DK2032907T3 - Varm køling til elektronik - Google Patents

Varm køling til elektronik Download PDF

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Publication number
DK2032907T3
DK2032907T3 DK06774031.6T DK06774031T DK2032907T3 DK 2032907 T3 DK2032907 T3 DK 2032907T3 DK 06774031 T DK06774031 T DK 06774031T DK 2032907 T3 DK2032907 T3 DK 2032907T3
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DK
Denmark
Prior art keywords
air
water
cooling
heat exchanger
temperature
Prior art date
Application number
DK06774031.6T
Other languages
English (en)
Inventor
Andrew Carlson
William Whitted
Gerald Aigner
Donald L Beaty
Jimmy Clidaras
William Hamburgen
Original Assignee
Google Llc
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Filing date
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Application granted granted Critical
Publication of DK2032907T3 publication Critical patent/DK2032907T3/da

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/0001—Control or safety arrangements for ventilation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0212—Condensation eliminators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/22—Means for preventing condensation or evacuating condensate
    • F24F2013/221—Means for preventing condensation or evacuating condensate to avoid the formation of condensate, e.g. dew
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/54—Free-cooling systems

Claims (11)

1. En metode til at skabe nedkølet luft til elektronisk udstyr, bestående af: opvarmning af luft i en beholder, der indeholder elektronisk udstyr (106), ved at luften føres henover det elektroniske udstyr (106), hvorved luften opvarmes fra 25° Celsius til mere end 45° celsius, hvorved det elektroniske udstyr består af en række serverrack (102) i et datacenter (101); indsamling af den opvarmede luft fra beholderen, der indeholder det elektroniske udstyr (106); nedkøling af den opvarmede luft med mere end 15° celsius i en luft-til-vand-varmeveksler (112); indføring af kølende vand til luft-til-vand-varmeveksleren (112) med en temperatur på mellem 15-35° celsius og over dugpunktstemperatur for den opvarmede luft; og tilbageføring af vandet fra luft-til-vand-varmeveksleren (112) og overførsel af varme ved anvendelse af en vand-til-vand-varmeveksler (122) i flydende kontakt med en fri, kølende vandkilde fra det tilbageførte vand til vand, der kommer fra den frie kølende vandkilde.
2. Metoden i henhold til patentkrav 1, hvori trinnet til at indfange den opvarmede luft består af indfangning af primært kun den opvarmede luft og nærmest ingen indfangning af luft, der ikke kommer fra beholderen, som indeholder det elektroniske udstyr (106).
3. Metoden i henhold til patentkrav 1, hvori det kølende vand kommer tilbage fra luft-til-vand-varmeveksleren (112) med en temperatur på over 40° celsius.
4. Metoden i henhold til patentkrav 1, der yderligere består af at vand tilbagesendes fra luft-til-vand-varmeveksleren (112), hvorved temperaturen på det indførte vand er mere end 15° celsius koldere end temperaturen på det tilbagevendende vand.
5. Metoden i henhold til patentkrav 1, hvori den frie, kølende vandkilde består af et eller flere køletårne (118).
6. Metoden i henhold til patentkrav 1, hvori temperaturen på det tilbagevendende vand er mere end 10° celsius varmere end vandet, der indføres fra den frie, kølende vandkilde.
7. Metoden i henhold til patentkrav 1, hvorved vandet, der indføres fra den frie, kølende vandkilde, defineres ved et første temperaturdelta fra overførslen af varme, og vandet, der tilbagesendes fra luft-til-vand-varmeveksleren (112), definerer et andet temperaturdelta, hvorved det første temperaturdelta er mere end 30 procent mindre end det andet temperaturdelta.
8. Et system til at indføre nedkølet luft til elektronisk udstyr med en metode i henhold til patentkrav 1, der består af: et datacenter (101), der indeholder elektronisk udstyr, som består af en række serverrack (102), hvorved systemet er konfigureret til at føre luft henover elektronisk udstyr, således at luften opvarmes fra 25° Celsius til mere end 45° celsius; en fri, kølende vandkilde; en vand-til-vand-varmeveksler (122) i flydende forbindelse med den frie, kølende vandkilde; og en luft-til-vand-varmeveksler (112) i flydende forbindelse med vand-til-vand-varmeveksleren (122) og placeret til at modtage opvarmet luft fra det elektroniske udstyr, hvorved luft-til-vand-varmeveksleren (112) er konfigureret til at overføre varme fra den opvarmede luft til kølende vand, hvorved vand-til-vand-varmeveksleren (122) er konfigureret til at overføre varme fra det kølende vand tilbagesendt fra luft-til-vand-varmeveksleren (112) til vandforsyningen fra den frie, kølende vandkilde og til at tilføre kølende vand til luft-til-vand-varmeveksleren (112), som har en temperatur på mellem 15-35° celsius og over dugpunktet for luften, der omgiver luft-til-vand-varmeveksleren.
9. Et system i henhold til patentkrav 8, hvori den frie, kølende vandkilde består af et køletårn (118).
10. Et system i henhold til patentkrav 8, hvori vand-til-vand-varmeveksleren er konfigureret til at nedkøle tilbagevendende vand fra vand-til-luft varmeveksleren med mere end 15° celsius.
11. Metoden i patentkrav 1 eller systemet i patentkrav 8, hvori datacentret (101) består af et arbejdsområde (106), der indeholder serverrack, og hvor disse serverrack er placeret i et antal parallelle rækker og monteret i lodrette rack (102a, 102b), hvori systemet yderligere består af en indblæsningsrist (108), der er placeret i arbejdsområdet (106) i midten afen række af rack, Hvorved luft-til-vand-varmeveksleren består af kølespoler (112a, 112b), der er placeret på modsatte sider af indblæsningsristen (108) nogenlunde lige med forsiden af rackene.
DK06774031.6T 2006-06-01 2006-06-27 Varm køling til elektronik DK2032907T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81066806P 2006-06-01 2006-06-01
PCT/US2006/024844 WO2007139558A1 (en) 2006-06-01 2006-06-27 Warm cooling for electronics

Publications (1)

Publication Number Publication Date
DK2032907T3 true DK2032907T3 (da) 2018-07-02

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US (5) US8209993B2 (da)
EP (1) EP2032907B1 (da)
CN (1) CN101523119B (da)
CA (1) CA2653806C (da)
DK (1) DK2032907T3 (da)
WO (1) WO2007139558A1 (da)

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