DK1816676T3 - Effekthalvledermodul - Google Patents
EffekthalvledermodulInfo
- Publication number
- DK1816676T3 DK1816676T3 DK07002025T DK07002025T DK1816676T3 DK 1816676 T3 DK1816676 T3 DK 1816676T3 DK 07002025 T DK07002025 T DK 07002025T DK 07002025 T DK07002025 T DK 07002025T DK 1816676 T3 DK1816676 T3 DK 1816676T3
- Authority
- DK
- Denmark
- Prior art keywords
- housing
- power semiconductor
- semiconductor module
- main surface
- later
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Bipolar Transistors (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006005445A DE102006005445A1 (de) | 2006-02-07 | 2006-02-07 | Leistungshalbleitermodul |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1816676T3 true DK1816676T3 (da) | 2008-10-06 |
Family
ID=37989155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK07002025T DK1816676T3 (da) | 2006-02-07 | 2007-01-31 | Effekthalvledermodul |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1816676B1 (da) |
AT (1) | ATE403234T1 (da) |
DE (2) | DE102006005445A1 (da) |
DK (1) | DK1816676T3 (da) |
ES (1) | ES2312145T3 (da) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009002993B4 (de) | 2009-05-11 | 2012-10-04 | Infineon Technologies Ag | Leistungshalbleitermodul mit beabstandeten Schaltungsträgern |
DE102013219245A1 (de) * | 2013-09-25 | 2015-03-26 | Siemens Aktiengesellschaft | Leistungsmodul mit Einfassung |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3521572A1 (de) * | 1985-06-15 | 1986-12-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit keramiksubstrat |
DE3610288A1 (de) * | 1986-03-26 | 1987-10-01 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
DE19630173C2 (de) * | 1996-07-26 | 2001-02-08 | Semikron Elektronik Gmbh | Leistungsmodul mit Halbleiterbauelementen |
JP2002026187A (ja) * | 2000-07-07 | 2002-01-25 | Sony Corp | 半導体パッケージ及び半導体パッケージの製造方法 |
-
2006
- 2006-02-07 DE DE102006005445A patent/DE102006005445A1/de not_active Withdrawn
-
2007
- 2007-01-31 EP EP07002025A patent/EP1816676B1/de active Active
- 2007-01-31 AT AT07002025T patent/ATE403234T1/de active
- 2007-01-31 DK DK07002025T patent/DK1816676T3/da active
- 2007-01-31 ES ES07002025T patent/ES2312145T3/es active Active
- 2007-01-31 DE DE502007000055T patent/DE502007000055D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
DE102006005445A1 (de) | 2007-08-16 |
EP1816676A1 (de) | 2007-08-08 |
ES2312145T3 (es) | 2009-02-16 |
DE502007000055D1 (de) | 2008-09-11 |
ATE403234T1 (de) | 2008-08-15 |
EP1816676B1 (de) | 2008-07-30 |
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