DK2684D0 - Fremgangsmade til fremstilling af en printplade - Google Patents
Fremgangsmade til fremstilling af en printpladeInfo
- Publication number
- DK2684D0 DK2684D0 DK0026/84A DK2684A DK2684D0 DK 2684 D0 DK2684 D0 DK 2684D0 DK 0026/84 A DK0026/84 A DK 0026/84A DK 2684 A DK2684 A DK 2684A DK 2684 D0 DK2684 D0 DK 2684D0
- Authority
- DK
- Denmark
- Prior art keywords
- procedure
- manufacturing
- printing plate
- printing
- plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US37483782A | 1982-05-05 | 1982-05-05 | |
US37483782 | 1982-05-05 | ||
PCT/US1983/000625 WO1983003944A1 (en) | 1982-05-05 | 1983-04-27 | High density printed wiring board |
US8300625 | 1983-04-27 |
Publications (4)
Publication Number | Publication Date |
---|---|
DK2684A DK2684A (da) | 1984-01-04 |
DK2684D0 true DK2684D0 (da) | 1984-01-04 |
DK159710B DK159710B (da) | 1990-11-19 |
DK159710C DK159710C (da) | 1991-04-15 |
Family
ID=23478386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK002684A DK159710C (da) | 1982-05-05 | 1984-01-04 | Fremgangsmaade til fremstilling af en printplade ogprintplade fremstillet ved fremgangsmaaden |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0108116B1 (da) |
AU (1) | AU565755B2 (da) |
CA (1) | CA1203635A (da) |
DE (1) | DE3369627D1 (da) |
DK (1) | DK159710C (da) |
ES (1) | ES522079A0 (da) |
IL (1) | IL68564A (da) |
WO (1) | WO1983003944A1 (da) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4652903A (en) * | 1984-09-21 | 1987-03-24 | Scientific Atlanta, Inc. | Frequency generation for multiplexed analog component color television encoding and decoding |
US5374469A (en) * | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
DE19508835C1 (de) * | 1995-03-11 | 1996-04-25 | Freudenberg Carl Fa | Verfahren zur Herstellung von Leiterplatten mit leitfähigen Sacklöchern |
JP3299679B2 (ja) * | 1996-12-27 | 2002-07-08 | 新光電気工業株式会社 | 多層配線基板及びその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1378154A (fr) * | 1962-09-24 | 1964-11-13 | North American Aviation Inc | Interconnexions électriques pour panneaux de circuits imprimés |
US3391457A (en) * | 1965-03-10 | 1968-07-09 | Litton Systems Inc | Shielded circuit conductor |
DE2059425A1 (de) * | 1970-12-02 | 1972-06-22 | Siemens Ag | Partieller Aufbau von gedruckten Mehrlagenschaltungen |
-
1983
- 1983-04-27 WO PCT/US1983/000625 patent/WO1983003944A1/en active IP Right Grant
- 1983-04-27 AU AU15503/83A patent/AU565755B2/en not_active Ceased
- 1983-04-27 EP EP83901684A patent/EP0108116B1/en not_active Expired
- 1983-04-27 DE DE8383901684T patent/DE3369627D1/de not_active Expired
- 1983-05-03 IL IL68564A patent/IL68564A/xx unknown
- 1983-05-04 CA CA000427474A patent/CA1203635A/en not_active Expired
- 1983-05-04 ES ES522079A patent/ES522079A0/es active Granted
-
1984
- 1984-01-04 DK DK002684A patent/DK159710C/da not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ES8404599A1 (es) | 1984-04-16 |
EP0108116B1 (en) | 1987-01-28 |
DK159710C (da) | 1991-04-15 |
ES522079A0 (es) | 1984-04-16 |
IL68564A (en) | 1987-12-20 |
DE3369627D1 (en) | 1987-03-05 |
EP0108116A1 (en) | 1984-05-16 |
WO1983003944A1 (en) | 1983-11-10 |
CA1203635A (en) | 1986-04-22 |
DK159710B (da) | 1990-11-19 |
DK2684A (da) | 1984-01-04 |
IL68564A0 (en) | 1983-09-30 |
AU1550383A (en) | 1983-11-21 |
AU565755B2 (en) | 1987-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PBP | Patent lapsed |