DK3275295T3 - Fremgangsmåde til fremstilling af et kredsløb til et hørehjælpemiddel - Google Patents

Fremgangsmåde til fremstilling af et kredsløb til et hørehjælpemiddel Download PDF

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Publication number
DK3275295T3
DK3275295T3 DK16714303.1T DK16714303T DK3275295T3 DK 3275295 T3 DK3275295 T3 DK 3275295T3 DK 16714303 T DK16714303 T DK 16714303T DK 3275295 T3 DK3275295 T3 DK 3275295T3
Authority
DK
Denmark
Prior art keywords
procedure
manufacturing
circuit
hearing aid
hearing
Prior art date
Application number
DK16714303.1T
Other languages
English (en)
Inventor
Holger Kral
Björn Freels
Johannes Kuhn
Stefanie Beyfuss
Original Assignee
Sivantos Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sivantos Pte Ltd filed Critical Sivantos Pte Ltd
Application granted granted Critical
Publication of DK3275295T3 publication Critical patent/DK3275295T3/da

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
DK16714303.1T 2015-03-25 2016-03-21 Fremgangsmåde til fremstilling af et kredsløb til et hørehjælpemiddel DK3275295T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015205431.4A DE102015205431A1 (de) 2015-03-25 2015-03-25 Verfahren zur Herstellung einer Schaltung
PCT/EP2016/056146 WO2016150912A1 (de) 2015-03-25 2016-03-21 Verfahren zur herstellung einer schaltung

Publications (1)

Publication Number Publication Date
DK3275295T3 true DK3275295T3 (da) 2023-03-20

Family

ID=55661380

Family Applications (1)

Application Number Title Priority Date Filing Date
DK16714303.1T DK3275295T3 (da) 2015-03-25 2016-03-21 Fremgangsmåde til fremstilling af et kredsløb til et hørehjælpemiddel

Country Status (6)

Country Link
US (1) US10701810B2 (da)
EP (1) EP3275295B1 (da)
CN (1) CN107535053A (da)
DE (1) DE102015205431A1 (da)
DK (1) DK3275295T3 (da)
WO (1) WO2016150912A1 (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015205431A1 (de) * 2015-03-25 2016-09-29 Sivantos Pte. Ltd. Verfahren zur Herstellung einer Schaltung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3138850A (en) * 1956-12-04 1964-06-30 Cosmocord Ltd Method of making a transducer element
US4255469A (en) * 1979-07-02 1981-03-10 Hughes Aircraft Company Process for selectively applying a conformal coating with a masking tape having an imbedded wire cutting edge
US6060683A (en) * 1998-09-22 2000-05-09 Direct Radiography Corp. Selective laser removal of dielectric coating
JP3643743B2 (ja) * 2000-01-28 2005-04-27 三洋電機株式会社 実装基板
JP4282724B2 (ja) 2007-02-20 2009-06-24 日本テキサス・インスツルメンツ株式会社 マイクロボールマウンタ用の振込みマスク
KR20110113482A (ko) * 2010-04-09 2011-10-17 (주)비엠알테크놀러지 직접 증착 방식에 의한 방사선 이미지 센서의 제조방법
EP2850923B1 (en) * 2012-05-18 2016-04-27 Advanced Bionics AG Printed circuit board apparatus and methods of making the same
US9374891B2 (en) * 2012-06-20 2016-06-21 Sivantos Pte. Ltd. Injection moulded circuit carrier having an integrated circuit board
CN104994965A (zh) * 2013-01-08 2015-10-21 Hzo股份有限公司 用于施涂保护性涂层的掩蔽基底
DE102015205431A1 (de) * 2015-03-25 2016-09-29 Sivantos Pte. Ltd. Verfahren zur Herstellung einer Schaltung

Also Published As

Publication number Publication date
US10701810B2 (en) 2020-06-30
EP3275295B1 (de) 2023-01-18
EP3275295A1 (de) 2018-01-31
DE102015205431A1 (de) 2016-09-29
CN107535053A (zh) 2018-01-02
US20180020555A1 (en) 2018-01-18
WO2016150912A1 (de) 2016-09-29

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