DE7836651U1 - Solar cell made from semiconductor material - Google Patents

Solar cell made from semiconductor material

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Publication number
DE7836651U1
DE7836651U1 DE7836651U DE7836651U DE7836651U1 DE 7836651 U1 DE7836651 U1 DE 7836651U1 DE 7836651 U DE7836651 U DE 7836651U DE 7836651 U DE7836651 U DE 7836651U DE 7836651 U1 DE7836651 U1 DE 7836651U1
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solar cell
layer
cell according
silicon
generated
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DE7836651U
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0693Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells the devices including, apart from doping material or other impurities, only AIIIBV compounds, e.g. GaAs or InP solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/02168Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/544Solar cells from Group III-V materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells

Description

Dr. Rudolf Hezel Unser ZeichenDr. Rudolf Hezel Our mark Ringstraße 23 VPA 78 P 8 0 5 5 BRDRingstrasse 23 VPA 78 P 8 0 5 5 BRD

8521 Spardorf8521 Savings Village

Solarzelle aus Halbleitermaterial.Solar cell made from semiconductor material.

- e8 k - e8 k

Die Hauptanmeldung betrifft eine Solarzelle aus Halbleitermaterial mit einem aktiven Gebiet, in welchemThe main application relates to a solar cell made of semiconductor material with an active region in which Ladungsträger durch die auf die Solarzelle auftreffende und in diese eindringende Energie erzeugt werden, bei der auf dem halbleitenden Körper im aktiven Gebiet eine elektrisch isolierende Schicht mit metallischen Kontakten angeordnet ist, welche als Doppelschicht ausge-Charge carrier through the incident on the solar cell and in this penetrating energy are generated, at the one on the semiconducting body in the active area electrically insulating layer is arranged with metallic contacts, which are designed as a double layer bildet ist und aus einer, auf dem Halbleiterkörper direkt aufgebrachten ersten Schicht aus einer natürlichen oder bei Temperaturen unterhalb 8000C erzeugten Siliziumoxidschicht und einer darüber befindlichen zweiten Schicht aus einem, im Vergleich zur erstenand from a first layer applied directly to the semiconductor body made of a natural silicon oxide layer or a silicon oxide layer produced at temperatures below 800 ° C. and a second layer located above it consisting of a silicon oxide layer compared to the first

Schicht andersartigen isolierenden Material besteht.Layer of different insulating material consists.

Die vorliegende Pmeldung betrifft eine Weiterführung der in der Heaptanmeldung,/insbesondere in Figur 5 beschriebenen Siliziumnitrid-Inversionsschicht-Solarzelle mit pn-Übergängen in den Eontaktbereichen.The present P report relates to a continuation of the heapt report, / in particular in Figure 5 described silicon nitride inversion layer solar cell with pn junctions in the contact areas.

Edt 1 Plr/8.12.1978Edt 1 Plr / December 8th, 1978

- 2 - VPA 78P 8 05 5 BRO- 2 - VPA 78P 8 05 5 BRO

Diese Weiterführung besteht erfindungsgemäß darin, daß im Halbleiterkörper parallel zur Oberfläche ein ganzflächiger pn-übergang angeordnet ist und die zweite isolierende Schicht aus Siliziumnitrid oder Silizium-5 oxinitrid besteht. Die Verbesserung gegenüber herkömmlichen pn-Zellen besteht darin, daß durch die Aufbringung der Siliziumnitridschicht bzw. Siliziumoxinitridschicht die Empfindlichkeit (Quantenwirkungsgrad) Im kurzwelligen Teil des Sonnenspektrums erhöht wird.According to the invention, this continuation consists in that A full-area pn junction is arranged in the semiconductor body parallel to the surface, and the second insulating layer made of silicon nitride or silicon-5 oxinitride. The improvement over conventional pn cells is that the application of the silicon nitride layer or silicon oxynitride layer increases the sensitivity (quantum efficiency) in the short-wave part of the solar spectrum will.

