DK108410C - Fremgangsmåde til fremstilling af en ved stuetemperatur stabil og ved opvarmning hæderlig blanding på basis af et fast epoxyformstof. - Google Patents

Fremgangsmåde til fremstilling af en ved stuetemperatur stabil og ved opvarmning hæderlig blanding på basis af et fast epoxyformstof.

Info

Publication number
DK108410C
DK108410C DK271263AA DK271263A DK108410C DK 108410 C DK108410 C DK 108410C DK 271263A A DK271263A A DK 271263AA DK 271263 A DK271263 A DK 271263A DK 108410 C DK108410 C DK 108410C
Authority
DK
Denmark
Prior art keywords
basis
heating
preparation
room temperature
solid epoxy
Prior art date
Application number
DK271263AA
Other languages
Danish (da)
English (en)
Original Assignee
Allied Prod Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allied Prod Corp filed Critical Allied Prod Corp
Application granted granted Critical
Publication of DK108410C publication Critical patent/DK108410C/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DK271263AA 1962-06-08 1963-06-07 Fremgangsmåde til fremstilling af en ved stuetemperatur stabil og ved opvarmning hæderlig blanding på basis af et fast epoxyformstof. DK108410C (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US200924A US3288747A (en) 1962-06-08 1962-06-08 Molding composition of powdered epoxy resin, and filler coated with normally solid curing agent

Publications (1)

Publication Number Publication Date
DK108410C true DK108410C (da) 1967-12-04

Family

ID=22743761

Family Applications (1)

Application Number Title Priority Date Filing Date
DK271263AA DK108410C (da) 1962-06-08 1963-06-07 Fremgangsmåde til fremstilling af en ved stuetemperatur stabil og ved opvarmning hæderlig blanding på basis af et fast epoxyformstof.

Country Status (7)

Country Link
US (1) US3288747A (US07223432-20070529-C00017.png)
BE (1) BE633164A (US07223432-20070529-C00017.png)
CH (1) CH425228A (US07223432-20070529-C00017.png)
DK (1) DK108410C (US07223432-20070529-C00017.png)
ES (1) ES288650A1 (US07223432-20070529-C00017.png)
GB (1) GB1009478A (US07223432-20070529-C00017.png)
NL (2) NL293777A (US07223432-20070529-C00017.png)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3388185A (en) * 1964-02-20 1968-06-11 Westinghouse Electric Corp Solid epoxide coating compositions containing a mixture of mono and polyfunctional anhydrides
GB1141405A (en) * 1965-09-27 1969-01-29 Matsushita Electric Ind Co Ltd Insulating method for electrical machinery and apparatus
US3485789A (en) * 1966-05-20 1969-12-23 Gen Electric Pulverulent coating compositions and fluidized bed coating method
US3963666A (en) * 1971-06-15 1976-06-15 Ciba-Geigy Corporation Storage-stable, quick-curing epoxide resin moulding materials
US3996175A (en) * 1971-06-25 1976-12-07 Ciba-Geigy Corporation Storage-stable, quick-curing epoxide resin moulding materials
US3923725A (en) * 1972-09-29 1975-12-02 Hitachi Ltd Method for forming epoxy resin products
US4146525A (en) * 1977-06-20 1979-03-27 Minnesota Mining And Manufacturing Company High strength ceramic-polymer composites
US4826896A (en) * 1987-03-19 1989-05-02 The Dexter Corporation Encapsulating electronic components
US5084501A (en) * 1988-11-07 1992-01-28 Armstrong World Industries, Inc. Highly filled resin powder
DE4327570A1 (de) * 1993-08-17 1995-04-20 Bayer Ag Rieselfähige Preßmassen, Verfahren zu deren Herstellung und ihre Verwendung
US6165558A (en) * 1996-02-02 2000-12-26 Vantico, Inc. Storage-stable moulding powder based on epoxy resins
KR100571136B1 (ko) 1997-12-08 2006-04-17 반티코 게엠베하 앤드 코.케이지 물에 영향을 받지 않는 에폭시 수지 경화촉진제인 노볼락
EP1668057A1 (de) * 2003-09-29 2006-06-14 Siemens Aktiengesellschaft Harzformulierung, verwendungen dazu und aus der formulierung hergestellter formkörper
US7485242B2 (en) * 2004-01-23 2009-02-03 Printar Ltd Reactive fine particles
US7763316B2 (en) * 2006-05-18 2010-07-27 Fairmount Minerals, Inc. No hexa shell sand
US7851342B2 (en) * 2007-03-30 2010-12-14 Intel Corporation In-situ formation of conductive filling material in through-silicon via

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2773048A (en) * 1952-08-25 1956-12-04 Honeywell Regulator Co Epoxy resin composition containing para, para' diamino diphenylmethane
US3000750A (en) * 1953-03-06 1961-09-19 Dehydag Dentsche Hydrierwerke Process of preparing dispersions of pulverulent material and preparations obtained thereby
NL95050C (US07223432-20070529-C00017.png) * 1953-07-29
US2866768A (en) * 1955-03-18 1958-12-30 Honeywell Regulator Co Epoxy molding composition and method of molding with same

Also Published As

Publication number Publication date
CH425228A (fr) 1966-11-30
DE1545191B2 (de) 1972-09-28
DE1545191A1 (de) 1970-03-05
GB1009478A (en) 1965-11-10
US3288747A (en) 1966-11-29
NL293777A (US07223432-20070529-C00017.png)
BE633164A (US07223432-20070529-C00017.png)
NL134842C (US07223432-20070529-C00017.png)
ES288650A1 (es) 1963-10-16

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