DE9209630U1 - Attachment - Google Patents
AttachmentInfo
- Publication number
- DE9209630U1 DE9209630U1 DE9209630U DE9209630U DE9209630U1 DE 9209630 U1 DE9209630 U1 DE 9209630U1 DE 9209630 U DE9209630 U DE 9209630U DE 9209630 U DE9209630 U DE 9209630U DE 9209630 U1 DE9209630 U1 DE 9209630U1
- Authority
- DE
- Germany
- Prior art keywords
- electronic power
- power component
- sleeve
- rotor bell
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K29/00—Motors or generators having non-mechanical commutating devices, e.g. discharge tubes or semiconductor devices
- H02K29/06—Motors or generators having non-mechanical commutating devices, e.g. discharge tubes or semiconductor devices with position sensing devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Outer Garments And Coats (AREA)
- Surgical Instruments (AREA)
- Forklifts And Lifting Vehicles (AREA)
Description
-6--6-
BeschreibungDescription
Die vorliegende Erfindung betrifft eine Befestigung einer wenigstens ein elektronisches Leistungsbauelement aufweisenden Leiterplatte an einem als Kühlkörper wirkenden Bauteil, wobei das elektronische Leistungsbauelement mit der Leiterplatte durch wenigstens eine Anschlußleitung verbunden ist, und das elektronische Leistungsbauelement mit dem Kühlkörper wärmeleitend und fest verbunden ist.The present invention relates to a fastening of a circuit board having at least one electronic power component to a component acting as a heat sink, wherein the electronic power component is connected to the circuit board by at least one connecting line, and the electronic power component is firmly connected to the heat sink in a heat-conducting manner.
Bei derartigen Anordnungen ist üblicherweise die Leiterplatte durch Verbindungselemente, z.B. Schrauben, Stege mit Rastmechanismen etc. an dem als Kühlkörper wirkenden Bauteil befestigt, wobei das elektronische Leistungsbauelement, das üblicherweise eine hohe Verlustleistung in Wärme umsetzen muß, auf einer Oberfläche der Leiterplatte angebracht ist.In such arrangements, the circuit board is usually attached to the component acting as a heat sink by connecting elements, e.g. screws, bars with locking mechanisms, etc., whereby the electronic power component, which usually has to convert a high power loss into heat, is attached to a surface of the circuit board.
Dabei besteht das Problem, daß mit zunehmender Miniaturisierung nur wenig Fläche auf der Leiterplatte vorhanden ist, um die Verbindungselemente der Leiterplatte mit dem Kühlkörper unterzubringen, und außerdem ist der Abstand der Leiterplatte von dem Kühlkörper relativ groß, da das elektronische Leistungsbauelement relativ große Dickenabmessungen gegenüber den übrigen Bauteilen (Widerständen, Kondensatoren, integrierte Schaltkreise etc.) auf der Leiterplatte aufweist. Außerdem ist bei einer separaten Verbindung zwischen der Leiterplatte und dem Kühlkörper bzw. zwischen demThe problem here is that with increasing miniaturization there is only little space on the circuit board to accommodate the connecting elements of the circuit board with the heat sink, and in addition the distance between the circuit board and the heat sink is relatively large, since the electronic power component has relatively large thicknesses compared to the other components (resistors, capacitors, integrated circuits, etc.) on the circuit board. In addition, with a separate connection between the circuit board and the heat sink or between the
-7--7-
elektronischen Leistungsbauelement und dem Kühlkörper im Erwärmungsfall mit Temperaturspannungen zu rechnen, die die Lötverbindung zwischen dem elektronischen Leistungsbauelement und den Leiterbahnen auf der Leiterplatte beeinträchtigen können.In the event of heating, temperature stresses must be expected between the electronic power component and the heat sink, which can impair the solder connection between the electronic power component and the conductor tracks on the circuit board.
Um diesem Nachteil abzuhelfen, ist in der Leiterplatte eine das elektronisches Leistungsbauelement zumindest teilweise aufnehmende Ausnehmung vorgesehen.In order to remedy this disadvantage, a recess is provided in the circuit board that at least partially accommodates the electronic power component.