Es liegt im Rahmen des Erfindungsgedankens, daß die Siliziumnitridschicht aus durch Glimmentladung von Silan und Ammoniak erzeugtem Plasmanitrid und der Halbleiterkörper aus einkristallinem, amorphem oder poly kristallinem Silizium besteht.It is within the scope of the inventive concept that the Silicon nitride layer made of plasma nitride produced by a glow discharge of silane and ammonia and the semiconductor body made of monocrystalline, amorphous or poly crystalline silicon.

In einer Weiterbildung des Erfindungsgedankens ist vorgesehen, den pn-übergang durch Ionertfaplantation zu erzeugen und die Tiefe im Halbleiterkörper auf etwa 0.05 bis 0.5 /um einzusxellen.In a further development of the concept of the invention, provision is made for the pn junction to be closed by ionic plantation and the depth in the semiconductor body to about 0.05 to 0.5 / um to ax.

Die weiteren Vorteil der erfindungsgemäßen Solarzelle gegenüber den bekannten Solarzellenanordnungen sind folgende:The further advantage of the solar cell according to the invention compared to the known solar cell arrangements are the following:

1. Die Siliziumnitrid-(Oxid)-Schicht ist ein idealer Antireflexionsbelag für Siliziumsolarzellen (n = 2).1. The silicon nitride (oxide) layer is an ideal anti-reflective coating for silicon solar cells (n = 2).

2. Durch die Siliziumnitridschicht wird ein idealer Schutz gegen das Bindringen von Verunreinigungen in den Halbleiterkörper (Kontaminationsschutz, Oberflächenpassivierung) gewährleistet.2. The silicon nitride layer provides ideal protection against the binding of impurities in the semiconductor body (contamination protection, surface passivation) guaranteed.

3. Elektronische Zustände, sowohl Grenzflächenzustände an der Halbleiter-Isolator Grenzfläche als auch3. Electronic states, both interface states at the semiconductor-insulator interface and

-3- VPA 73P8055 8RO-3- VPA 73P8055 8RO

solche, die die niedrige Lebensdauer der Minoritätsladungsträger im diffundierten Halbleitergebiet bedingen, werden durch den bei der Siliziumnitridabscheidung entstehenden äußerst aktiven Wasserstoffthose which cause the short service life of the minority charge carriers in the diffused semiconductor region are made by the extremely active hydrogen produced during the silicon nitride deposition (3 SiH^ + 4 NH3-* Si3N^ + 12 H2) in ihrer Wirkung als Rekombinationszentren reduziert. Dies hat eine Erniedrigung der Oberflächenrekombinationsgeschwindigkeit und eine Erhöhung der Lebensdauer (Diffusionslänge) der im Oberflächenbereich des Halbleiters(3 SiH ^ + 4 NH 3 - * Si 3 N ^ + 12 H 2 ) reduced in their effect as recombination centers. This has a lowering of the surface recombination speed and an increase in the lifetime (diffusion length) of those in the surface area of the semiconductor erzeugten Minoritätsladungsträger zur Folge, was zu einer höheren Empfindlichkeit der Solarzelle im kurzwelligen Teil des Sonnenspektrums führt.generated minority charge carriers result, which leads to a higher sensitivity of the solar cell in the short-wave part of the solar spectrum.

Weitere Einzelheiten werden an einem Ausführungsbeispiel % 15 anhand der in der Zeichnung befindlichen Figur, welche im Schnittbild eine Siliziumnitrid-Solarzelle mit ganzFurther details will be of an exemplary embodiment with reference to the 15% located in the drawing figure which in a sectional view a silicon solar cell with very flächigem pn-übergang und Metallkontakten darstellt,flat pn junction and metal contacts, noch näher erläutert.explained in more detail.

