DK0734459T3 - Method and Device for Plasma Activated Evaporation - Google Patents

Method and Device for Plasma Activated Evaporation

Info

Publication number
DK0734459T3
DK0734459T3 DK95901341T DK95901341T DK0734459T3 DK 0734459 T3 DK0734459 T3 DK 0734459T3 DK 95901341 T DK95901341 T DK 95901341T DK 95901341 T DK95901341 T DK 95901341T DK 0734459 T3 DK0734459 T3 DK 0734459T3
Authority
DK
Denmark
Prior art keywords
plasma activated
activated evaporation
evaporation
plasma
activated
Prior art date
Application number
DK95901341T
Other languages
Danish (da)
Inventor
Klaus Goedicke
Siegfried Schiller
Volker Kirchhoff
Manfred Neumann
Jonathan Reschke
Original Assignee
Fraunhofer Ges Forschung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung filed Critical Fraunhofer Ges Forschung
Application granted granted Critical
Publication of DK0734459T3 publication Critical patent/DK0734459T3/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DK95901341T 1993-12-16 1994-11-22 Method and Device for Plasma Activated Evaporation DK0734459T3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4343042A DE4343042C1 (en) 1993-12-16 1993-12-16 Method and device for plasma-activated vapour deposition
PCT/DE1994/001415 WO1995016798A1 (en) 1993-12-16 1994-11-22 Plasma-activated vapour-deposition process and device

Publications (1)

Publication Number Publication Date
DK0734459T3 true DK0734459T3 (en) 1999-09-20

Family

ID=6505256

Family Applications (1)

Application Number Title Priority Date Filing Date
DK95901341T DK0734459T3 (en) 1993-12-16 1994-11-22 Method and Device for Plasma Activated Evaporation

Country Status (5)

Country Link
EP (1) EP0734459B1 (en)
JP (1) JPH09508942A (en)
DE (2) DE4343042C1 (en)
DK (1) DK0734459T3 (en)
WO (1) WO1995016798A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4440521C1 (en) 1994-11-12 1995-11-02 Rowo Coating Ges Fuer Beschich Device for coating substrates with a material vapor in a vacuum or vacuum
DE19543781A1 (en) * 1995-11-24 1997-05-28 Leybold Ag Vacuum coating system with a crucible arranged in the vacuum chamber for receiving material to be evaporated
DE19544584A1 (en) * 1995-11-30 1997-06-05 Leybold Ag Vacuum coating system with a crucible arranged in the vacuum chamber for receiving material to be evaporated
DE19610012B4 (en) * 1996-03-14 2005-02-10 Unaxis Deutschland Holding Gmbh A method for stabilizing a working point in reactive sputtering in an oxygen-containing atmosphere
DE29611678U1 (en) * 1996-07-04 1997-08-07 Siemens AG, 80333 München Sound transducers, in particular ultrasound transducers
US6223683B1 (en) 1997-03-14 2001-05-01 The Coca-Cola Company Hollow plastic containers with an external very thin coating of low permeability to gases and vapors through plasma-assisted deposition of inorganic substances and method and system for making the coating
DE19740793C2 (en) * 1997-09-17 2003-03-20 Bosch Gmbh Robert Process for coating surfaces by means of a system with sputter electrodes and use of the process
DE19825056C1 (en) * 1998-06-04 2000-01-13 Fraunhofer Ges Forschung Circuit for supplying electrical energy to plasma can feed high power to unipolar or bipolar pulsed plasma with switching region in range 20 to 100 kHz with conventional IGBT switch
DE19827587A1 (en) * 1998-06-20 1999-12-23 Ardenne Anlagentech Gmbh Double-magnetron sputtering unit for large area reactive plasma-enhanced deposition of e.g. light absorbing layers on metal strips for solar absorbers or heat reflective layers on window glass
US6251233B1 (en) * 1998-08-03 2001-06-26 The Coca-Cola Company Plasma-enhanced vacuum vapor deposition system including systems for evaporation of a solid, producing an electric arc discharge and measuring ionization and evaporation
US6720052B1 (en) 2000-08-24 2004-04-13 The Coca-Cola Company Multilayer polymeric/inorganic oxide structure with top coat for enhanced gas or vapor barrier and method for making same
US6740378B1 (en) 2000-08-24 2004-05-25 The Coca-Cola Company Multilayer polymeric/zero valent material structure for enhanced gas or vapor barrier and uv barrier and method for making same
WO2003089502A1 (en) 2002-04-15 2003-10-30 The Coca-Cola Company Coating composition containing an epoxide additive and structures coated therewith

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149468A (en) * 1981-03-09 1982-09-16 Sanyo Shinku Kogyo Kk Ion plating device
DE3627151A1 (en) * 1986-08-11 1988-02-18 Leybold Heraeus Gmbh & Co Kg METHOD AND DEVICE FOR REACTIVELY EVAPORATING METAL COMPOUNDS
DD252205B5 (en) * 1986-09-01 1993-12-09 Fraunhofer Ges Forschung atomizing
US5133849A (en) * 1988-12-12 1992-07-28 Ricoh Company, Ltd. Thin film forming apparatus
DE3931565C1 (en) * 1989-09-22 1991-01-24 Dornier Luftfahrt Gmbh, 8000 Muenchen, De

Also Published As

Publication number Publication date
WO1995016798A1 (en) 1995-06-22
EP0734459A1 (en) 1996-10-02
EP0734459B1 (en) 1999-02-03
DE4343042C1 (en) 1995-03-09
DE59407784D1 (en) 1999-03-18
JPH09508942A (en) 1997-09-09

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