DE9307464U1 - - Google Patents

Info

Publication number
DE9307464U1
DE9307464U1 DE9307464U DE9307464U DE9307464U1 DE 9307464 U1 DE9307464 U1 DE 9307464U1 DE 9307464 U DE9307464 U DE 9307464U DE 9307464 U DE9307464 U DE 9307464U DE 9307464 U1 DE9307464 U1 DE 9307464U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9307464U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE9307464U priority Critical patent/DE9307464U1/de
Publication of DE9307464U1 publication Critical patent/DE9307464U1/de
Priority to JP6125702A priority patent/JPH06334115A/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE9307464U 1993-05-17 1993-05-17 Expired - Lifetime DE9307464U1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE9307464U DE9307464U1 (zh) 1993-05-17 1993-05-17
JP6125702A JPH06334115A (ja) 1993-05-17 1994-05-16 円板状半導体デバイスの締めつけ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9307464U DE9307464U1 (zh) 1993-05-17 1993-05-17

Publications (1)

Publication Number Publication Date
DE9307464U1 true DE9307464U1 (zh) 1993-07-15

Family

ID=6893371

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9307464U Expired - Lifetime DE9307464U1 (zh) 1993-05-17 1993-05-17

Country Status (2)

Country Link
JP (1) JPH06334115A (zh)
DE (1) DE9307464U1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013203532A1 (de) 2013-03-01 2014-09-04 Magna Powertrain Ag & Co. Kg Bauteilekühlung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU773794A1 (ru) * 1979-01-10 1980-10-23 Предприятие П/Я М-5774 Радиоэлектронный блок
DE2926403A1 (de) * 1979-06-29 1981-01-08 Siemens Ag Vorrichtung zum einspannen wenigstens eines scheibenfoermigen halbleiterbauelementes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU773794A1 (ru) * 1979-01-10 1980-10-23 Предприятие П/Я М-5774 Радиоэлектронный блок
DE2926403A1 (de) * 1979-06-29 1981-01-08 Siemens Ag Vorrichtung zum einspannen wenigstens eines scheibenfoermigen halbleiterbauelementes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013203532A1 (de) 2013-03-01 2014-09-04 Magna Powertrain Ag & Co. Kg Bauteilekühlung

Also Published As

Publication number Publication date
JPH06334115A (ja) 1994-12-02

Similar Documents

Publication Publication Date Title
DE9306785U1 (zh)
DE9303231U1 (zh)
DE9304210U1 (zh)
DE9302280U1 (zh)
DE9303870U1 (zh)
DE9302891U1 (zh)
DE9302125U1 (zh)
DE9305499U1 (zh)
DE9306377U1 (zh)
DE9300425U1 (zh)
DE9301515U1 (zh)
DE9301028U1 (zh)
DE9300820U1 (zh)
DE9300529U1 (zh)
DE9306248U1 (zh)
DE9301609U1 (zh)
DE9301102U1 (zh)
DE9302666U1 (zh)
DE9301339U1 (zh)
DE9307054U1 (zh)
DE9305522U1 (zh)
DE9303286U1 (zh)
DE9307119U1 (zh)
DE9302802U1 (zh)
DE9303316U1 (zh)