DK1070444T3 - Method and apparatus for making thin-layer structures - Google Patents

Method and apparatus for making thin-layer structures

Info

Publication number
DK1070444T3
DK1070444T3 DK99924725T DK99924725T DK1070444T3 DK 1070444 T3 DK1070444 T3 DK 1070444T3 DK 99924725 T DK99924725 T DK 99924725T DK 99924725 T DK99924725 T DK 99924725T DK 1070444 T3 DK1070444 T3 DK 1070444T3
Authority
DK
Denmark
Prior art keywords
layer structures
making thin
thin
making
structures
Prior art date
Application number
DK99924725T
Other languages
Danish (da)
Inventor
Hans Koch
Wolfhard Semmler
Original Assignee
B R Deutschland Vertr D Bundes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19817530A external-priority patent/DE19817530C2/en
Application filed by B R Deutschland Vertr D Bundes filed Critical B R Deutschland Vertr D Bundes
Application granted granted Critical
Publication of DK1070444T3 publication Critical patent/DK1070444T3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DK99924725T 1998-04-09 1999-03-25 Method and apparatus for making thin-layer structures DK1070444T3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19817530A DE19817530C2 (en) 1998-04-09 1998-04-09 Process for the production of thin-film structures
US9091898P 1998-06-29 1998-06-29
PCT/DE1999/000958 WO1999053738A1 (en) 1998-04-09 1999-03-25 Method and device for producing thin-layer structures

Publications (1)

Publication Number Publication Date
DK1070444T3 true DK1070444T3 (en) 2002-07-22

Family

ID=26045627

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99924725T DK1070444T3 (en) 1998-04-09 1999-03-25 Method and apparatus for making thin-layer structures

Country Status (3)

Country Link
EP (1) EP1070444B1 (en)
DK (1) DK1070444T3 (en)
WO (1) WO1999053738A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0030095D0 (en) * 2000-12-09 2001-01-24 Xaar Technology Ltd Method of ink jet printing
EP1223615A1 (en) * 2001-01-10 2002-07-17 Eidgenössische Technische Hochschule Zürich A method for producing a structure using nanoparticles
US7682970B2 (en) 2003-07-16 2010-03-23 The Regents Of The University Of California Maskless nanofabrication of electronic components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3047884A1 (en) * 1980-12-18 1982-07-15 Siemens AG, 1000 Berlin und 8000 München Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate
CH673920A5 (en) * 1987-05-19 1990-04-12 Rino Doriguzzi
JPH03504910A (en) * 1989-03-23 1991-10-24 ジビン，キリル　ペトロビチ Methods of manufacturing integrated circuits and related devices
JPH03239551A (en) * 1990-02-15 1991-10-25 Matsushita Electric Works Ltd Printing method of printed-wiring board

Also Published As

Publication number Publication date
EP1070444B1 (en) 2002-04-17
EP1070444A1 (en) 2001-01-24
WO1999053738A1 (en) 1999-10-21

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