing device with the top skin of the junction box removed to better show the design of the signal connection between the control module and the computing module, in accordance with one embodiment of the present invention. Junction box 600 includes an access window 600S that is coupled to frame 100. If necessary, compute module 200 can be removed from frame 100 by disconnecting conductive bus 700 and associated signal wires without disconnecting other frame structures such as junction box 600. How shown in Fig. 2-4, the computing module 200 includes a signal interface 220 that extends into a junction box 600 from an upper end of the frame 100. The control module 300 includes a signal coupling end 310 that extends into a junction box 600 on its top side. The signal connection end 310 of the signal module 30 and the signal interface 220 of the computing module 200 are electrically connected in the junction box 600 via a signal wire 900.

The computing device according to the present invention includes a sealable junction box. The control board and the control interface between the control board and the computing board are connected in a connection box, and the power supply and the power supply wire of the computing board are connected in the connection box. Thus, the power supply connecting wires and signal wires are prevented from being affected, which improves safety and improves appearance; In addition, a connection box is located at the upper end of the device to facilitate operations.

As shown in FIG. 2, the junction box 600 includes a top skin sheet 610 and a bottom skin body 620, wherein the top skin sheet 610 covers the bottom skin body 620 to seal the junction box 600.

In fig. 5 is a three-dimensional diagram of a computing device frame structure according to one embodiment of the present invention. The computing device frame 100 of the present invention is a one-piece aluminum piece that requires no assembly, is low in cost, and is highly durable. The frame 100 includes a first side wall 110, a second side wall 120, a top wall 130, and a bottom wall 140. The first side wall 110 and the second side wall 120 are supported between the top wall 130 and the bottom wall 140.

The first side wall 110, the second side wall 120, the top wall 130 and the bottom wall 140 form a peripheral wall of the frame 100, wherein the frame 100 is hollow at its front and rear ends. With reference to FIG. 2, the heat dissipation unit 500 includes a first fan 510 and a second fan 520. The first fan 510 and the second fan 520 are connected, respectively, to a front end and a rear end of the frame 100, covering the front end and the rear end of the frame 100.

The outer part of the first side wall 110 includes a power supply guide slide 111 located along the lateral direction X. Referring to FIG. 2, the power supply module holder 800 is connected to the first side wall 110 via the power supply guide slide 111, and the power supply module 400 is attached to the power supply module holder 800.

With reference to FIG. 5 and fig. 6, Fig. 6 is a three-dimensional diagram of the structure of a computing module of a computing device coupled to a frame according to one embodiment of the present invention. The bottom wall 140 includes a lower computing board guide 141 disposed along the lateral direction X, and the computing module 200 is retractable into or out of the frame 100 along the lower computing board guide 141.

The compute module 200 includes a heat sink 230 and a compute board 240. The heat sink 230 is attached to the compute board 240 to remove heat from the compute board 240. The heat sink 230 may be attached to one side or two sides of the compute board 240.

- 4 044258 In this embodiment, the heat sink 230 is attached to two sides of the compute board 240, i.e. the computing board 240 is located between two heat sinks 230. The bottom of the heat sink 230 has a groove 231 configured to cooperate with the lower guide slide 141 of the computing board. The groove 231 and the lower guide slide 141 of the compute board are configured to cooperate with each other so that the compute module 200 can be inserted into or out of the frame 100. In addition, the two ends of the guide rail have positioning and fixing structures such as positioning rails and positioning lugs. The positioning and fixing structures may alternatively be heat dissipation modules.

The groove 231 may be formed in only the bottom portion of one heat sink 230 or may be formed in the bottom portions of two heat sinks 230.

According to this invention, a guide is formed on the heat sink, i.e. The heat sink is used to support and slide, which can effectively prevent the computer board from being deformed and damaged.

On the top wall 130 there is a groove 131 located transversely. The power supply interface 210 and the signal interface 220 on the compute board 240 of the compute module 200 protrude above the frame 100 through a slot 131. As shown in FIG. 2, when the connection box 600 is connected to the upper end of the frame 100, the power supply interface 210 and the signal interface 220 are located in the connection box 600.

The upper wall 130 has an upper computing board guide slide 132 corresponding to a lower computing board guide slide 141 on the lower wall 140, and an upper computing board guide slide 132 is formed by extruding an aluminum material on the side of the groove 131. Accordingly, the upper end of the heat sink 230 has a groove 232, configured to interact with the upper guide slide 132 of the computing board. The upper guide skid and the lower guide skid work together to ensure precise and stable gliding.

