DK114802B - Apparat til selektiv udstansning af arkformet materiale. - Google Patents

Apparat til selektiv udstansning af arkformet materiale.

Info

Publication number
DK114802B
DK114802B DK88265AA DK88265A DK114802B DK 114802 B DK114802 B DK 114802B DK 88265A A DK88265A A DK 88265AA DK 88265 A DK88265 A DK 88265A DK 114802 B DK114802 B DK 114802B
Authority
DK
Denmark
Prior art keywords
sheet material
selective punching
punching
selective
sheet
Prior art date
Application number
DK88265AA
Other languages
English (en)
Inventor
D Roshon
T Young
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of DK114802B publication Critical patent/DK114802B/da

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
    • G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
    • G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K15/00—Electron-beam welding or cutting
    • B23K15/08—Removing material, e.g. by cutting, by hole drilling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/40—Paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
DK88265AA 1964-02-20 1965-02-19 Apparat til selektiv udstansning af arkformet materiale. DK114802B (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US346215A US3293652A (en) 1964-02-20 1964-02-20 Selective piercing of sheet material

Publications (1)

Publication Number Publication Date
DK114802B true DK114802B (da) 1969-08-04

Family

ID=23358434

Family Applications (1)

Application Number Title Priority Date Filing Date
DK88265AA DK114802B (da) 1964-02-20 1965-02-19 Apparat til selektiv udstansning af arkformet materiale.

Country Status (5)

Country Link
US (1) US3293652A (da)
DE (1) DE1499376B2 (da)
DK (1) DK114802B (da)
GB (1) GB1021909A (da)
SE (1) SE325732B (da)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3382343A (en) * 1964-07-23 1968-05-07 Hrand M. Muncheryan Laser welding machine
US3325819A (en) * 1965-03-15 1967-06-13 Fraser Edmund Everrette Coherent light card marking system
US3440388A (en) * 1966-04-04 1969-04-22 Monsanto Co Method for machining with laser beam
US3629545A (en) * 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
US3898417A (en) * 1969-12-22 1975-08-05 Nat Steel Corp Continuous strip encoding
US4046986A (en) * 1973-10-09 1977-09-06 Applied Display Services, Inc. Apparatus for making printing plates and other materials having a surface in relief
DE2726454B2 (de) * 1977-06-11 1979-08-23 Hoesch Werke Ag, 4600 Dortmund Verfahren zum Kennzeichnen von bewegten Tafeln und Bändern
US4540392A (en) * 1983-12-23 1985-09-10 International Paper Company Method and apparatus to seal coated paperboard materials
US4772788A (en) * 1985-12-25 1988-09-20 Nippon Paint Co., Ltd. Corona discharge treating system
JPS63159445A (ja) * 1986-12-23 1988-07-02 Nippon Paint Co Ltd コロナ放電処理装置
JP2633670B2 (ja) * 1989-01-07 1997-07-23 三井石油化学工業株式会社 灌水チューブ及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1573174A (en) * 1926-02-16 Record-forming device
US2084848A (en) * 1933-11-17 1937-06-22 Jr William W Lasker Statistical card
US2143376A (en) * 1935-01-02 1939-01-10 Rca Corp Recording system
US2922688A (en) * 1952-06-28 1960-01-26 Edwin A Boyan Apparatus for recording electrically on heat-sensitive material
US2858073A (en) * 1957-03-18 1958-10-28 Taube Mortimer Coded record card
US3045905A (en) * 1959-05-21 1962-07-24 George J Tarasuk Punch card
US3074809A (en) * 1959-10-26 1963-01-22 Minnesota Mining & Mfg Heat-sensitive copying-paper
US3134892A (en) * 1960-08-06 1964-05-26 United Aircraft Corp Method and apparatus for the machining of material by means of a beam of charge carriers
BE620053A (da) * 1961-07-11
US3183518A (en) * 1961-12-04 1965-05-11 Ibm Record perforating apparatus
US3172989A (en) * 1962-07-27 1965-03-09 United Aircraft Corp Electron beam cutting control
US3181170A (en) * 1963-07-25 1965-04-27 Northrop Corp Optical display device

Also Published As

Publication number Publication date
DE1499376A1 (de) 1972-04-20
GB1021909A (en) 1966-03-09
DE1499376B2 (de) 1973-06-20
US3293652A (en) 1966-12-20
SE325732B (da) 1970-07-06

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