DE8327618U1 - TOOL, PREFERABLY CHISEL - Google Patents

Description

The invention relates to a tool according to the preamble of claim 1.

Tools to which the invention relates are tools with at least one Wear-resistant hard metal part that is used to machine workpieces, stone or the like. Preferably it can be chisels, such as drill bits, turning bits or the like.

25 30 35

Such hard metal parts are wear-resistant hard metal parts, for example *. to sintered or Cast hard metal parts, which can contain, for example, tungsten carbide, This is only an example and the The invention also applies to tools with other hard metal parts of course applicable.

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Hard metal usually has a smaller coefficient of expansion than the metal of the carrier, which is usually made of steel. If the carrier is made of steel, the coefficient of thermal expansion of the hard metal is generally only about half the coefficient of thermal expansion of the steel. Both the soldering of the hard metal to the carrier cause stresses in the hard metal and the forces and heat generated during operation. These stresses often cause stress cracks in the hard metal part of the tool. In order to reduce the risk of such stress cracks, it is known to reduce the stresses in the hard metal by means of low-melting soft solder. However, soft solder has other disadvantages, most of which prohibit its use. Normally, therefore, hard solders with higher melting points, in particular solders based on copper and / or silver, are used. In the case of the invention, hard solder can also be expediently provided. It is also known to embed metallic wire mesh into the soldering layer connecting the hard metal part to the carrier, which is completely soldered to the solder, but it does not serve to reduce stress in the hard metal part, but to facilitate the shooting in of the solder and also to ensure the correct thickness of the To secure solder layer. There are also hard metals that are less prone to stress cracking than other types of hard metal.

However, when choosing the type of hard metal, you are accordingly on less stress-sensitive hard metals restricts what is undesirable. Basically, there is a risk of stress cracks in the hard metal part the larger, the larger its cross-section and its length.

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I.

It is therefore an object of the invention to reduce the risk i

to reduce stress cracks in the hard metal part. |

^

This object is achieved according to the invention by a tool according to claim solved. Due to the at least one predetermined weak point conditional reduction in the ability of the plumb bob, forces, i.e. pulling / - *

Baer pressure and / or shear forces to be transmitted, weü the risk of stress cracks in the hard metal part with a secure hold of the hard metal part reduced or completely eliminated in a simple, inexpensive, operationally reliable manner. Preferably one or more of the measures described in claims 2 and 3 can be provided for this purpose.

, p. / needs, she keeps her

Since the solder substance is not or will not be changed / internal cohesion. The invention enables the use of hard solders of high strength, which are correspondingly good Hold the hard metal part on the carrier result.

preferably the insert can be embedded in the solder, i.e. are completely within the perpendicular.

Appropriately, the surface of the insert can be at least partially designed so that it is with does not connect to the solder during soldering.

By the insert at least partially with the The solder in which it is arranged does not connect, it cannot be perpendicular to the surface in these areas Transferring tensile forces and possibly only relatively small thrust forces through friction, which causes the stresses in the hard metal part are reduced and so the risk of stress cracks in the hard metal part is reduced or even completely is fixed. Since this insert can be very thin, it hardly needs to increase the thickness of the soldering gap. These Inlay can preferably be made of at least partially coated metal or of metal that does not bond with the solder Wight metal, e.g. ceramic, graphite or the like., Exist.

If the insert is variable in volume, it can be removed from the solder

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/ plastic h

forces exerted on them, including compressive forces elastic or / 1

give way and thus also reduce the power transmission capacity of the solder. For this purpose she can preferably have at least one cavity sealed to the outside against penetration of solder, so that in these no solder penetrates during soldering and so it remains empty and therefore also free of solder. The volume-variable deposit results as a result of it Compressibility Stress reduction in the carbide and thus a reduction in the risk of stress cracks, even when their outer surface is completely bonded with the solder. Even stronger stress relief in the hard metal can be achieved if the additional measure is provided that the outer surface of this hollow insert does not or only partially connects with the solder. This deposit can made of metal and / or of other materials.

With the connection of the solder with a surface or an area of the surface of the insert, the hard metal part or the carrier is understood to mean that the solder firmly connects to this surface or the relevant area, d. H. soldered to her or him. Multi-layer insert forming the predetermined breaking points also reduces the power transmission capacity of the solder. It can be provided so that it is completely with the solder or partially or not soldered. In the first two preferred cases, their connection with the solder is appropriate stronger than the predetermined breaking points forming connection of their respective layers with one another. Before-30

preferably, this insert can be a two-layer sheet metal strip or a spiral, a Pot, a sleeve or the like. Act from two-layer sheet metal, the two layers of which, for example, both from

Iron or of iron and aluminum or the like. Be-35

which are connected to each other by cold rolling.

Due to the weaker connection between the layers predetermined breaking points made possible with each other can be the

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Also reduce stresses in the hard metal part and thus the risk of stress cracks in it. Of the Break takes place in such a way that the layers in question at least in some areas by tensile or Release shear forces from one another, so that they then slide on one another in these areas or apart from one another can take off.

Another useful measure can be that

the surface of the hard metal IQ and / or of the carrier adjoining the solder is partially provided with at least one surface layer that does not connect to the solder. This layer can be, for example, aluminum oxide Al — O ₃ , silicon carbide SiC, other oxide ceramics or the like. Since the soldering layer is only partially connected to the hard metal part and / or the carrier, the stresses in the hard metal part are reduced and the risk of stress cracks is also reduced or eliminated. This measure is particularly suitable for very narrow soldering gaps.

2Q The invention readily enables the use of Hard solder, so that even in the case of soldering on smaller surfaces, there is no problem with holding it securely the hard metal part can be easily reached on or in the carrier.

In order to create an insert with a cavity closed off to the outside in a particularly simple manner, it can be particularly expediently designed as a flat tube which is closed at both ends. This

3Q flat tube can, for example, be made from a round tube by rolling be made and consist of iron, the outer surface of which bonds with the solder. It can in the event a flat soldering gap should be laid in this serpentine shape. In the case of a round cross-section Soldering gap, the flat tube can preferably be wound to form a spiral, with adjacent ones expediently Spiral turns touch with their longitudinal edges or can almost touch. The soldering gap is after that

•••• ft ■ · «· *

5554.

filled in with the plumb bob.

If the surface of the inlay arranged in the solder, preferably embedded in the solder, is designed in such a way that that at least in some areas it has a surface quality that does not connect with the solder this insert should preferably be designed in the form of a sheet or band. In this case, preferably both widths

^ q Sides of the sheet or tape surface texture that does not bond with the solder, whereas the narrow edges prefer a surface texture that connect to the solder. For example, it can be a sheet or tape that is attached to

jg both broad sides by alloying with an intermetallic Coating of high heat resistance is provided, which does not bond with the solder. Also other surface textures, which can achieve that they do not connect with the respective solder

2Q can of course be provided. For example, the or the relevant surface areas of this insert have a very thin ceramic coating or the Insert made of thin ceramic plates, strips or the like. At least if the surface of this Inlay does not connect to the solder at any point, it is necessary that it has at least one of one the hard metal part with the solder bridge connecting the carrier leaves the penetrated passage free and / or together with at least one other such. inlay

op free at least one such passage for a solder bridge leaves. But it is also possible to provide that this insert together with existing on both sides Solder layers a so-called multilayer film, for example Silver solder-iron-silver solder forms, but it is then necessary that both sides are on partial areas connect with the solder, for example. On circular surface areas arranged according to a grid. The remaining Surface areas of this insert are then, for example, through

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Alitization coated in such a way that they do not bond with the adjacent solder.

According to a further embodiment, the insert be a flat element provided with holes, such as a perforated strip, sleeve, pot or the like. These In this case, the insert has a surface quality that does not connect to the adjacent solder, at least in some areas

IQ on. Here, "at least in some areas" is understood to mean that at least one area of the relevant Surface texture, with a maximum of their entire surface covering the relevant, surface quality that does not bond with the solder may have. In this case, at least the broad sides of the flat element can preferably be used as not be of a connection with the plumb bob.

The volume-variable insert can also have other designs than flat tubes, for example. be preferably a hollow plate or a hollow strip, which or one essentially over its or its length and width extending cavity or a plurality or plurality of smaller ones Has cavities or it can also be a shell-shaped hollow body which has a single cavity or also again has a plurality or multiplicity of cavities. Also other trainings with and without cavities are possible.

In the invention it is generally expedient if the insert or the inserts are at least over Extend a substantial part of the soldering gap, preferably approximately over the entire soldering gap or in the case of one the brazing gap comprising the hard metal part extends preferably at least substantially over the circumferential area

5554

of the soldering gap. It is essential that the deposit or deposits are so large that they pose a risk reduce stress cracks in the carbide.

