DE8625150U1 - - Google Patents
Info
- Publication number
- DE8625150U1 DE8625150U1 DE19868625150 DE8625150U DE8625150U1 DE 8625150 U1 DE8625150 U1 DE 8625150U1 DE 19868625150 DE19868625150 DE 19868625150 DE 8625150 U DE8625150 U DE 8625150U DE 8625150 U1 DE8625150 U1 DE 8625150U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19868625150 DE8625150U1 (el) | 1986-09-19 | 1986-09-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19868625150 DE8625150U1 (el) | 1986-09-19 | 1986-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8625150U1 true DE8625150U1 (el) | 1986-11-13 |
Family
ID=6798466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19868625150 Expired DE8625150U1 (el) | 1986-09-19 | 1986-09-19 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8625150U1 (el) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0727928A1 (en) * | 1995-02-18 | 1996-08-21 | Hewlett-Packard GmbH | Electronic assembly having improved thermal characteristics |
-
1986
- 1986-09-19 DE DE19868625150 patent/DE8625150U1/de not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0727928A1 (en) * | 1995-02-18 | 1996-08-21 | Hewlett-Packard GmbH | Electronic assembly having improved thermal characteristics |
US5900649A (en) * | 1995-02-18 | 1999-05-04 | Hewlett-Packard Company | Electronic assembly having improved thermal characteristics |