The relative direction or location described above, designated by the term upper end or upper side, is the relative direction or location shown in the accompanying drawings, which also includes the outermost end of the side surface. As shown in FIG. 7, which is a three-dimensional diagram of the structure of a computing device according to one embodiment of the present invention, when the computing device shown in FIG. 1, lying on its side, the junction box 600 is located on one side of the frame 100. As shown in FIG. 8, which is a three-dimensional diagram of the design of a computing module of a computing device connected to a frame, according to one embodiment of the present invention, the computing module 200 is moved in or out through the top of the frame 100. In addition, to simplify the design of the chassis, the control module 300, the module 400 The power supply and heat dissipation module 500 may be housed in the frame 100 to ensure the integrity and cleanliness of the frame structure.

With reference to FIG. 2 and fig. 6, a plurality of computing modules 200 are arranged in parallel along a lateral direction X, and the control module 300 includes a plurality of control connection ends, each of which is connected to a signal interface of a corresponding computing module 200. Moreover, the conductive line 700 is configured to connect a plurality of computing modules 200 for connecting the computing modules 200 to the power supply module 400.

Of course, the present invention can also have many other embodiments. One skilled in the art can suggest various appropriate changes and variations to the present invention without departing from its ideas and spirit. However, such appropriate changes and variations shall be within the scope of the claims appended to the present invention.

Industrial applicability

The computing device according to the present invention includes a sealed junction box; wherein the power supply and the power supply wire of the computing board are connected in a junction box. In this way, the various connecting wires of the power supply are sealed inside the connection box and protected from impact, which not only improves safety and appearance, but also makes operations easier. The junction box has an access window connected to the frame. The entire compute module can be slid out of or into the frame without removing other frame structures such as the junction box, saving time and effort on maintenance.

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Claims (12)

CLAIM 1. A computing device comprising a frame, a computing module, a control module, a power supply module and a heat dissipation module, wherein the computing module is located in the frame, the power supply module, the control module and the heat dissipation module are attached outside the frame, the computing module contains a power supply interface, and the power supply module includes a connecting end of the power supply, the computing device also includes a connecting box located on the top of the frame, and a power supply module, wherein the power supply interface extends into the connecting box from the upper end of the frame, the connecting end of the power supply extends into the connecting end box, and the power supply interface and the connection end of the power supply are connected in the connection box by a conductive busbar, and the heat dissipation module contains a first fan and a second fan, the frame is hollow at the front and rear ends, the first fan and the second fan are connected, respectively, to the front end and the rear end of the frame, covering the front end and the rear end of the frame. 2. The computing device of claim 1, wherein the computing module comprises a signal interface, the signal interface extends to a junction box at a first location, the control module includes a signal connection end, the control module is located in the junction box at a second location different from the first location, and the signal interface and the signal connecting end are connected in a connection box through a signal wire. 3. The computing device of claim 1, wherein the junction box comprises an upper skin sheet and a lower skin body, wherein the upper skin sheet covers the lower skin body to seal the junction box. 4. The computing device according to claim 2, in which the frame is an aluminum part made in one piece. 5. The computing device of claim 4, wherein the frame comprises a first side wall, a second side wall, an upper wall, and a lower wall, wherein the first side wall and the second side wall are supported between the upper wall and the lower wall. 6. The computing device according to claim 5, wherein the outer portion of the first side wall has a power supply guide rail disposed transversely, the power supply module holder is connected to the first side wall via the power supply guide slide, and the power supply module is attached to the power supply module holder . 7. The computing device according to claim 5, in which the bottom wall has a lower guide slide of the computing board located transversely, and the computing module is designed to be pushed into the frame or pulled out of the frame along the lower guide slide of the computing board. 8. The computing device according to claim 7, wherein the computing module includes a heat sink having a groove configured to interact with a lower guide slide of the computing board. 9. The computing device according to claim 7, in which there is a groove located transversely on the top wall, the power supply interface of the computing module protrudes above the frame through said groove and passes into the junction box, and the signal interface of the computing module protrudes above the frame through the groove and passes into the junction box box. 10. The computing device as set forth in claim 9, wherein the upper wall has an upper computing board guide rail corresponding to a lower computing board guide rail, and the upper computing board guide rail is formed by extruding an aluminum material on the groove side. 11. A computing device according to any one of claims 1 to 10, in which a plurality of computing modules are arranged in parallel, and the conductive bus is configured to connect the plurality of computing modules in series. 12. A computing device containing a frame, -