t 20 In der Figur ist der p-dotierte Siliziumkörper mit 1, § der Rückkontakt der Solarzellenanoi'dnung mit 2 be- t 20 In the figure, the p-doped silicon body is denoted by 1, § the back contact of the solar cell assembly is denoted by 2

zeichnet. Die in der Figur dargestellte Doppelisolatordraws. The double insulator shown in the figure schicht besteht aus der natürlich gewachsenen dünnenlayer consists of the naturally grown thin

r· SiOg-Schicht 3 und einer dickeren (ca. 80 am) Silizium-r SiOg layer 3 and a thicker (approx. 80 am) silicon

nitridschicht 4, welche in einer Glimmentladung durch Reaktion von Silan mit Ammoniak bei ungefähr 3000C hergestellt worden ist. Diese Schicht 4 kann auf der gesamten Zellenoberfläche abgeschieden werden, wobei vor der Abscheidung die Metallkontakte 5 aus Ασηπτη·um aufgedampft werden müssen. Es ist aber auch möglich, daß sich die Siliziumnitridschicht 4 nur zwischen den Metallkontakten (metal grid) befindet, wobei ein Foton&skierungsschritt erforderlich ist, um die Kontaktflächen freizulegen. 35nitride layer 4, which has been produced in a glow discharge by reacting silane with ammonia at about 300 0 C. This layer 4 can be deposited on the entire cell surface, the metal contacts 5 having to be vapor-deposited from Α σ η π τη · um before the deposition. It is also possible, however, for the silicon nitride layer 4 to be located only between the metal contacts (metal grid), a photon and sketching step being required in order to expose the contact areas. 35

Der parallel zur Oberfläche verlaufende ganzflächigeThe whole area running parallel to the surface

- 4 - VPA 78 P 8 O 5 5 8RO- 4 - VPA 78 P 8 O 5 5 8RO

pn-übergang 6 wird erzeugt durch Ionenimplantation von Phosphor oder Arsen in einer Tiefe von 0.2 /um.pn junction 6 is produced by ion implantation of phosphorus or arsenic at a depth of 0.2 μm.

Die Kontaktierung des Metallfingersystems 5 (metal grid) erfolgt durch ein in die Siliziumnitridschicht 4 eingeätztes Fenster im Bereich eines Metallkontaktes.The metal finger system 5 (metal grid) is contacted by means of a layer that is etched into the silicon nitride layer 4 Window in the area of a metal contact.

Im Wellenlängenbereich von 450 - 650 mn konnte gegenüber einer analogen Solarzelle ohne Si-Nitridschicht ein um 50 % höherer Quantenwirkungsgrad erzielt -werden.In the wavelength range from 450 - 650 mn, opposite an analog solar cell without Si nitride layer a 50% higher quantum efficiency can be achieved.

Drastische Verbesserungen durch das Si-Nitrid sind bei Solarzellen aus polykristallinem und amorphem Halbleitermaterial aufgrund der hohen Dichte von Rekombinationszentren zu erwarten. Bei GaAs-Solarzellen, bei denen ein wesentlich größerer Anteil von Ladungsträgern im Oberflächenbereich erzeugt wird, ist diese Methode besonders vorteilhaft.Drastic improvements through the Si nitride are in solar cells made of polycrystalline and amorphous semiconductor material expected due to the high density of recombination centers. For GaAs solar cells, at where a significantly larger proportion of charge carriers is generated in the surface area, this method is particularly advantageous.

8 c sprüche
1 Figur
8 c proverbs
1 figure

VPA 78 P 8 0 5 5 BRDVPA 78 P 8 0 5 5 FRG

Solarzelle aus HalbleitermaterialSolar cell made from semiconductor material

Die Erfindung betrifft eine Solarzellenanordnung aus Halbleitermaterial mit einem parallel zur Oberfläche verlaufenden ganzflächigen pn-übergang, bei der auf dem halbleitenden Körper eine elektrisch-isolierende Doppelschicht bestehend aus SiO2 und Plasmanitrid angeordnet ist.The invention relates to a solar cell arrangement made of semiconductor material with a full-area pn junction running parallel to the surface, in which an electrically insulating double layer consisting of SiO 2 and plasma nitride is arranged on the semiconducting body.

