DK188483D0 - ADHESIVE COMPOSITION - Google Patents

ADHESIVE COMPOSITION

Info

Publication number
DK188483D0
DK188483D0 DK1884/83A DK188483A DK188483D0 DK 188483 D0 DK188483 D0 DK 188483D0 DK 1884/83 A DK1884/83 A DK 1884/83A DK 188483 A DK188483 A DK 188483A DK 188483 D0 DK188483 D0 DK 188483D0
Authority
DK
Denmark
Prior art keywords
adhesive composition
adhesive
composition
Prior art date
Application number
DK1884/83A
Other languages
Danish (da)
Other versions
DK165011B (en
DK188483A (en
DK165011C (en
Inventor
Gregg Reynolds
Original Assignee
Esdan Extrusion Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esdan Extrusion Pty Ltd filed Critical Esdan Extrusion Pty Ltd
Publication of DK188483D0 publication Critical patent/DK188483D0/en
Publication of DK188483A publication Critical patent/DK188483A/en
Publication of DK165011B publication Critical patent/DK165011B/en
Application granted granted Critical
Publication of DK165011C publication Critical patent/DK165011C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/02—Condensation polymers of aldehydes or ketones with phenols only of ketones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
DK188483A 1982-04-30 1983-04-27 ADHESIVE INCLUDING A HARMFUL RESIN, PROCEDURE FOR MANUFACTURING SUCH RESIN AND PROCEDURE FOR MIXING TWO PARTS DK165011C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPF380382 1982-04-30
AUPF380382 1982-04-30

Publications (4)

Publication Number Publication Date
DK188483D0 true DK188483D0 (en) 1983-04-27
DK188483A DK188483A (en) 1983-10-31
DK165011B DK165011B (en) 1992-09-28
DK165011C DK165011C (en) 1993-02-08

Family

ID=3769505

Family Applications (1)

Application Number Title Priority Date Filing Date
DK188483A DK165011C (en) 1982-04-30 1983-04-27 ADHESIVE INCLUDING A HARMFUL RESIN, PROCEDURE FOR MANUFACTURING SUCH RESIN AND PROCEDURE FOR MIXING TWO PARTS

Country Status (5)

Country Link
EP (1) EP0107684A1 (en)
DK (1) DK165011C (en)
NZ (1) NZ204048A (en)
WO (1) WO1983003832A1 (en)
ZA (1) ZA833048B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8708386D0 (en) * 1987-04-08 1987-05-13 Cesaroni A J Heat sealing of polyamides
US8765853B2 (en) 2007-04-04 2014-07-01 Ppg Industries Ohio, Inc. Coating compositions and methods for improving the adhesion of coatings to polymeric substrates

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1823127A (en) * 1925-10-21 1931-09-15 Ig Farbenindustrie Ag Manufacture of artificial resins
US3376262A (en) * 1967-07-10 1968-04-02 Chevron Res Phenol-formaldehyde resin modified with tetralin hydroperoxide and tetralone
US4234706A (en) * 1977-05-26 1980-11-18 General Electric Company Quinone-coupled polyphenylene oxides
US4188476A (en) * 1979-04-06 1980-02-12 E. I. Du Pont De Nemours And Company Aromatic polyester consisting essentially of p-oxybenzoyl units, terephthaloyl units, 2,6-dioxynaphthalene or 2,6-dioxyanthraquinone units and m-oxybenzoyl or 1,3-dioxyphenylene units
JPS56112961A (en) * 1980-02-13 1981-09-05 Mitsubishi Petrochem Co Ltd Thermosetting resin composition

Also Published As

Publication number Publication date
NZ204048A (en) 1986-05-09
EP0107684A1 (en) 1984-05-09
DK165011B (en) 1992-09-28
DK188483A (en) 1983-10-31
ZA833048B (en) 1984-01-25
WO1983003832A1 (en) 1983-11-10
DK165011C (en) 1993-02-08

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Legal Events

Date Code Title Description
AHS Application shelved for other reasons than non-payment
PBP Patent lapsed