DK188483A - Adhaesiv sammensaetning - Google Patents
Adhaesiv sammensaetning Download PDFInfo
- Publication number
- DK188483A DK188483A DK188483A DK188483A DK188483A DK 188483 A DK188483 A DK 188483A DK 188483 A DK188483 A DK 188483A DK 188483 A DK188483 A DK 188483A DK 188483 A DK188483 A DK 188483A
- Authority
- DK
- Denmark
- Prior art keywords
- adhesive composition
- adhesive
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/02—Condensation polymers of aldehydes or ketones with phenols only of ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPF380382 | 1982-04-30 | ||
AUPF380382 | 1982-04-30 |
Publications (4)
Publication Number | Publication Date |
---|---|
DK188483D0 DK188483D0 (da) | 1983-04-27 |
DK188483A true DK188483A (da) | 1983-10-31 |
DK165011B DK165011B (da) | 1992-09-28 |
DK165011C DK165011C (da) | 1993-02-08 |
Family
ID=3769505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK188483A DK165011C (da) | 1982-04-30 | 1983-04-27 | Adhaesiv omfattende en haerdelig harpiks, fremgangsmaade til fremstilling af en saadan harpiks og fremgangsmaade til sammenklaebning af to dele |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0107684A1 (da) |
DK (1) | DK165011C (da) |
NZ (1) | NZ204048A (da) |
WO (1) | WO1983003832A1 (da) |
ZA (1) | ZA833048B (da) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8708386D0 (en) * | 1987-04-08 | 1987-05-13 | Cesaroni A J | Heat sealing of polyamides |
US8765853B2 (en) | 2007-04-04 | 2014-07-01 | Ppg Industries Ohio, Inc. | Coating compositions and methods for improving the adhesion of coatings to polymeric substrates |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1823127A (en) * | 1925-10-21 | 1931-09-15 | Ig Farbenindustrie Ag | Manufacture of artificial resins |
US3376262A (en) * | 1967-07-10 | 1968-04-02 | Chevron Res | Phenol-formaldehyde resin modified with tetralin hydroperoxide and tetralone |
US4234706A (en) * | 1977-05-26 | 1980-11-18 | General Electric Company | Quinone-coupled polyphenylene oxides |
US4188476A (en) * | 1979-04-06 | 1980-02-12 | E. I. Du Pont De Nemours And Company | Aromatic polyester consisting essentially of p-oxybenzoyl units, terephthaloyl units, 2,6-dioxynaphthalene or 2,6-dioxyanthraquinone units and m-oxybenzoyl or 1,3-dioxyphenylene units |
JPS56112961A (en) * | 1980-02-13 | 1981-09-05 | Mitsubishi Petrochem Co Ltd | Thermosetting resin composition |
-
1983
- 1983-04-27 DK DK188483A patent/DK165011C/da not_active IP Right Cessation
- 1983-04-29 EP EP83901313A patent/EP0107684A1/en not_active Withdrawn
- 1983-04-29 WO PCT/AU1983/000052 patent/WO1983003832A1/en unknown
- 1983-04-29 NZ NZ204048A patent/NZ204048A/en unknown
- 1983-04-29 ZA ZA833048A patent/ZA833048B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DK188483D0 (da) | 1983-04-27 |
ZA833048B (en) | 1984-01-25 |
DK165011B (da) | 1992-09-28 |
EP0107684A1 (en) | 1984-05-09 |
WO1983003832A1 (en) | 1983-11-10 |
NZ204048A (en) | 1986-05-09 |
DK165011C (da) | 1993-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AHS | Application shelved for other reasons than non-payment | ||
PBP | Patent lapsed |