DE8703604U1 - - Google Patents

Info

Publication number
DE8703604U1
DE8703604U1 DE8703604U DE8703604U DE8703604U1 DE 8703604 U1 DE8703604 U1 DE 8703604U1 DE 8703604 U DE8703604 U DE 8703604U DE 8703604 U DE8703604 U DE 8703604U DE 8703604 U1 DE8703604 U1 DE 8703604U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8703604U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Euroatlas fur Umformertechnik und Optronik 2800 Bremen De GmbH
Original Assignee
Euroatlas fur Umformertechnik und Optronik 2800 Bremen De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Euroatlas fur Umformertechnik und Optronik 2800 Bremen De GmbH filed Critical Euroatlas fur Umformertechnik und Optronik 2800 Bremen De GmbH
Priority to DE8703604U priority Critical patent/DE8703604U1/de
Publication of DE8703604U1 publication Critical patent/DE8703604U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE8703604U 1987-03-11 1987-03-11 Expired DE8703604U1 (sh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8703604U DE8703604U1 (sh) 1987-03-11 1987-03-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8703604U DE8703604U1 (sh) 1987-03-11 1987-03-11

Publications (1)

Publication Number Publication Date
DE8703604U1 true DE8703604U1 (sh) 1988-07-21

Family

ID=6805672

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8703604U Expired DE8703604U1 (sh) 1987-03-11 1987-03-11

Country Status (1)

Country Link
DE (1) DE8703604U1 (sh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009037259A1 (de) * 2009-08-12 2011-02-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1764231A1 (de) * 1967-05-24 1971-07-01 Comp Generale Electricite Halbleiter-Bauelement und Verfahren zu dessen Herstellung
DE2211513A1 (de) * 1971-07-30 1973-02-08 Stanley Electric Co Ltd Halbleiterelement mit radiator
GB2079052A (en) * 1980-06-30 1982-01-13 Alusuisse Cooling bodies for semiconductors or the like
DE8118336U1 (de) * 1982-04-29 Robert Bosch Gmbh, 7000 Stuttgart "Halbleitergleichrichter"
DE3127457A1 (de) * 1981-07-11 1983-02-03 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8118336U1 (de) * 1982-04-29 Robert Bosch Gmbh, 7000 Stuttgart "Halbleitergleichrichter"
DE1764231A1 (de) * 1967-05-24 1971-07-01 Comp Generale Electricite Halbleiter-Bauelement und Verfahren zu dessen Herstellung
DE2211513A1 (de) * 1971-07-30 1973-02-08 Stanley Electric Co Ltd Halbleiterelement mit radiator
GB2079052A (en) * 1980-06-30 1982-01-13 Alusuisse Cooling bodies for semiconductors or the like
DE3127457A1 (de) * 1981-07-11 1983-02-03 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-Z: Elektrie, 1969, H. 2, S. 68 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009037259A1 (de) * 2009-08-12 2011-02-17 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul
DE102009037259B4 (de) * 2009-08-12 2012-04-19 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul

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