DE9102118U1 - - Google Patents

Info

Publication number
DE9102118U1
DE9102118U1 DE9102118U DE9102118U DE9102118U1 DE 9102118 U1 DE9102118 U1 DE 9102118U1 DE 9102118 U DE9102118 U DE 9102118U DE 9102118 U DE9102118 U DE 9102118U DE 9102118 U1 DE9102118 U1 DE 9102118U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9102118U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE9102118U priority Critical patent/DE9102118U1/de
Publication of DE9102118U1 publication Critical patent/DE9102118U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
DE9102118U 1991-02-22 1991-02-22 Expired - Lifetime DE9102118U1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9102118U DE9102118U1 (ja) 1991-02-22 1991-02-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9102118U DE9102118U1 (ja) 1991-02-22 1991-02-22

Publications (1)

Publication Number Publication Date
DE9102118U1 true DE9102118U1 (ja) 1992-06-25

Family

ID=6864573

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9102118U Expired - Lifetime DE9102118U1 (ja) 1991-02-22 1991-02-22

Country Status (1)

Country Link
DE (1) DE9102118U1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19934554A1 (de) * 1999-07-22 2001-01-25 Michael Stollenwerk Wärmetauscher
DE10009899A1 (de) * 2000-03-01 2001-11-22 Jochen Straehle Integriertes aktives Halbleiterkomponentenkühlsystem
DE19733455B4 (de) * 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1136362A (fr) * 1954-09-06 1957-05-13 Wegerator Appareil pour la production de thermo-électricité
DE1882033U (de) * 1963-01-31 1963-11-07 Philips Patentverwaltung Thermoelektrische kuehlvorrichtung, deren halbleiterkoerper mittels metall-, vorzugsweise kupferbruecken, elektrisch verbunden sind.
US3256696A (en) * 1962-01-29 1966-06-21 Monsanto Co Thermoelectric unit and process of using to interconvert heat and electrical energy
US3293083A (en) * 1962-07-02 1966-12-20 Carrier Corp Thermoelectric structures
DE1963023A1 (de) * 1969-12-10 1971-06-16 Siemens Ag Thermoelektrische Vorrichtung
EP0009605A1 (de) * 1978-10-02 1980-04-16 International Business Machines Corporation Kühlsystem für Halbleiter-Modul
EP0237741A2 (en) * 1986-03-20 1987-09-23 Hitachi, Ltd. Thermal conduction device
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1136362A (fr) * 1954-09-06 1957-05-13 Wegerator Appareil pour la production de thermo-électricité
US3256696A (en) * 1962-01-29 1966-06-21 Monsanto Co Thermoelectric unit and process of using to interconvert heat and electrical energy
US3293083A (en) * 1962-07-02 1966-12-20 Carrier Corp Thermoelectric structures
DE1882033U (de) * 1963-01-31 1963-11-07 Philips Patentverwaltung Thermoelektrische kuehlvorrichtung, deren halbleiterkoerper mittels metall-, vorzugsweise kupferbruecken, elektrisch verbunden sind.
DE1963023A1 (de) * 1969-12-10 1971-06-16 Siemens Ag Thermoelektrische Vorrichtung
EP0009605A1 (de) * 1978-10-02 1980-04-16 International Business Machines Corporation Kühlsystem für Halbleiter-Modul
US4730665A (en) * 1983-07-14 1988-03-15 Technology Enterprises Company Apparatus for cooling high-density integrated circuit packages
EP0237741A2 (en) * 1986-03-20 1987-09-23 Hitachi, Ltd. Thermal conduction device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
57-153458 A,E-148, Dec.14, 1982, Vol.6, No.264 *
Patents Abstracts of Japan: 54-38771, E-112, May 23, 1979, Vol.3, No.60 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19733455B4 (de) * 1997-08-02 2012-03-29 Curamik Electronics Gmbh Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung
DE19934554A1 (de) * 1999-07-22 2001-01-25 Michael Stollenwerk Wärmetauscher
DE10009899A1 (de) * 2000-03-01 2001-11-22 Jochen Straehle Integriertes aktives Halbleiterkomponentenkühlsystem

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