DE8900799U1 - High-precision single-axis length measuring device with interferometer measuring system - Google Patents
High-precision single-axis length measuring device with interferometer measuring systemInfo
- Publication number
- DE8900799U1 DE8900799U1 DE8900799U DE8900799U DE8900799U1 DE 8900799 U1 DE8900799 U1 DE 8900799U1 DE 8900799 U DE8900799 U DE 8900799U DE 8900799 U DE8900799 U DE 8900799U DE 8900799 U1 DE8900799 U1 DE 8900799U1
- Authority
- DE
- Germany
- Prior art keywords
- measuring
- reflector
- axis length
- precision single
- measuring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000012937 correction Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 3
- 244000309464 bull Species 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/248—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves using special electromagnetic means or methods
- B23Q17/2495—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves using special electromagnetic means or methods using interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02055—Reduction or prevention of errors; Testing; Calibration
- G01B9/0207—Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
- G01B2290/60—Reference interferometer, i.e. additional interferometer not interacting with object
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
Description
-2 --2 -
HELIOS-Meßtechnik GmbH&Co KG .7119 NiedernhallHELIOS-Meßtechnik GmbH&Co KG .7119 Niedernhall
Hochgenaue Einachslängenmeßgeräte werden überwiegend zum Prüfen von Lehren, Maßverkörperungen und sehr genauen Werkstücken eingesetzt. Es werden Meßschritte von 0,0001 mm angezeigt.High-precision single-axis length measuring devices are mainly used for testing gauges, measuring standards and very precise workpieces. Measuring steps of 0.0001 mm are displayed.
Die bisher bekannten hochgenauen Einachslängenmeßgeräte sind mit Inkrementalmaßstäben aus Stahl oder Glas und opto-elektronischen Meßsystenren ausgestattet. Diese Systeme bestehen neben der Maßverkörperung aus weiteren optischen Bauteilen. Die Herstellung der. hochgenauen inkrementalen Maßstäbe ist technisch aufwendig. Die optischen Meßsysteme arbeiten nur fehlerfrei, wenn die einzelnen Bauteile in einer sehr präzisen, relativen Bewegung zueinander geführt werden. Dieses technische Erfordernis setzt sehr genaue Führungen an den Befestigungselementen und Meßschlitten voraus. Um Teilungsfehler, mit denen inkremental Maßstäbe behaftet sind, zu eliminieren, wird angestrebt durch Korrekturwerte die Fehler auf ein Minimum zu reduzieren. Dies führt jedoch zu sehr aufwendigen Prüf- und Rechenoperationen. Darüber hinaus treten durch hohe Interpolation weitere Fehler auf.The high-precision single-axis length measuring devices known to date are equipped with incremental scales made of steel or glass and opto-electronic measuring systems. In addition to the measuring embodiment, these systems consist of other optical components. The production of the high-precision incremental scales is technically complex. The optical measuring systems only work error-free if the individual components are guided in a very precise, relative movement to one another. This technical requirement requires very precise guides on the fastening elements and measuring slides. In order to eliminate division errors that are associated with incremental scales, the aim is to reduce the errors to a minimum by means of correction values. However, this leads to very complex testing and calculation operations. In addition, further errors occur due to high interpolation.
Laserinterferometer in den unterschiedlichsten Ausführungen sind bekannt. Es ist Aufgabe der Erfindung ein geeignetes Laserinterferometer, mit dem neben dem Meßstrahl gleichzeitig ein Korrekturstrahl erzeugt wird, in Lehrenmeßgeräte zu integrieren.Laser interferometers in a wide variety of designs are known. The object of the invention is to integrate a suitable laser interferometer, with which a correction beam is generated in addition to the measuring beam, into gauge measuring devices.