Damit wird eine eigene Verbindung des Kühlkörpers mit der Leiterplatte überflüssig, da die Verbindung zwischen der Leiterplatte und dem Kühlkörper durch die Verbindung zwischen dem elektronische Leistungsbauelement, das in die Leiterplatte eingelassen ist, und dem Kühlkörper bewirkt wird. Weiterhin verringert sich der Abstand zwischen der Leiterplatte und dem Kühlkörper in dem Maß, wie das elektronische Leistungsbauelement in die Ausnehmung in der Leiterplatte eingelassen wird.This eliminates the need for a separate connection between the heat sink and the circuit board, as the connection between the circuit board and the heat sink is created by the connection between the electronic power component, which is embedded in the circuit board, and the heat sink. Furthermore, the distance between the circuit board and the heat sink decreases as the electronic power component is embedded in the recess in the circuit board.
Vorzugsweise ist das elektronische Leistungsbauelement mit Spiel in die Ausnehmung eingesetzt, wird dort ausgerichtet, daran anschließend zumindest bereichsweise an seinen Seitenflächen in die Ausnehmung eingeklebt und dann wird die Klebung ausgehärtet. So kann sichergestellt werden, daß ggf. an der Leiterplatte angebrachte Sensoren (Hallgeneratoren, Tachogeneratoren etc.) eine vorbestimmbare Position zu anderen Bauteilen (z.B. einer Motorwelle oder dergl.) halten.Preferably, the electronic power component is inserted into the recess with play, is aligned there, then at least partially glued into the recess on its side surfaces and then the glue is cured. This ensures that any sensors attached to the circuit board (Hall generators, tacho generators, etc.) maintain a predeterminable position in relation to other components (e.g. a motor shaft or the like).
-8--8th-
Bevorzugt ist das elektronische Leistungsbauelement zumindest bereichsweise in die Ausnehmung eingeklebt, um eine dauerhafte und rüttelfeste Verbindung zwischen der Leiterplatte und dem Kühlkörper (bzw. zwischen diesen und dem elektronische Leistungsbauelement zu gewährleisten.Preferably, the electronic power component is glued into the recess at least in part in order to ensure a permanent and vibration-proof connection between the circuit board and the heat sink (or between these and the electronic power component).
Dabei erfolgt die Klebung vorteilhaft mittels eines Epoxidharzes. The bonding is preferably carried out using an epoxy resin.
Bei einer vorteilhaften Ausgesatltung ist das als Kühlkörper wirkende Bauteil ein Gehäuseteil eines elektrischen Gerätes, das z.B. ein kollektorloser Gleichstrommotor, ein Außenläufermotor, oder ein Reluktanzmotor ist.In an advantageous configuration, the component acting as a heat sink is a housing part of an electrical device, e.g. a brushless DC motor, an external rotor motor, or a reluctance motor.
Weiterhin ist das elektronische Leistungsbauelement einFurthermore, the electronic power component is a
Leistungshalbleiter-Bauelement, wie z.B. ein Endstufentransistor, eine Diode, ein Triac, oder ein Thyristor.Power semiconductor component, such as an output transistor, a diode, a triac, or a thyristor.
Eine bevorzugte Ausführungsform der Erfindung ist in der Fig, la in einer seitlichen Schnittdarstellung und in Fig. Ib in einer Draufsicht veranschaulicht.A preferred embodiment of the invention is illustrated in Fig. 1a in a side sectional view and in Fig. 1b in a plan view.
Weiterhin betrifft die Erfindung einen Außenläufermotor mit einer als Tiefziehteil aus Weicheisen gebildeten Rotorglocke und einer die Rotorglocke tragenden Zentralwelle, wobei die Rotorglocke einen zur Zentralwelle ragenden, mit der Rotorglocke einstückig verbundenen Deckelbereich aufweist.The invention further relates to an external rotor motor with a rotor bell formed as a deep-drawn part made of soft iron and a central shaft supporting the rotor bell, wherein the rotor bell has a cover region projecting towards the central shaft and integrally connected to the rotor bell.
-9--9-
Bei derartigen Anordnungen besteht das Problem, die Rotorglocke möglichst preiswert herzustellen, und dabei gleichzeitig eine möglichst zentrierte und genaue Halterung der Rotorglocke an der Zentralwelle zu gewährleisten.With such arrangements, the problem is to manufacture the rotor bell as inexpensively as possible, while at the same time ensuring that the rotor bell is mounted on the central shaft as centered and precisely as possible.
