DK1455391T3 - Power semiconductor module with follower component - Google Patents
Power semiconductor module with follower componentInfo
- Publication number
- DK1455391T3 DK1455391T3 DK04003562T DK04003562T DK1455391T3 DK 1455391 T3 DK1455391 T3 DK 1455391T3 DK 04003562 T DK04003562 T DK 04003562T DK 04003562 T DK04003562 T DK 04003562T DK 1455391 T3 DK1455391 T3 DK 1455391T3
- Authority
- DK
- Denmark
- Prior art keywords
- power semiconductor
- semiconductor module
- follower component
- sensor
- base plate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Measuring Fluid Pressure (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A semiconductor power module has a base plate or direct mounting on a cooling body and comprises a housing (50), isolating substrate (20) with many isolated metal connections (24) to semiconductor elements and at least one sensor (40) connected to an external evaluation unit and electrically connected to the base plate. An independent claim is also included for a module as above in which the sensor is mounted on a second of the two main substrate surfaces.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10309302A DE10309302B4 (en) | 2003-03-04 | 2003-03-04 | Power semiconductor module with sensor component |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1455391T3 true DK1455391T3 (en) | 2007-07-30 |
Family
ID=32797792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK04003562T DK1455391T3 (en) | 2003-03-04 | 2004-02-18 | Power semiconductor module with follower component |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1455391B1 (en) |
AT (1) | ATE357741T1 (en) |
DE (2) | DE10309302B4 (en) |
DK (1) | DK1455391T3 (en) |
ES (1) | ES2282745T3 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005013762C5 (en) | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Electronic device and method for determining the temperature of a power semiconductor |
DE102007044143A1 (en) * | 2007-09-18 | 2009-04-02 | Behr-Hella Thermocontrol Gmbh | Electric consumer load i.e. ventilation fan motor of ventilation system for motor vehicle, controlling device, has temperature sensor coupled with drain-connection element of housing of metal oxide semiconductor power transistor |
DE102009024385B4 (en) * | 2009-06-09 | 2011-03-17 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a power semiconductor module and power semiconductor module with a connection device |
JP5517988B2 (en) * | 2011-04-22 | 2014-06-11 | 日立オートモティブシステムズ株式会社 | Engine starter |
JP6305519B2 (en) | 2013-04-26 | 2018-04-04 | アーベーベー・テクノロジー・アーゲー | Power semiconductor module |
DE102013223430A1 (en) * | 2013-11-18 | 2015-05-21 | BSH Hausgeräte GmbH | Device with a power electronics module for supplying an electrical load of a household appliance with electrical supply voltage, household appliance and method for producing such a device |
JP7380062B2 (en) * | 2019-10-18 | 2023-11-15 | 富士電機株式会社 | semiconductor module |
EP4340014A1 (en) * | 2022-09-15 | 2024-03-20 | Siemens Aktiengesellschaft | Arrangement with at least one passive component |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148523A (en) * | 1995-11-21 | 1997-06-06 | Toshiba Corp | Semiconductor device |
DE19630902B4 (en) * | 1996-08-01 | 2005-07-14 | Ixys Semiconductor Gmbh | Device for temperature monitoring in a power electronic device |
DE19745040C2 (en) * | 1997-02-10 | 2003-03-27 | Daimler Chrysler Ag | Arrangement and method for measuring a temperature |
KR100268665B1 (en) * | 1997-06-27 | 2000-10-16 | 윤종용 | Method and device for mounting lcd to printed circuit board in a portable communication terminal |
GB2337121B (en) * | 1998-05-09 | 2002-07-31 | Motorola Ltd | Temperature estimation arrangement and method |
DE10024516B4 (en) * | 2000-05-18 | 2006-03-09 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | The power semiconductor module |
WO2002054489A2 (en) * | 2000-12-29 | 2002-07-11 | Advanced Micro Devices, Inc. | Temperature measurement system and method |
-
2003
- 2003-03-04 DE DE10309302A patent/DE10309302B4/en not_active Expired - Fee Related
-
2004
- 2004-02-18 DK DK04003562T patent/DK1455391T3/en active
- 2004-02-18 EP EP04003562A patent/EP1455391B1/en not_active Expired - Lifetime
- 2004-02-18 DE DE502004003250T patent/DE502004003250D1/en not_active Expired - Lifetime
- 2004-02-18 ES ES04003562T patent/ES2282745T3/en not_active Expired - Lifetime
- 2004-02-18 AT AT04003562T patent/ATE357741T1/en active
Also Published As
Publication number | Publication date |
---|---|
DE10309302B4 (en) | 2007-09-27 |
ES2282745T3 (en) | 2007-10-16 |
DE10309302A1 (en) | 2004-09-30 |
DE502004003250D1 (en) | 2007-05-03 |
EP1455391B1 (en) | 2007-03-21 |
ATE357741T1 (en) | 2007-04-15 |
EP1455391A1 (en) | 2004-09-08 |
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