DE8500718U1 - - Google Patents
Info
- Publication number
- DE8500718U1 DE8500718U1 DE19858500718 DE8500718U DE8500718U1 DE 8500718 U1 DE8500718 U1 DE 8500718U1 DE 19858500718 DE19858500718 DE 19858500718 DE 8500718 U DE8500718 U DE 8500718U DE 8500718 U1 DE8500718 U1 DE 8500718U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19858500718 DE8500718U1 (ja) | 1985-01-14 | 1985-01-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19858500718 DE8500718U1 (ja) | 1985-01-14 | 1985-01-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8500718U1 true DE8500718U1 (ja) | 1992-09-03 |
Family
ID=6776286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19858500718 Expired DE8500718U1 (ja) | 1985-01-14 | 1985-01-14 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8500718U1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4237763A1 (de) * | 1992-11-09 | 1994-05-11 | Siemens Ag | Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen |
EP0669651A1 (en) * | 1994-02-28 | 1995-08-30 | AT&T Corp. | Method and apparatus for cooling electronic components |
-
1985
- 1985-01-14 DE DE19858500718 patent/DE8500718U1/de not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4237763A1 (de) * | 1992-11-09 | 1994-05-11 | Siemens Ag | Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen |
EP0669651A1 (en) * | 1994-02-28 | 1995-08-30 | AT&T Corp. | Method and apparatus for cooling electronic components |