DK113089B - Method for encapsulating an electrical component. - Google Patents

Method for encapsulating an electrical component.

Info

Publication number
DK113089B
DK113089B DK239864A DK239864A DK113089B DK 113089 B DK113089 B DK 113089B DK 239864 A DK239864 A DK 239864A DK 239864 A DK239864 A DK 239864A DK 113089 B DK113089 B DK 113089B
Authority
DK
Denmark
Prior art keywords
encapsulating
electrical component
electrical
component
Prior art date
Application number
DK239864A
Other languages
Danish (da)
Inventor
K Coper
Original Assignee
Cons Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cons Electronics Ind filed Critical Cons Electronics Ind
Publication of DK113089B publication Critical patent/DK113089B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/003Apparatus or processes for encapsulating capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20Seals between parts of vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20Seals between parts of vessels
    • H01J5/22Vacuum-tight joints between parts of vessel
    • H01J5/26Vacuum-tight joints between parts of vessel between insulating and conductive parts of vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0033Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037Solid sealing members other than lamp bases
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0033Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037Solid sealing members other than lamp bases
    • H01J2893/0041Direct connection between insulating and metal elements, in particular via glass material
    • H01J2893/0043Glass-to-metal or quartz-to-metal, e.g. by soldering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Joining Of Glass To Other Materials (AREA)
DK239864A 1963-05-31 1964-05-13 Method for encapsulating an electrical component. DK113089B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28444963A 1963-05-31 1963-05-31

Publications (1)

Publication Number Publication Date
DK113089B true DK113089B (en) 1969-02-17

Family

ID=23090264

Family Applications (1)

Application Number Title Priority Date Filing Date
DK239864A DK113089B (en) 1963-05-31 1964-05-13 Method for encapsulating an electrical component.

Country Status (4)

Country Link
DK (1) DK113089B (en)
GB (1) GB1069907A (en)
NL (1) NL132463C (en)
SE (1) SE346178B (en)

Also Published As

Publication number Publication date
NL6405833A (en) 1964-12-01
GB1069907A (en) 1967-05-24
NL132463C (en) 1971-05-17
SE346178B (en) 1972-06-26

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