Interferometrische Meßverfahren haben den Nachteil, daß der Meßstrahl durch Luftturbulenz, Luftdruckschwankungen und Luftfeuchtigkeit, Staub, Gase etc. beeinflußt wird und zu unrichtigen Meßergebnissen führt. Interferometrische Messungen haben jedoch andererseits den Vorteil, daß die Meßsignale, die &zgr; j Meßwerten verarbeitet werden, nicht durch kleine Mängel an den Führungssystemen der Meßgeräte beeinflußt werden. Ein weiterer Vorteil der beschriebenen Erfindung ist es, den Meßstrahl mit einem Korrekturstrahl zu vergleichen. Der Korrekturstrahl wird so geführt, daß er denselben physikalischen Einwirkungen, wie Turbulenz, Feuchtigkeit, Luftdruckunterschiede, Temperaturen, Gase, Staub u.s.w., wie der Meßstrahl ausgesetzt ist. Die Meßwerte werden durch die Einwirkungen auf den Korrekturstrahl relativiert. Ir, der Europäischen Patent-Interferometric measuring methods have the disadvantage that the measuring beam is influenced by air turbulence, air pressure fluctuations and air humidity, dust, gases, etc. and leads to incorrect measurement results. Interferometric measurements, however, have the advantage that the measurement signals that are processed into ζ j measurement values are not influenced by small defects in the guidance systems of the measuring devices. Another advantage of the invention described is that the measuring beam can be compared with a correction beam. The correction beam is guided in such a way that it is exposed to the same physical influences as the measuring beam, such as turbulence, humidity, air pressure differences, temperatures, gases, dust, etc. The measurement values are relativized by the influences on the correction beam. Ir, the European Patent
schrift 84 108 100 und in der Offeiilegungsschrift OS 37 06 347 ist ein solches interferometrisches System, welches als Lichtquelle eine Halblei- :er-Laserdiode benutzt, beschrieben.Such an interferometric system, which uses a semiconductor laser diode as a light source, is described in German Patent Application No. 84 108 100 and in German Patent Application No. OS 37 06 347.
:ig. 1 zeigt die schematische Darstellung eines beschriebenen, hochgenauen Einachslängenmeßgerätes. : ig. 1 shows the schematic representation of a described, high-precision single-axis length measuring device.
Dieses Gerät zeichnet sich durch ein sehr stabiles Gerätebett, auf dem ein relativ langer Meßschlitten geführt wird, aus. Im Meßschlitten ist eine Pinole in weit auseinanderliegenden Führungen schwimmend gelagert.This device is characterized by a very stable device bed on which a relatively long measuring slide is guided. In the measuring slide, a quill is mounted floating in widely spaced guides.
Im Gerätebett (9) ist der Interferometerkopf (1) untergebracht. Dieser Interfereneterkopf (1) beinhaltet die Quelle &udigr;&tgr; das Laserlicht, in diesem Falle eine Halbleiter-Laserdiode, die Temperatur- und die Stromregeleinrichtung und die nötigen optischen Bauelemente.The interferometer head (1) is housed in the device bed (9). This interferometer head (1) contains the source &udigr;&tgr; the laser light, in this case a semiconductor laser diode, the temperature and current control device and the necessary optical components.
Der Meßstrahl (2) wird auf einen ersten Umlenkspiegel (3) und von dort auf den zweiten Umlenkspiegel (4) gelenkt. Der Umlenkspiegel (4) richtet den Meßstrahl auf den Reflektor (5). Der reflektierte Meßstrahl wird im umgekehrten Weg über die Umlenkspiegel (4) und (3) wieder in den Laserkopf zurückgeführt. Gleichzeitig wird aus derselben Lichtquelle ein Korrekturstrahl (6) emittiert. Dieser wird im fest angeordneten Reflektor (7) zurückgelenkt und für die-Korrektur des Meßergebnisses benutzt.The measuring beam (2) is directed to a first deflection mirror (3) and from there to the second deflection mirror (4). The deflection mirror (4) directs the measuring beam to the reflector (5). The reflected measuring beam is returned to the laser head in the opposite direction via the deflection mirrors (4) and (3). At the same time, a correction beam (6) is emitted from the same light source. This is deflected back in the fixed reflector (7) and used to correct the measurement result.
Der Interferometerkopf (1) ist im Gerätebett angeordnet. Der Meßschlitten (10) hat einen Ansatz, welcher durch eine Nut im Gerätebett in dieses hineinragt. An diesem Ansatz wird der Reflektor (5) für den Meßstrahl (2) befestigt. Der Korrekturstrahl (6) wird von dem fest installierten Reflektor (7) wiederum in den Interferometerkopf (1) zur Signalauswertung zurückgeworfen .The interferometer head (1) is arranged in the device bed. The measuring carriage (10) has a projection which extends through a groove in the device bed. The reflector (5) for the measuring beam (2) is attached to this projection. The correction beam (6) is reflected back by the permanently installed reflector (7) into the interferometer head (1) for signal evaluation.