Zur Lösung diesen Problems ist an den Deckelbereich ein in das Innere der Rotorglocke reichender, mit dem Deckelbereich einstückig verbundenen Kragen angeformt, über den die Rotorglocke mit der Zentralwelle drehfest verbunden ist, und der Kragen ist durch eine vom Deckelbereich in das Innere der der Rotorglocke ragende Hülse gebildet ist, die mehr Materialvolumen aufweist, als eine ebene Scheibe mit der gleichen Materialstärke wie die Hülse wobei die Außengestalt der Scheibe der Projektion der Hülse in Richtung ihrer Längsachse entspricht.To solve this problem, a collar is formed on the cover area that extends into the interior of the rotor bell and is connected in one piece with the cover area, via which the rotor bell is connected to the central shaft in a rotationally fixed manner, and the collar is formed by a sleeve that extends from the cover area into the interior of the rotor bell and has more material volume than a flat disk with the same material thickness as the sleeve, whereby the outer shape of the disk corresponds to the projection of the sleeve in the direction of its longitudinal axis.
Durch eine derart lange Hülse bei im wesentlichen gleichbleibender Materialstärke ist die Stabilität der Befestigung der Rotorglocke an der Zentralwelle gewährleistet.Such a long sleeve with essentially constant material thickness ensures the stability of the attachment of the rotor bell to the central shaft.
Zur Verbesserung der Festigkeit der Rotorglocke ist die Hülse über einen nach außen ragenden konischen Ansatz an den Deckelbereich angesetzt.To improve the strength of the rotor bell, the sleeve is attached to the cover area via an outward-projecting conical attachment.
-10--10-
Bevorzugterweise beträgt die Länge der Hülse etwa 20% bis 60 % der Höhe der Rotorglocke, wobei die Hülse mit der Zentralwelle verklebt ist.Preferably, the length of the sleeve is approximately 20% to 60% of the height of the rotor bell, with the sleeve being glued to the central shaft.
Eine bevorzugte Ausführungsform der Erfindung ist in der Fig. 2 veranschaulicht.A preferred embodiment of the invention is illustrated in Fig. 2.
Die Fig. la, Ib zeigen eine Befestigung einer ein elektronisches Leistungsbauelement 1, z.B. einen Leistungstransistor mit einem TO 220-Gehäuse oder dergl. aufweisenden Leiterplatte 2 an einem als Kühlkörper wirkenden Bauteil. Dabei ist das elektronische Leistungsbauelement 1 mit Kupferbahnen der Leiterplatte 2 durch wenigstens eine Anschlußleitung 4 verbunden. Das elektronische Leistungsbauelement 1 ist mit dem flachen Kühlkörper 3 wärmeleitend und fest durch eine Schraube 7 verbunden. In der Leiterplatte ist eine das elektronisches Leistungsbauelement 1 zumindest teilweise aufnehmende Ausnehmung 6 vorgesehen, in der das elektronische Leistungsbauelement 1 mit Spiel eingesetzt und dort ausgerichtet wird. Daran anschließend wird das elektronische Leistungsbauelement 1 zumindest bereichsweise an seinen Seitenflächen in die Ausnehmung 6 eingeklebt und dann wird die Klebung ausgehärtet.Fig. 1a, 1b show a fastening of a circuit board 2 containing an electronic power component 1, e.g. a power transistor with a TO 220 housing or the like, to a component acting as a heat sink. The electronic power component 1 is connected to copper tracks of the circuit board 2 by at least one connecting line 4. The electronic power component 1 is connected to the flat heat sink 3 in a heat-conducting and fixed manner by a screw 7. A recess 6 is provided in the circuit board which at least partially accommodates the electronic power component 1, in which the electronic power component 1 is inserted with play and aligned there. The electronic power component 1 is then glued at least partially on its side surfaces into the recess 6 and the adhesive is then cured.
Zur stabilen Verbindung, und damit die Leiterplatte fest mit dem Leistungsbauelement - und damit auch mit dem Kühlkörper verbunden ist, ist das elektronische Leistungsbauelement 1 an allen vier Seitenflächen in dieFor a stable connection and so that the circuit board is firmly connected to the power component - and thus also to the heat sink, the electronic power component 1 is embedded in the
-11--11-
Ausnehmung 6 eingeklebt ist. Dabei ist die Klebeverbindung mittels eines Epoxidharzes hergestellt, das temperaturbeständig und korrosionsunempfindlich ist.Recess 6 is glued in. The adhesive connection is made using an epoxy resin that is temperature-resistant and corrosion-resistant.
Bei der vorliegenden Ausführungsform ist das als Kühlkörper wirkende Bauteil ein Gehäuseteil eines elektrischen Gerätes. Um den Abstand zwischen der wärmeabstrahlenden Kühlfläche und der Leiterplatte sicherzustellen, ist an den Kühlkörper ein Steg 8 angeformt, der an dem Leistungsbauelement 1 anliegt.In the present embodiment, the component acting as a heat sink is a housing part of an electrical device. In order to ensure the distance between the heat-radiating cooling surface and the circuit board, a web 8 is formed on the heat sink, which rests against the power component 1.
Das elektrische Gerät kann ein kollektorloser Gleichstrommotor, insbesondere ein Außenläufermotor, oder ein Reluktanzmotor sein, und das elektronische Leistungsbauelement 1 ist ein Leistungshalbleiter-Bauelement der Motorsteuerung, wie z.B. ein Endstufentransistor, eine Diode, ein Triac, oder ein Thyristor.The electrical device can be a collectorless DC motor, in particular an external rotor motor, or a reluctance motor, and the electronic power component 1 is a power semiconductor component of the motor control, such as an output stage transistor, a diode, a triac, or a thyristor.
In der Fig. 2 ist eine als Tiefziehteil aus Weicheisen gebildete zylinderförmige Rotorglocke 11 und eine die Rotorglocke 11 tragenden Zentralwelle 12 eines Außenläufermotors veranschaulicht, wobei die Rotorglocke 11 einen zur Zentralwelle 12 ragenden, mit der Rotorglocke 11 einstückig verbundenen Deckelbereich 13 aufweist. An den Deckelbereich 13 ist ein in das Innere der Rotorglocke 11 reichender, mit dem Deckelbereich einstückig verbundenen Kragen 14 angeformt, über den die Rotorglocke 11 mit der Zentralwelle 12 drehfest verbunden ist. Dabei ist der Kragen 14 durch eine vom Deckelbereich 13 in das Innere der der Rotorglocke 11 ragende Hülse 16 gebildet ist, die mehrIn Fig. 2, a cylindrical rotor bell 11 formed as a deep-drawn part made of soft iron and a central shaft 12 of an external rotor motor carrying the rotor bell 11 are illustrated, wherein the rotor bell 11 has a cover region 13 that protrudes towards the central shaft 12 and is connected in one piece with the rotor bell 11. A collar 14 that extends into the interior of the rotor bell 11 and is connected in one piece with the cover region is formed onto the cover region 13, via which the rotor bell 11 is connected to the central shaft 12 in a rotationally fixed manner. The collar 14 is formed by a sleeve 16 that protrudes from the cover region 13 into the interior of the rotor bell 11, which is more
-12--12-
Materialvolumen aufweist, als eine ebene Scheibe mit der gleichen Materialstärke wie die Hülse 16, wobei die Außmaterial volume than a flat disk with the same material thickness as the sleeve 16, the outer
Die Hülse 16 ist über einen nach außen ragenden konischen Ansatz 18 an den Deckelbereich angesetzt.The sleeve 16 is attached to the cover area via an outwardly projecting conical extension 18.
Die Länge der Hülse 16 beträgt etwa 25% der Höhe der Rotorglocke 11 und die Hülse 16 ist mit der Zentralwelle 12 verklebt.The length of the sleeve 16 is approximately 25% of the height of the rotor bell 11 and the sleeve 16 is glued to the central shaft 12.
Claims (13)
- in der Leiterplatte eine das elektronisches Leistungsbauelement (I) zumindest teilweise aufnehmende Ausnehmung (6) vorgesehen ist.characterized in that
- a recess (6) is provided in the circuit board which at least partially accommodates the electronic power component (I).
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9209630U DE9209630U1 (en) | 1992-07-17 | 1992-07-17 | Attachment |
DE4324210A DE4324210B4 (en) | 1992-07-17 | 1993-07-19 | Cooling arrangement for electronic power components |
DE4345316A DE4345316A1 (en) | 1992-07-17 | 1993-07-19 | Outer rotor motor or outer armature motor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9209630U DE9209630U1 (en) | 1992-07-17 | 1992-07-17 | Attachment |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9209630U1 true DE9209630U1 (en) | 1993-11-18 |
Family
ID=6881737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9209630U Expired - Lifetime DE9209630U1 (en) | 1992-07-17 | 1992-07-17 | Attachment |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE9209630U1 (en) |
-
1992
- 1992-07-17 DE DE9209630U patent/DE9209630U1/en not_active Expired - Lifetime
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