DE9213849U1 - - Google Patents
Info
- Publication number
- DE9213849U1 DE9213849U1 DE9213849U DE9213849U DE9213849U1 DE 9213849 U1 DE9213849 U1 DE 9213849U1 DE 9213849 U DE9213849 U DE 9213849U DE 9213849 U DE9213849 U DE 9213849U DE 9213849 U1 DE9213849 U1 DE 9213849U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9213849U DE9213849U1 (ko) | 1992-10-14 | 1992-10-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9213849U DE9213849U1 (ko) | 1992-10-14 | 1992-10-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9213849U1 true DE9213849U1 (ko) | 1993-01-28 |
Family
ID=6884806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9213849U Expired - Lifetime DE9213849U1 (ko) | 1992-10-14 | 1992-10-14 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9213849U1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19640650A1 (de) * | 1996-10-02 | 1998-04-09 | Ego Elektro Geraetebau Gmbh | Wärmeerzeugende Baugruppe mit wärmeleitender Verbindungsschicht zwischen Wärmequelle und Wärmesenke |
DE19832450A1 (de) * | 1998-07-18 | 2000-01-20 | Frankl & Kirchner | Halbleiter-Kühl-Anordnung |
EP1324388A2 (en) * | 2001-12-27 | 2003-07-02 | Polymatech Co., Ltd. | Method for cooling electronic components and thermally conductive sheet for use therewith |
DE102009048838B3 (de) * | 2009-10-09 | 2011-01-20 | Eads Deutschland Gmbh | Hermetisches dichtes Hochfrequenz-Frontend |
-
1992
- 1992-10-14 DE DE9213849U patent/DE9213849U1/de not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19640650A1 (de) * | 1996-10-02 | 1998-04-09 | Ego Elektro Geraetebau Gmbh | Wärmeerzeugende Baugruppe mit wärmeleitender Verbindungsschicht zwischen Wärmequelle und Wärmesenke |
DE19832450A1 (de) * | 1998-07-18 | 2000-01-20 | Frankl & Kirchner | Halbleiter-Kühl-Anordnung |
EP1324388A2 (en) * | 2001-12-27 | 2003-07-02 | Polymatech Co., Ltd. | Method for cooling electronic components and thermally conductive sheet for use therewith |
EP1324388A3 (en) * | 2001-12-27 | 2004-06-16 | Polymatech Co., Ltd. | Method for cooling electronic components and thermally conductive sheet for use therewith |
US7094459B2 (en) | 2001-12-27 | 2006-08-22 | Polymatech Co., Ltd. | Method for cooling electronic components and thermally conductive sheet for use therewith |
DE102009048838B3 (de) * | 2009-10-09 | 2011-01-20 | Eads Deutschland Gmbh | Hermetisches dichtes Hochfrequenz-Frontend |