Fig. 3 ziUgt eine abweichende Anordnung des if;terferometrischen Meßsystems.Fig. 3 shows a different arrangement of the interferometric measuring system.
Der Interferometerkopf (1) ist in diesem Falle senkrecht zur Führungsebene im Gerätebett (11) angeordnet. Der Meßstrahl (2) wird durch eine längliche öffnung durch dasIn this case, the interferometer head (1) is arranged perpendicular to the guide plane in the device bed (11). The measuring beam (2) is guided through an elongated opening through the
Gerätebett hindurchgeführt und durch den Umlenkspiegel (12) auf den Reflektor (5) gelenkt. Oer Reflektor ist direkt an der schwimmend gelagerten Meßpinole befestigt. Der Korrekturstrahl (6) wird parallel zum Meßstrahl geführt und durch den Reflektor (7) der fest mit dem Gerätebett verbündet1 ist, in den Laserkopf zurückgeworfen.The beam is guided through the device bed and directed onto the reflector (5) by the deflection mirror (12). The reflector is attached directly to the floating measuring spindle. The correction beam (6) is guided parallel to the measuring beam and reflected back into the laser head by the reflector (7), which is firmly connected to the device bed.
Fig. 4 zeigt eine weitere Anordnung des laserinterferometrischen Meßsystems .Fig. 4 shows another arrangement of the laser interferometric measuring system.
Das Gerätebett (11) weist einen feststehenden Winkel (13) auf. Dieser Winkel ragt von unten in den Meßschlitten (10). Am oberen Teil des Winkels (13) ist der Interferometerkopf (1) angeordnet. Der Meßstrahl wird direkt in den Reflektor, der fest mit der Pinole verbunden ist, gelenkt und zurückgeführt. Der Korrekturreflektor ( 7 j ist am Winkel (13) in einem ausreichenden Abstand befestigt.The device bed (11) has a fixed angle (13). This angle protrudes from below into the measuring carriage (10). The interferometer head (1) is arranged on the upper part of the angle (13). The measuring beam is directed directly into the reflector, which is firmly connected to the spindle, and returned. The correction reflector (7j) is attached to the angle (13) at a sufficient distance.
Claims (1)
7119 NiedernhallHELIOS-Meßtechnik GmbH&Co KG
7119 Niedernhall
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8900799U DE8900799U1 (en) | 1989-01-25 | 1989-01-25 | High-precision single-axis length measuring device with interferometer measuring system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8900799U DE8900799U1 (en) | 1989-01-25 | 1989-01-25 | High-precision single-axis length measuring device with interferometer measuring system |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8900799U1 true DE8900799U1 (en) | 1990-05-31 |
Family
ID=6835373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8900799U Expired - Lifetime DE8900799U1 (en) | 1989-01-25 | 1989-01-25 | High-precision single-axis length measuring device with interferometer measuring system |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8900799U1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0874215A2 (en) * | 1997-04-24 | 1998-10-28 | Technomess Qualitätssicherungs- Systeme Gesellschaft mbH | Method and device for measuring lengths and distances |
DE4100773C2 (en) * | 1991-01-12 | 1999-09-30 | Zeiss Carl Jena Gmbh | Interferometric length measuring device |
DE102016013550B3 (en) | 2016-11-08 | 2018-04-19 | Rolf Klöden | Profile measuring system for roughness and contour measurement on a surface of a workpiece |
-
1989
- 1989-01-25 DE DE8900799U patent/DE8900799U1/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4100773C2 (en) * | 1991-01-12 | 1999-09-30 | Zeiss Carl Jena Gmbh | Interferometric length measuring device |
EP0874215A2 (en) * | 1997-04-24 | 1998-10-28 | Technomess Qualitätssicherungs- Systeme Gesellschaft mbH | Method and device for measuring lengths and distances |
EP0874215A3 (en) * | 1997-04-24 | 2000-09-20 | Technomess Qualitätssicherungs- Systeme Gesellschaft mbH | Method and device for measuring lengths and distances |
DE102016013550B3 (en) | 2016-11-08 | 2018-04-19 | Rolf Klöden | Profile measuring system for roughness and contour measurement on a surface of a workpiece |
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