DK1316997T3 - Convert to pressure contact - Google Patents

Convert to pressure contact

Info

Publication number
DK1316997T3
DK1316997T3 DK02026281T DK02026281T DK1316997T3 DK 1316997 T3 DK1316997 T3 DK 1316997T3 DK 02026281 T DK02026281 T DK 02026281T DK 02026281 T DK02026281 T DK 02026281T DK 1316997 T3 DK1316997 T3 DK 1316997T3
Authority
DK
Denmark
Prior art keywords
protrusions
contact
dimples
dimple
base
Prior art date
Application number
DK02026281T
Other languages
Danish (da)
Inventor
Thomas Frank
Original Assignee
Semikron Elektronik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik Gmbh filed Critical Semikron Elektronik Gmbh
Application granted granted Critical
Publication of DK1316997T3 publication Critical patent/DK1316997T3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Inverter Devices (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Secondary Cells (AREA)
  • Contacts (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Die Bonding (AREA)

Abstract

The device has a base body, a substrate carrying semiconducting components and contact elements for d.c. and a.c. voltage connections and a d.c. intermediate circuit board. At least one contact has protrusions and the counterpart has deformable dimples whose base area is only partly covered by the protrusions. The dimples are deformed by the protrusions so their common contact surface is at least one fifth of the base of a dimple. <??>The device has a base body, a substrate carrying semiconducting components connected correctly for the circuit and contact surfaces, contact elements for d.c. and a.c. voltage connections for contacting the contact surfaces and a d.c. intermediate circuit board. At least one contact has protrusions (11) and the counterpart has deformable dimples (4) whose base area is only partly covered by the protrusions. The dimples are deformed by the protrusions so that the common contact surface (12) of a dimple and protrusion is at least one fifth of the base of a dimple.
DK02026281T 2001-12-01 2002-11-27 Convert to pressure contact DK1316997T3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10159119A DE10159119B4 (en) 2001-12-01 2001-12-01 Inverter in pressure contact

Publications (1)

Publication Number Publication Date
DK1316997T3 true DK1316997T3 (en) 2008-02-25

Family

ID=7707751

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02026281T DK1316997T3 (en) 2001-12-01 2002-11-27 Convert to pressure contact

Country Status (5)

Country Link
EP (1) EP1316997B1 (en)
AT (1) ATE376253T1 (en)
DE (2) DE10159119B4 (en)
DK (1) DK1316997T3 (en)
ES (1) ES2292677T3 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5329423A (en) * 1993-04-13 1994-07-12 Scholz Kenneth D Compressive bump-and-socket interconnection scheme for integrated circuits
US5499924A (en) * 1993-07-12 1996-03-19 Kel Comporation Butt joint connector assembly
GB9400384D0 (en) * 1994-01-11 1994-03-09 Inmos Ltd Circuit connection in an electrical assembly
DE19942770A1 (en) * 1999-09-08 2001-03-15 Ixys Semiconductor Gmbh Power semiconductor module
DE10127947C1 (en) * 2001-08-22 2002-10-17 Semikron Elektronik Gmbh Circuit device for power semiconductor module has intermediate circuit board with DC and AC terminals coupled to conductor paths of substrate incorporated in base body

Also Published As

Publication number Publication date
EP1316997A2 (en) 2003-06-04
EP1316997A3 (en) 2006-02-08
EP1316997B1 (en) 2007-10-17
ATE376253T1 (en) 2007-11-15
DE50211078D1 (en) 2007-11-29
DE10159119B4 (en) 2005-02-17
DE10159119A1 (en) 2003-06-18
ES2292677T3 (en) 2008-03-16

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