DK91576A - METHOD OF PHOTOLITOGRAPHIC STRUCTURE OF HYBRID CIRCUIT RESISTANCE PATHS - Google Patents

METHOD OF PHOTOLITOGRAPHIC STRUCTURE OF HYBRID CIRCUIT RESISTANCE PATHS

Info

Publication number
DK91576A
DK91576A DK91576A DK91576A DK91576A DK 91576 A DK91576 A DK 91576A DK 91576 A DK91576 A DK 91576A DK 91576 A DK91576 A DK 91576A DK 91576 A DK91576 A DK 91576A
Authority
DK
Denmark
Prior art keywords
photolitographic
hybrid circuit
circuit resistance
resistance paths
paths
Prior art date
Application number
DK91576A
Other languages
Danish (da)
Inventor
G Berner
P Noel
L Schweri
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of DK91576A publication Critical patent/DK91576A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0317Thin film conductor layer; Thin film passive component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
DK91576A 1975-03-05 1976-03-03 METHOD OF PHOTOLITOGRAPHIC STRUCTURE OF HYBRID CIRCUIT RESISTANCE PATHS DK91576A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH275775A CH613556A5 (en) 1975-03-05 1975-03-05 Process for photolithographic patterning of resistor tracks in hybrid circuits

Publications (1)

Publication Number Publication Date
DK91576A true DK91576A (en) 1976-09-06

Family

ID=4240925

Family Applications (1)

Application Number Title Priority Date Filing Date
DK91576A DK91576A (en) 1975-03-05 1976-03-03 METHOD OF PHOTOLITOGRAPHIC STRUCTURE OF HYBRID CIRCUIT RESISTANCE PATHS

Country Status (6)

Country Link
CH (1) CH613556A5 (en)
DE (1) DE2512860C2 (en)
DK (1) DK91576A (en)
FR (1) FR2303444A1 (en)
GB (1) GB1535995A (en)
SE (1) SE417657B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2532472B1 (en) * 1982-08-31 1985-12-20 Lignes Telegraph Telephon METHOD FOR MANUFACTURING ELECTRICAL CONNECTIONS FOR HYBRID CIRCUIT AND HYBRID CIRCUIT COMPRISING SUCH CONNECTIONS
DE3708832A1 (en) * 1987-03-18 1988-09-29 Siemens Ag Wet-chemical patterning of hafnium boride layers
FR2648232B1 (en) 1989-06-09 1991-09-27 Erg METHOD AND DEVICE FOR IN SITU MEASUREMENT OF SWELLING CHARACTERISTICS OF A SOIL

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457148A (en) * 1964-10-19 1969-07-22 Bell Telephone Labor Inc Process for preparation of stabilized metal film resistors
CH576739A5 (en) * 1972-08-25 1976-06-15 Ciba Geigy Ag

Also Published As

Publication number Publication date
DE2512860A1 (en) 1976-09-23
SE7602098L (en) 1976-09-06
CH613556A5 (en) 1979-09-28
FR2303444A1 (en) 1976-10-01
DE2512860C2 (en) 1986-06-19
FR2303444B1 (en) 1980-01-25
GB1535995A (en) 1978-12-13
SE417657B (en) 1981-03-30

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment