DK200100156U3 - Cooling element and cooling device - Google Patents

Cooling element and cooling device

Info

Publication number
DK200100156U3
DK200100156U3 DK200100156U DKBA200100156U DK200100156U3 DK 200100156 U3 DK200100156 U3 DK 200100156U3 DK 200100156 U DK200100156 U DK 200100156U DK BA200100156 U DKBA200100156 U DK BA200100156U DK 200100156 U3 DK200100156 U3 DK 200100156U3
Authority
DK
Denmark
Prior art keywords
cooling
cooling device
cooling element
Prior art date
Application number
DK200100156U
Other languages
Danish (da)
Inventor
Schlomka Georg
Original Assignee
Schlomka Georg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlomka Georg filed Critical Schlomka Georg
Application granted granted Critical
Publication of DK200100156U3 publication Critical patent/DK200100156U3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DK200100156U 2000-06-15 2001-06-14 Cooling element and cooling device DK200100156U3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20010663U DE20010663U1 (en) 2000-06-15 2000-06-15 Cooling element and cooling device

Publications (1)

Publication Number Publication Date
DK200100156U3 true DK200100156U3 (en) 2001-07-27

Family

ID=7942891

Family Applications (1)

Application Number Title Priority Date Filing Date
DK200100156U DK200100156U3 (en) 2000-06-15 2001-06-14 Cooling element and cooling device

Country Status (2)

Country Link
DE (1) DE20010663U1 (en)
DK (1) DK200100156U3 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004040069A (en) * 2002-07-01 2004-02-05 Chin Kuang Luo Heat dissipating device
DE10315299A1 (en) * 2003-04-04 2004-10-14 Hella Kg Hueck & Co. Housing for circuit board and power components, has deformable thermally-conductive medium arranged between circuit board and base of other half of housing
DE20307472U1 (en) 2003-05-14 2003-08-14 Richard Wöhr GmbH, 75339 Höfen Unit for cooling housings, equipment cabinets has multi-layer cooling body with metal base plate with higher coefficient of thermal conductivity than aluminum, side plate of e.g. aluminum
DE10335197B4 (en) * 2003-07-30 2005-10-27 Kermi Gmbh Cooling device for an electronic component, in particular for a microprocessor
DE102005016098A1 (en) * 2005-04-08 2006-10-12 Tq-Components Gmbh Passive cooling system for e.g. industrial computer, has heat distribution plate arranged on module of computer device and interlocked with cooling body, and heat generating component arranged on support unit
DE102008004961A1 (en) * 2008-01-18 2009-07-23 Marquardt Gmbh Cooling body for electrical switch of e.g. grinder, has area resting and/or assigned to heat source, and another area turned to cooling agent, where material for former area has heat conductivity higher than material for latter area
DE102009056290A1 (en) * 2009-11-30 2011-06-09 Alphacool Gmbh Device for cooling e.g. micro processor, arranged on printed circuit board i.e. graphic card, of computer, has connecting unit i.e. blind hole, cooperating with another connecting unit i.e. thread, for removable mounting of coolers
DE102011078460A1 (en) * 2011-06-30 2013-01-03 Robert Bosch Gmbh Electronic circuit for dissipation of heat loss components
DE102013219369A1 (en) * 2013-09-26 2015-03-26 Osram Opto Semiconductors Gmbh Electronic device and method for manufacturing an electronic device
DE102015215571A1 (en) * 2015-08-14 2017-02-16 Siemens Aktiengesellschaft Heat sink for an electronic component and method for its production
DE102015215570A1 (en) 2015-08-14 2017-02-16 Siemens Aktiengesellschaft Heat sink for an electronic component and method for its production

Also Published As

Publication number Publication date
DE20010663U1 (en) 2000-10-26

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