DE9301740U1 - - Google Patents
Info
- Publication number
- DE9301740U1 DE9301740U1 DE9301740U DE9301740U DE9301740U1 DE 9301740 U1 DE9301740 U1 DE 9301740U1 DE 9301740 U DE9301740 U DE 9301740U DE 9301740 U DE9301740 U DE 9301740U DE 9301740 U1 DE9301740 U1 DE 9301740U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9301740U DE9301740U1 (US20020125480A1-20020912-P00900.png) | 1993-02-09 | 1993-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9301740U DE9301740U1 (US20020125480A1-20020912-P00900.png) | 1993-02-09 | 1993-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE9301740U1 true DE9301740U1 (US20020125480A1-20020912-P00900.png) | 1993-04-15 |
Family
ID=6889125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE9301740U Expired - Lifetime DE9301740U1 (US20020125480A1-20020912-P00900.png) | 1993-02-09 | 1993-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE9301740U1 (US20020125480A1-20020912-P00900.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19502896A1 (de) * | 1995-01-31 | 1996-08-01 | Cab Produkttechnik Ges Fuer Co | Vorrichtung zum Trennen von vorgeritzten Leiterplattenutzen |
| DE19749217A1 (de) * | 1997-11-07 | 1999-05-12 | Cab Produkttechnik Ges Fuer Co | Vorrichtung zum Trennen von Leiterplattennutzen |
| DE19515034C2 (de) * | 1994-05-16 | 2000-04-06 | Siemens Ag | Vorrichtung zum Trennen von bestückten, mit V-Nutzen versehenen Leiterplatten nutzen |
| DE102005054029B3 (de) * | 2005-11-10 | 2007-06-21 | Lpkf Laser & Electronics Ag | Verfahren zum Einbringen einer Durchbrechung in ein Substrat |
-
1993
- 1993-02-09 DE DE9301740U patent/DE9301740U1/de not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19515034C2 (de) * | 1994-05-16 | 2000-04-06 | Siemens Ag | Vorrichtung zum Trennen von bestückten, mit V-Nutzen versehenen Leiterplatten nutzen |
| DE19502896A1 (de) * | 1995-01-31 | 1996-08-01 | Cab Produkttechnik Ges Fuer Co | Vorrichtung zum Trennen von vorgeritzten Leiterplattenutzen |
| DE19749217A1 (de) * | 1997-11-07 | 1999-05-12 | Cab Produkttechnik Ges Fuer Co | Vorrichtung zum Trennen von Leiterplattennutzen |
| DE102005054029B3 (de) * | 2005-11-10 | 2007-06-21 | Lpkf Laser & Electronics Ag | Verfahren zum Einbringen einer Durchbrechung in ein Substrat |
