DE9301744U1 - - Google Patents
Info
- Publication number
- DE9301744U1 DE9301744U1 DE9301744U DE9301744U DE9301744U1 DE 9301744 U1 DE9301744 U1 DE 9301744U1 DE 9301744 U DE9301744 U DE 9301744U DE 9301744 U DE9301744 U DE 9301744U DE 9301744 U1 DE9301744 U1 DE 9301744U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9301744U DE9301744U1 (un) | 1993-02-09 | 1993-02-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9301744U DE9301744U1 (un) | 1993-02-09 | 1993-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9301744U1 true DE9301744U1 (un) | 1993-04-01 |
Family
ID=6889128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9301744U Expired - Lifetime DE9301744U1 (un) | 1993-02-09 | 1993-02-09 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9301744U1 (un) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0632500A1 (en) * | 1993-05-27 | 1995-01-04 | Nippon Densan Corporation | Heat sink fan |
EP0641023A1 (en) * | 1993-08-25 | 1995-03-01 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |
-
1993
- 1993-02-09 DE DE9301744U patent/DE9301744U1/de not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0632500A1 (en) * | 1993-05-27 | 1995-01-04 | Nippon Densan Corporation | Heat sink fan |
US5484013A (en) * | 1993-05-27 | 1996-01-16 | Nippon Densan Corporation | Heat sink fan |
EP0641023A1 (en) * | 1993-08-25 | 1995-03-01 | International Business Machines Corporation | Convertible cooling module for air or water cooling of electronic circuit components |