DE8531940U1 - - Google Patents

Info

Publication number
DE8531940U1
DE8531940U1 DE19858531940 DE8531940U DE8531940U1 DE 8531940 U1 DE8531940 U1 DE 8531940U1 DE 19858531940 DE19858531940 DE 19858531940 DE 8531940 U DE8531940 U DE 8531940U DE 8531940 U1 DE8531940 U1 DE 8531940U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19858531940
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19858531940 priority Critical patent/DE8531940U1/de
Publication of DE8531940U1 publication Critical patent/DE8531940U1/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0417Feeding with belts or tapes
    • H05K13/0421Feeding with belts or tapes with treatment of the terminal leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
DE19858531940 1985-11-12 1985-11-12 Expired DE8531940U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19858531940 DE8531940U1 (en) 1985-11-12 1985-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19858531940 DE8531940U1 (en) 1985-11-12 1985-11-12

Publications (1)

Publication Number Publication Date
DE8531940U1 true DE8531940U1 (en) 1987-07-02

Family

ID=6787174

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19858531940 Expired DE8531940U1 (en) 1985-11-12 1985-11-12

Country Status (1)

Country Link
DE (1) DE8531940U1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3738164A1 (en) * 1987-11-10 1989-05-18 Siemens Ag DEVICE FOR PROCESSING AND PROVIDING TAPEPAKS FOR CUTTERS
EP0521338A1 (en) * 1991-06-26 1993-01-07 Siemens Nixdorf Informationssysteme Aktiengesellschaft Method and arrangement for soldering surface mounted components on printed circuit boards
EP0520295B1 (en) * 1991-06-26 1994-09-14 Siemens Nixdorf Informationssysteme Aktiengesellschaft Method and device for forming external connections in surface mounted components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3738164A1 (en) * 1987-11-10 1989-05-18 Siemens Ag DEVICE FOR PROCESSING AND PROVIDING TAPEPAKS FOR CUTTERS
EP0521338A1 (en) * 1991-06-26 1993-01-07 Siemens Nixdorf Informationssysteme Aktiengesellschaft Method and arrangement for soldering surface mounted components on printed circuit boards
EP0520295B1 (en) * 1991-06-26 1994-09-14 Siemens Nixdorf Informationssysteme Aktiengesellschaft Method and device for forming external connections in surface mounted components

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