DE841987C - Process for making vacuum-tight connections - Google Patents

Process for making vacuum-tight connections

Info

Publication number
DE841987C
DE841987C DEP12870D DEP0012870D DE841987C DE 841987 C DE841987 C DE 841987C DE P12870 D DEP12870 D DE P12870D DE P0012870 D DEP0012870 D DE P0012870D DE 841987 C DE841987 C DE 841987C
Authority
DE
Germany
Prior art keywords
copper
ceramic
ceramic body
silver
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEP12870D
Other languages
German (de)
Inventor
Helmut Dr Phil Nat Vedder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DEP12870D priority Critical patent/DE841987C/en
Application granted granted Critical
Publication of DE841987C publication Critical patent/DE841987C/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)

Description

Verfahren zum Herstellen vakuumdichter Verbindungen Es ist bekannt, vakuumdichte Verbindungen zwischen mehreren keramischen Körpern oder auch zwischen keramischen Körpern und Metall mit Hilfe von Silber oder silberhaltigen Legierungen als Lötmittel herzustellen. Derartige Verbindungen werden beispielsweise benötigt, um Elektroden vakuumdicht in Stromrichtgefäße mit Metallwandung einzuführen. Die Erfindung bezieht sich auf eine Verbesserung des bisherigen Lötverfahrens mit dem Ziel, eine innigere Verbindung zwischen dem silberhaltigen Lot und dem anzulötenden Keramikkörper zu erzielen. Sie betrifft ein Verfahren zur Herstellung derartiger vakuumdichter Verbindungen und ist dadurch gekennzeichnet, daß die zu verlötenden Keramikkörper an der Lötstelle vor dem Löten mit einem Überzug aus Kupfer versehen werden, der, vorzugsweise in oxydierender Atmosphäre, eingebrannt wird.Process for making vacuum-tight connections It is known vacuum-tight connections between several ceramic bodies or between ceramic bodies and metal with the help of silver or silver-containing alloys as a solder to manufacture. Such connections are required, for example, to introduce electrodes vacuum-tight into converter vessels with metal walls. the Invention relates to an improvement of the previous soldering process with the The aim is to create a more intimate connection between the silver-containing solder and the solder to be soldered Achieve ceramic body. It relates to a method for producing such vacuum-tight connections and is characterized in that the to be soldered Ceramic body provided with a copper coating at the soldering point before soldering which is baked, preferably in an oxidizing atmosphere.

Gemäß einer vorteilhaften Weiterbildung der Erfindung wird das Einbrennen des Kupferüberzuges in die Keramikmasse nur so weit ,durchgeführt, äaß nicht alles Kupfer eine Verbindung mit der keramischen Masse eingeht, sondern daß an der Oberfläche des Keramikkörpers noch eine Schicht metallischen Kupfers oder/und Oxyde desselben erhalten bleiben. Bei dem anschließenden Verlöten wird dann zweckmäßig ztir Zurückbildung etwa verbliebener Kupferoxyde in metallisches Kupfer dem silberhaltigen Lötmittel ein reduzierender Zusatz beigegeben, oder die Verlötung wird zu dem gleichen Zwecke in reduzierender Atmosphäre vorgenommen. Auf diese Weise gelingt es, durch Verlöten des Silbers bzw. der silberhaltigen Legierung mit der in den Keramikkörper eingebrannten Kupferschicht eine besonders enge Verbindung der zu verlötenden Teile miteinander zu erzielen.According to an advantageous further development of the invention, the burning-in of the copper coating in the ceramic mass only so far, carried out, did not eat everything Copper forms a connection with the ceramic mass, but that on the surface of the ceramic body still has a layer of metallic copper and / or oxides of the same remain. During the subsequent soldering, it is then expedient for regression any remaining copper oxides in metallic copper the silver-containing solder a reducing additive is added, or the soldering is done for the same purpose made in a reducing atmosphere. In this way it succeeds by soldering of Silver or the alloy containing silver with the burnt into the ceramic body Copper layer creates a particularly close connection between the parts to be soldered to achieve.

Claims (4)

PATENTANSPRÜCHE: i. Verfahren zum Herstellen von vakuumdichten Verbindungen zwischen mehreren keramischen Körpern oder keramischen. Körpern und Metall mittels Silber oder silberhaltiger Legierungen als Lötmittel, dadurch gekennzeichnet, daß die zu verlötenden Keramikkörper an der Lötstelle vor dem Löten mit einem überzug aus Kupfer versehen werden, der, vorzugsweise in oxydierender Atmosphäre, eingebrannt wird. PATENT CLAIMS: i. Process for making vacuum-tight connections between several ceramic bodies or ceramic. Bodies and metal means Silver or silver-containing alloys as solder, characterized in that the ceramic body to be soldered with a coating at the soldering point before soldering made of copper, which is burned in, preferably in an oxidizing atmosphere will. 2. Verfahren nach Anspruch i, dadurch gekennzeichnet, daß der Einbrennvorgang nur so weit durchgeführt wird, daß nicht alles Kupfer eine Verbindung mit der 'keramischen Masse eingeht, sondern an der Oberfläche der Keramikkörper noch eine Schicht metallischen Kupfers oder/und Oxyde desselben erhalten bleiben. 2. The method according to claim i, characterized in that the burning-in process is carried out only so far that not all copper has a connection with the 'ceramic Mass enters, but on the surface of the ceramic body still a layer of metallic Copper and / or oxides of the same are retained. 3. Verfahren nach Anspruch i oder 2, dadurch gekennzeichnet; daß das Verlöten; mit Silberlot unter Zufügung reduzierender Zusätze oder/und in reduzierender Atmosphäre erfolgt, so daß etwa verbliebene Kupferoxyde wieder zu Kupfer zurückgebildet werden. 3. The method according to claim i or 2, characterized; that soldering; with silver solder with the addition of reducing Additions and / or in a reducing atmosphere, so that any remaining copper oxides be converted back to copper. 4. Lötverbindung, hergestellt nach dem Verfahren gemäß Anspruch i oder folgenden, dadurch gekennzeichnet, daß sie mindestens in der Nähe der Keramikkörper, vorzugsweise angrenzend an der Oberfläche, Kupfer und/oder seine Verbindungen mit Bestandteilen der keramischen Körper enthält.4. Soldered joint made according to the process according to claim i or following, characterized in that it is at least in the Proximity of the ceramic body, preferably adjacent to the surface, copper and / or contains its compounds with components of the ceramic body.
DEP12870D 1948-10-02 1948-10-02 Process for making vacuum-tight connections Expired DE841987C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEP12870D DE841987C (en) 1948-10-02 1948-10-02 Process for making vacuum-tight connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEP12870D DE841987C (en) 1948-10-02 1948-10-02 Process for making vacuum-tight connections

Publications (1)

Publication Number Publication Date
DE841987C true DE841987C (en) 1952-06-23

Family

ID=7364311

Family Applications (1)

Application Number Title Priority Date Filing Date
DEP12870D Expired DE841987C (en) 1948-10-02 1948-10-02 Process for making vacuum-tight connections

Country Status (1)

Country Link
DE (1) DE841987C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE968557C (en) * 1953-05-12 1958-03-06 Philips Nv Method for joining ceramic objects with one another or with metal objects

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE968557C (en) * 1953-05-12 1958-03-06 Philips Nv Method for joining ceramic objects with one another or with metal objects

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