DK113089B - Method for encapsulating an electrical component. - Google Patents
Method for encapsulating an electrical component.Info
- Publication number
- DK113089B DK113089B DK239864A DK239864A DK113089B DK 113089 B DK113089 B DK 113089B DK 239864 A DK239864 A DK 239864A DK 239864 A DK239864 A DK 239864A DK 113089 B DK113089 B DK 113089B
- Authority
- DK
- Denmark
- Prior art keywords
- encapsulating
- electrical component
- electrical
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
- H01J5/22—Vacuum-tight joints between parts of vessel
- H01J5/26—Vacuum-tight joints between parts of vessel between insulating and conductive parts of vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0037—Solid sealing members other than lamp bases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0037—Solid sealing members other than lamp bases
- H01J2893/0041—Direct connection between insulating and metal elements, in particular via glass material
- H01J2893/0043—Glass-to-metal or quartz-to-metal, e.g. by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28444963A | 1963-05-31 | 1963-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
DK113089B true DK113089B (en) | 1969-02-17 |
Family
ID=23090264
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK239864A DK113089B (en) | 1963-05-31 | 1964-05-13 | Method for encapsulating an electrical component. |
Country Status (4)
Country | Link |
---|---|
DK (1) | DK113089B (en) |
GB (1) | GB1069907A (en) |
NL (1) | NL132463C (en) |
SE (1) | SE346178B (en) |
-
1964
- 1964-05-13 DK DK239864A patent/DK113089B/en unknown
- 1964-05-14 GB GB2014764A patent/GB1069907A/en not_active Expired
- 1964-05-25 NL NL6405833A patent/NL132463C/xx active
- 1964-05-29 SE SE659864A patent/SE346178B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
NL6405833A (en) | 1964-12-01 |
GB1069907A (en) | 1967-05-24 |
NL132463C (en) | 1971-05-17 |
SE346178B (en) | 1972-06-26 |
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