The measure to reduce or eliminate the risk of stress cracks in the hard metal in the case of the surface of the hard metal part and / or of the carrier adjoining the solder partially with at least a surface layer that does not bond with the solder also has the advantage of that the surfaces of the hard metal part and the carrier connected to one another by the soldering can be reduced in size without significantly reducing the spatial extent of the solder layer.

in the drawing are exemplary embodiments of the Invention shown. Show it:

Fig. 1 is a fragmentary, partially sectioned Side view of a chisel according to a first embodiment of the invention,

Fig. 2 the detail Z of Fig. Λ in an enlarged view,

-13-

Pig. 3 shows a section from a chisel, similar

that of Fig. 2, which according to a second embodiment of the invention

is trained,

4 shows a partial and partially sectioned side view of a chisel according to a further embodiment

the invention,

5 shows the detail Z ¹ from FIG. 4 in an enlarged representation,

6 shows a partial and partially sectioned side view of a chisel according to another embodiment of the invention,

7 shows the detail Z ″ from FIG. 6 in an enlarged manner

Depiction,

Fig. 8 each have a longitudinally cut detail of Q ₃ and 9 a chisel in accordance with two further embodiments of the invention.

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The pick 10 shown in FIGS. 1 and 2 can, for example, with partial cutting and mining machines for mining stones, ores, minerals, coal and the like. are used and has a rotationally symmetrical shaft 11, which at its front end as a Has a blind hole formed coaxial central bore 12, in which as a hard metal part 13 a so-called hard metal tip is attached by means of solder 14. This solder 14 can expediently be a hard solder, preferably be a silver- and / or copper-containing hard solder with melting points of, for example, 700-1100 ° C. Of the Shank 11 is a carrier for the card metal part 13. The Hard metal part 13 is located in the bore 12 Area of an insert 16, which consists of a metal strip 15 embedded in the solder 14 helically wound spiral 16, which is thus wound in the manner of a helical spring, there is. The whole Soldering gap 41 between the hard metal part 13 and the The wall of the bore 12 is filled with the solder 14 and this spiral 16. That this spiral 16 forming

.25 metal band 15 has a rectangular cross-section, desser. in the direction of the longitudinal center axis of the spiral 16 extending height as shown is greater than its width. The outer and inner broad sides 17, 18 of the Metal strip 15 have such surface coatings, that they have not connected to the solder 14 during soldering over the full length of the metal strip 15, that is to say with are not soldered to him. In contrast, the two narrow edges 19, 20 of the metal strip 15 with respect to their Surfaces be designed so that they connect to the solder 14 during soldering, that is, soldered to the solder are. So that the two broad sides 17, 18 of the

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Metal band 15 with the solder 14 when soldering not connect, they can have any suitable coatings, for example. thin ceramic coatings or the like. It is particularly useful if these two broad sides 17, 18 of the metal strip 15 are coated by aluminizing,

! Q This is explained using an example. It is assumed that the metal strip 15 consists of iron and its two broad sides were first coated with aluminum and it was then ^{exposed to a temperature of about 70O 0} C and higher. This thermal treatment then forms an intermetallic layer of high heat resistance from the aluminum and iron, in that the aluminum layer forms _{the compound Al 3 Fe with a limited amount of the adjacent iron.} This intermetallic layer looks dark

2Q gray out and adheres firmly to the iron, connects not with the solder 14 and withstands the soldering temperatures.

The following procedure can be used to solder the hard metal part 13 into the shaft 14: The one that can withstand the soldering temperatures Spiral 16 is pushed onto the circular cylindrical circumference of the rotationally symmetrical hard metal tip while expanding and then keeps itself to this extent. In this embodiment, their touch VJindungen not, so they are spaced from one another, as shown in FIGS. 1 and 2. This hard metal part 13 with Coil 16 is then inserted into bore 12 together with the required amount of solder in powder form and then this chisel 10 is put on for soldering required high temperature so that the solder

oc powder melts and the entire gap between the

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Wall of the bore 12 and the hard metal part 13 fills, by the hard metal part 13 with the spiral 16

_ goes down, solder 14 also gets into the b

Areas between the inner broad side 18 and the outer broad side 17 of the metal strip 15 and the hard metal part 13 or the wall of the bore 12, so that the spiral 16 is completely embedded in the solder 14 will. This solder 14 connects to the wall of the bore 12 and the hard metal part 13. It can As mentioned, also connect to the narrow side edges 19 of the metal strip 15, but not to his Broadsides 17, 18. By not dealing with the

Connecting broadsides 17, 18, the tensions are 15

reduced in the hard metal part 13 and the

The risk of stress fractures in the hard metal part 13 is reduced or remedied entirely. The helical gap of the spiral 16 forms one of a corresponding, the peripheral wall 36 of the bore 12 with the Um-20

Fang 37 of the hard metal part 13 connecting solder bridge 39 penetrated passage 35 of this insert 16.

This can also be done with the other exemplary embodiments

Solder 14 should preferably be hard solder, in particular solder on 25

the base of copper and / or silver, including pure copper or silver.

The chisel 10 shown in detail in FIG. 3

can follow the pick according to Fig. 1 and 2 with -3C

correspond to the differences:

A first difference is that the outer shape is the same as or similar to the spiral 16 1 and 2 designed, helical

winding spiral 16 ', the one also completely 35

in day Lot 14 forms an inlay embedded in one Metal band 15 'consists of two metal layers 22,23

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has, which are much less firmly connected to each other than the solder 14 with the insert 16 ', the Hard metal part 13 and the shaft 11. In this embodiment the entire surface of this metal strip 15 'can be firmly connected to the solder 14, ie both the two broad sides and the two narrow sides of the rectangular cross-section Metal band 15 ·. Since the two layers 22.-23 of the metal strip 15 'are connected to one another, can no solder 14 penetrate between them when soldering. However the connection between these two layers 22,23 is less firm than the connection of this metal strip 15 ' with the solder 14. For this purpose, the metal strip 3 5 ' For example, it can be produced by using two metal strips, preferably of approximately the same thickness, for example made of steel or iron their broad sides are placed one on top of the other and connected to one another by cold rolling, so that they are then the form two layers 22,23. Due to tensions in the hard metal part 13 it can then happen that the two Layers 22, 23 of the metal strip 15 'in places detach from each other, as they adhere less firmly to each other than the soldering points. This less firm connection between the two Layers 22, 23 with one another thus in particular create predetermined breaking points which are exposed to shear fractures, and due to the resultant break points Breaks in the connection between the two layers 22,23 become the M hard metal part occurring stresses and thus the risk of stress cracks in it or the latter is reduced Danger even completely eliminated if necessary. Although it is easiest to provide that all of the outside surface the spiral 16 'connects to the solder 14, can in In some cases, in order to further reduce the stresses in the hard metal, the outer surface can also be provided of the spiral 16 ′ completely or in some areas with a coating that does not connect to the solder 14 is provided.

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The pick 10 according to FIGS. 4 and 5 can again like the round shank cutter 10 according to FIG. 3 with the difference that the one inlay in the soldering gap 41 is also helical winding spiral 16 "from a metal tube 15" approximately rectangular cross-section is wound, the turns of this spiral 16 "in this embodiment touch or almost touch each other, i.e. no or smaller distances from each other than at the embodiments according to FIGS.

This metal tube 15 "thus has an almost rectangular, only air containing cavity 24, but which is closed at the two longitudinal ends, so that no solder 14 can penetrate into it during soldering. The surface of this tube 15 ″ can be designed in such a way that it connects firmly to the solder 14. this tube can be made of iron or steel. It can be made, for example, by adding a round Tube rolled into the approximately rectangular cross-sectional shape, so that the cavity of the tube only becomes flatter, so does not disappear. The elastic or plastic effect caused by this cavity 24 of the tube 15 ″ Compressibility of the pipe 15 ″ reduces the operation occurring tensions in the hard metal part 13 and thus reduces the risk of tension iron or remedies her whole. A further reduction of these stresses in the hard metal part 13 can be achieved here, if you have the outside surface of this tube 15 "completely or in places so that it did not connect with the solder during soldering, they thus, for example, alited.

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The pick 10 according to FIGS. 6 and 7

can again be the same or similar to that of FIG. 1 with the difference that in the solder a metallic pot 16a is embedded as an insert, its circumferential wall and base perforated evenly

IQ are. The inner and outer surfaces of this e.g.

The pot made of iron is provided with a coating that does not bond with the solder 14, for example by means of aluminizing, that is to say that of the spiral 16 of the Fig. 1 may correspond. Di · walls of the holes this pot 16a, however, can be uncoated and so connect to solder 14. The hard metal part 13 is inserted into this pot as shown. When soldering, d. H. When the solder melts, the solder 14 penetrates through the holes 35 'of the openings forming the passages Pot and between the entire surface of the pot 16a and the hard metal part 13 and the wall of the bore 12 of the shaft 11 a and connects both with the hard metal pin and with the wall of the bore 12 and with the Circumferential surfaces of the holes of the pot 16a. As a result of Holes in the pot 16 a are formed between the hard metal part 13 and the wall of the bore 12 of the shaft 11 penetrating the holes of the pot Bridges 39 made of solder 14, which in this embodiment have circular cross-sections. For example, the

Total sum of the cross-sections of this bar-shaped

Bridges 20-80% of the surface covered by solder 14 of the hard metal part 13 amount. In this embodiment, the bottom of the bore 12 is also the Shank 11 flat. Instead of the pot 16 a, if necessary.

also only one corresponding to the Topfurafangswandung

5554 "20

Sleeve may be provided, which is the circular cylindrical

Area of the hard metal part 13 within the bore 12 includes.

Also in the Ausführungsforia according to FIGS. 6 and 7 considerable stress reduction achieved in the hard metal 3 3 and thereby also the risk of stress cracks reduced or eliminated in the carbide.

The embodiment according to FIG. 8 shows a ge

cut section from a lathe chisel 10 ', the from a rod-shaped carrier 11 'and one, into one right-angled recess of the carrier 11 'soldered Hard metal plate 13 * consists. It is in this embodiment in the angled to look over the Width of the hard metal part 13 ′ extending soldering gap 41 an evenly perforated thin sheet-metal angle 16b extending over its width and length is used as an insert / which is completely inserted into the solder 14 is embedded. The surface of this angle 16b is possibly with the exception of the walls of its holes, with a coating, for example. Provided by aluminizing, the does not connect with the plumb line. This deposit 16 b reduces the stresses in the hard metal part 13 and thereby reduces or eliminates the risk of stress cracks in the hard metal part 13 *.

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In the embodiment of FIG. 9, which again

a cut section from a turning chisel JO ' similar to that shown in FIG. 8, the reduction of the stresses in the formed as a hard metal plate Hard metal part 13 'caused by the soldering Gap 41 delimiting surfaces of the steel or the like. existing shank 11 'and the hard metal part 13 are provided at a plurality of evenly distributed points with very thin coatings 40, the are designed so that they are with the solder 14 during soldering have not connected. These coatings 40 can, for example. Be strip-shaped or have other designs and be arranged according to a grid, the coatings 40 on the hard metal part 13 'and on the steel of the Shank 11 'face each other as shown can or can also be offset from one another. These coatings 40 can also be round, or have other suitable designs and arrangements. It is also conceivable for these coatings 40 vorzu only on the card metal part 13 'or only on the shaft 11' see. These coatings 40 are designed so that they do not bond with the solder. For example, the coatings 40 can consist of silicon carbide SiC, of aluminum oxide Al ₂ O ₃ , of other oxide ceramics or the like and for example 20 to 30% of the

Cover the soldering gap surfaces.

In the exemplary embodiments according to FIGS. 1-8, the inserts 16 ^{, 16 1} , 16 "! 6a and 16b are completely embedded in the solder. However, it is also conceivable that not in

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in each case the solder completely between the insert and the shaft 11,11 'or the hard metal part 13,3 3' penetrates, the insert falls very close in places> to the hard metal stack 13, 23 'or the shaft 13, 11 is applied, so that then there can be no complete embedding.

The thickness of the soldering gap can be, for example, 0.4 to 1 mm in all exemplary embodiments, however, it may also be larger or smaller. The thicknesses of the inserts 16, 16 ·, 16 ", 16b can preferably 0.1 to 0.5 mm, but optionally also be larger or smaller.

Instead of arranging only one insert in the solder gap,

several deposits can also be arranged in it «0

be. For example, in the case of the exemplary embodiments according to Figs. 1-7 instead of the spiral 15 or 16 ' or 16 ′ each encompass a plurality of rings which completely or essentially encompass the hard metal part 13, for example in annular grooves in the wall of the bore inserted or attached to the hard metal part 13 under pretension.

The substance of the solder 14 is in all embodiments by the Enlage Ιβ, ΐβ ', ΐβ ¹¹ , 16a, 16b and

does not affect the coatings 40, so remains unchanged.

Claims (16)

Dr.-Ing. Dip !, Phye.j ÖSjKÄB £ Ö £ f TQ 'Pafeijtanwalt ZugelaeeenerVe'rtreter beinTEuropäiechen'Paientamt Telex 07-23747 Koen Deutsche Bank AG Stuttgart Account No. 89 00 300 (BLZ 60070070) Telephone: (07 H) 39 64 61 Postecheck Pushes. 84919-70! Telegram: KoenlRpat 7000 STUTTGART- !, Klüpfeletraße6 CBLZ 60010070) Poetfach Bl 5554 S chu t ζ claims 1. Tool, preferably chisel, with at least one Wear-resistant, the machining of workpieces, stone or the like. Serving hard metal part, the with is firmly connected to a metallic carrier by solder located in at least one soldering gap, through which characterized in that in the Lötspal- (41) at least one predetermined Vulnerability is provided. 2. Tool according to claim 1, characterized in that the through the hard metal part (13) and / or the carrier (11; 11 ') formed wall or formed walls of the solder gap (41) partially with at least one that does not connect to the adjacent solder (14) during soldering Surface layer (40) is or are provided. 3. Tool according to claim 1 or 2, characterized in that at least one insert (16; 16 '; 16 "; 16a; 16b), which is connected to the solder (141) is at least partially not soldered and / or is variable in volume and / or a multilayer part (16 ') that - 2 - has at least two layers (22, 23) which are less firmly connected to one another than the solder to the hard metal part and the carrier to form predetermined breaking points. 4. Tool according to claim 3, characterized in that the variable-volume insert (16 ") at least has a solder-free cavity (24). 5. Tool according to claim 3 or 4, characterized in that net that the multilayer part (16 ¹ ) is metallic and soldered to the solder. 6. Tool according to one of claims 3-5, characterized in that the not or only partially insert (16; 16a; 16b) soldered with the solder There is metal that is connected to the solder at the area or areas not connected to the solder when soldering non-connecting surface layer or layers is provided. 7. Tool according to one of claims 3-6, characterized in that the insert consists of ^m i ^{f the} solder does not solderable material. 8. Tool according to claim 7, characterized in that the insert is non-metallic, preferably made of ceramic, graphite or asbestos. 9. Tool according to one of claims 3-8, characterized characterized in that the insert (16; 16 '; 16 ¹ ';16a; 35 16b) in the solder (14) at least substantially is embedded. - 3 - 10. Tool according to one of claims 3-9, characterized in that the volume-variable insert (16 ') is a flat tube closed at its ends, a hollow plate or shell or a hollow strip with at least one cavity (24) each. 11. Tool according to one of claims 3 - 10, characterized in that with a pin or bolt- shaped hard metal part (13) which is soldered into a recess of the carrier (13), the insert encompasses the circumference of the hard metal part Spiral (16; 16 ¹ ; 16 ') or at least one insert 15 a the circumference of the hard metal part at least in essential comprehensive ring is. 12. Tool according to one of claims 3-11, characterized in that the at least partially not connecting to the solder during soldering Surface finish exhibiting insert made of a perforated, flat, itself along the opposite area of the Hard metal part (3 3) extending element, 25 z. B. a pot (16a), a strip (16b), a sleeve, a spiral or the like. Is. 13. Tool according to one of claims 3-12, characterized characterized in that the hard metal part (13, - 13 ') and / or the surface areas of the relevant insert (16; 16a; 16b) opposite the carrier (11; 11 ″) have a nature that does not connect to the solder (14). - 4 - 14. Tool according to one of the preceding claims, characterized in that the solder (14) is a hard solder, preferably a hard solder based on copper. 15. Tool according to one of claims 3-14, there- characterized in that the insert (16, 16 ', 16' ', 16a, 16b) at least one passage for a das Hard metal part (13; 33 ') with the carrier (11; 11') having connecting solder bridge (39) and / or between itself and at least one other such insert releases.
ο 16. Tool according to one of the preceding claims, characterized in that the one or more does not connect to the adjacent solder during soldering Surface areas of the insert (16) and / or of the 20th Carrier by aluminizing with an intermetallic Coating are provided.