DK1381115T3 - Pressure switched power semiconductor relay - Google Patents

Pressure switched power semiconductor relay

Info

Publication number
DK1381115T3
DK1381115T3 DK03011570T DK03011570T DK1381115T3 DK 1381115 T3 DK1381115 T3 DK 1381115T3 DK 03011570 T DK03011570 T DK 03011570T DK 03011570 T DK03011570 T DK 03011570T DK 1381115 T3 DK1381115 T3 DK 1381115T3
Authority
DK
Denmark
Prior art keywords
power semiconductor
switched power
semiconductor relay
pressure switched
openings
Prior art date
Application number
DK03011570T
Other languages
Danish (da)
Inventor
Roberto Bellu
Paolo Salvati
Benito Sterpone
Original Assignee
Semikron Elektronik Gmbh Paten
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh Paten filed Critical Semikron Elektronik Gmbh Paten
Application granted granted Critical
Publication of DK1381115T3 publication Critical patent/DK1381115T3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4846—Connecting portions with multiple bonds on the same bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Conversion In General (AREA)
  • Electronic Switches (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

The relay has a ceramic substrate (10) with a structured metallised layer fitted with semiconductor elements, a 2-part housing (22,24) having openings (240) for fixing to a heat sink base, power and auxiliary connection elements (34,36) and a control device (50) fitted to the outside of the housing. The connection elements have spring sections and are received and fixed in openings and recesses provided by the cooperating housing parts upon snap-fitting them together.
DK03011570T 2002-07-11 2003-05-22 Pressure switched power semiconductor relay DK1381115T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10231219A DE10231219C1 (en) 2002-07-11 2002-07-11 Semiconductor relay has ceramic substrate carrying semiconductor elements, 2-part housing enclosing connection elements, heat sink base and control device

Publications (1)

Publication Number Publication Date
DK1381115T3 true DK1381115T3 (en) 2004-10-11

Family

ID=7714759

Family Applications (1)

Application Number Title Priority Date Filing Date
DK03011570T DK1381115T3 (en) 2002-07-11 2003-05-22 Pressure switched power semiconductor relay

Country Status (5)

Country Link
EP (1) EP1381115B1 (en)
AT (1) ATE270004T1 (en)
DE (2) DE10231219C1 (en)
DK (1) DK1381115T3 (en)
ES (1) ES2224088T3 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004021122B4 (en) * 2004-04-29 2007-10-11 Semikron Elektronik Gmbh & Co. Kg Arrangement in pressure contact with a power semiconductor module
DE102004025609B4 (en) * 2004-05-25 2010-12-09 Semikron Elektronik Gmbh & Co. Kg Arrangement in screw-type pressure contact with a power semiconductor module
DE102005024900B4 (en) 2004-06-08 2012-08-16 Fuji Electric Co., Ltd. power module
DE102004031623B4 (en) * 2004-06-30 2007-12-13 Infineon Technologies Ag Power semiconductor module with springy connection contact
DE102004037656B4 (en) 2004-08-03 2009-06-18 Infineon Technologies Ag Electronic module with optimized mounting capability and component arrangement with an electronic module
DE102004042367B4 (en) 2004-09-01 2008-07-10 Infineon Technologies Ag The power semiconductor module
DE102004050588B4 (en) * 2004-10-16 2009-05-20 Semikron Elektronik Gmbh & Co. Kg Arrangement with a power semiconductor component and with a contact device
DE102004057421B4 (en) * 2004-11-27 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Pressure-contacted power semiconductor module for high ambient temperatures and method for its production
DE102005017849B4 (en) * 2005-04-18 2012-11-08 Siemens Ag Electronic component
DE102006058694B4 (en) * 2006-12-13 2011-06-16 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with contact springs
DE102007010883A1 (en) * 2007-03-06 2008-09-18 Infineon Technologies Ag Power semiconductor device and method for its production
DE102007016222B3 (en) * 2007-04-04 2008-11-06 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module in pressure contact design and method for producing the same
DE102008034068B4 (en) * 2008-07-22 2019-07-18 Semikron Elektronik Gmbh & Co. Kg The power semiconductor module
DE102008048882A1 (en) 2008-09-25 2010-04-22 Rational Ag Direct plug-in connection system comprises power semiconductor module and housing, where power semiconductor module comprises circuit board with integrated conductor path to semiconductor element forming relay
DE102008057831B4 (en) * 2008-11-19 2010-09-16 Semikron Elektronik Gmbh & Co. Kg Arrangement with power semiconductor module and driver device
DE102009037257B4 (en) * 2009-08-12 2014-07-31 Semikron Elektronik Gmbh & Co. Kg Power semiconductor module with circuit carrier and load connection element and manufacturing method thereof
FR2951019B1 (en) 2009-10-07 2012-06-08 Valeo Etudes Electroniques POWER MODULE FOR MOTOR VEHICLE
DE102013113143B4 (en) * 2013-11-28 2016-04-21 Semikron Elektronik Gmbh & Co. Kg Power semiconductor device
DE102015103068B4 (en) * 2015-03-03 2019-05-02 Infineon Technologies Bipolar Gmbh & Co. Kg Power semiconductor module with improved mechanical support of the control connection element and associated mounting method
DE102015116639B4 (en) * 2015-10-01 2021-12-09 Semikron Elektronik Gmbh & Co. Kg Snap connection arrangement with a snap hook element and a snap hook counter element
EP3477792A1 (en) * 2017-10-27 2019-05-01 Wago Verwaltungsgesellschaft mbH Pickup connector and grounding contact for same
DE102022213003A1 (en) 2022-12-02 2024-06-13 Zf Friedrichshafen Ag Power module for a converter with twisted signal pin pairs for control signal routing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3903229A1 (en) * 1989-02-03 1990-08-09 Vdo Schindling Electronic circuit
DE4419005A1 (en) * 1994-05-31 1995-12-07 Hella Kg Hueck & Co Electronic load switch for motor vehicles
DE19647229C1 (en) * 1996-11-15 1998-02-12 Telefunken Microelectron Plate type component carrier to component carrier connector device for e.g. circuit board
DE29723167U1 (en) * 1997-06-16 1998-04-30 Murr-Elektronik GmbH, 71570 Oppenweiler Modular device
DE19733047A1 (en) * 1997-07-31 1999-02-18 Fahrzeugklimaregelung Gmbh Controller for an electric motor with control circuit and power semiconductor
DE10008572B4 (en) * 2000-02-24 2007-08-09 Infineon Technologies Ag Connecting device for power semiconductor modules

Also Published As

Publication number Publication date
ES2224088T3 (en) 2005-03-01
DE50300025D1 (en) 2004-07-29
EP1381115B1 (en) 2004-06-23
ATE270004T1 (en) 2004-07-15
EP1381115A1 (en) 2004-01-14
DE10231219C1 (en) 2003-05-22

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