Claims (8)

- 1 - VPA /BP 8 0 55 BRO- 1 - VPA / BP 8 0 55 BRO 1. Solarzelle aus Halbleitermaterial mit einem aktiven Gebiet, in welchem Ladungsträger durch die auf die Solarzelle auftreffende und in diese eindringende Energie erzeugt werden, bei der auf dem halbleitenden Körper im aktiven Gebiet eine elektrisch isolierende Schi eist mit metallischen Kontakten angeordnet ist, welche als Doppelschicht ausgebildet ist und aus einer, auf dem Halbleiterkörper direkt aufgebrachten, ersten Schicht aus einer natürlichen oder bei Temperaturen unterhalb 8000C erzeugten Siliziumoxidschicht und einer darüber befindlichen zweiten Schicht aus einem, im Vergleich zur ersten Schicht andersartigen isolierenden1. Solar cell made of semiconductor material with an active area in which charge carriers are generated by the energy hitting and penetrating the solar cell, in which an electrically insulating layer with metallic contacts is arranged on the semiconducting body in the active area, which is a double layer is formed and from a, directly applied to the semiconductor body, first layer made of a natural silicon oxide layer or generated at temperatures below 800 ° C. and a second layer located above it made of an insulating layer that is different from the first layer Material besteht, imοΐΐ Ftvfrcirfr (Firtffirt twiwftiThTHgMaterial consists, imοΐΐ Ftvfrcirfr (Firtffirt twiwftiThTHg 4, dadurch gekennzeich net, daß im Halbleiterkörper parallel zur Oberfläche ein ganzflächiger pn-übergang angeordnet ist und die zweite isolierende Schicht aus Siliziumnitrid oder Siliziumoxinitrid besteht. 4, characterized in that in the semiconductor body parallel to the surface a full-area pn junction is arranged and the second insulating layer made of silicon nitride or silicon oxynitride. P P. 2. Solarzelle nach Anspruch 1, dadurch g e kennzeichnet, daß die Siliziumnitridschicht aus durch Glimmentladung von Silan und Ammoniak 25 erzeugtem Plasmanitrid besteht.2. Solar cell according to claim 1, characterized in that that the silicon nitride layer is made by glow discharge of silane and ammonia 25 generated plasma nitride consists. 3. Solarzelle nach Anspruch 1 und 2, dadurch3. Solar cell according to claim 1 and 2, characterized gekennzeichnet, daß der Halbleiteril körper aus einkristallinem, amorphem oder polykristallinem Silizium, Germanium oder aus A,j,By-Verbindungen, insbesondere aus Galliumarsenid, besteht.characterized in that the semiconductor body consists of monocrystalline, amorphous or polycrystalline Silicon, germanium or from A, j, By compounds, in particular of gallium arsenide. 4. Solarzelle nach Anspruch 1 bis 3, dadurch4. Solar cell according to claim 1 to 3, characterized u.u. gekennzeichnet, daß die Tiefe desmarked that the depth of the f 35 pn-Uberganges im Halbleiterkörper auf 0.05 - 0.5 /umf 35 pn junction in the semiconductor body to 0.05-0.5 / um ψψ eingestellt wird.is set. - 2 - VPA 78 P 8 0 5 5 BRO- 2 - VPA 78 P 8 0 5 5 BRO 5. Solarzelle nach Anspruch 1 bis 4, gekennzeichnet durch einen durch Ionenimplantation erzeugten pn-übergang.5. Solar cell according to claim 1 to 4, characterized by means of a pn junction generated by ion implantation. 6. Solarzelle nach Anspruch 1 bis 4, gekennzeichnet durch einen durch Diffusion erzeugten pn-übergang.6. Solar cell according to claim 1 to 4, characterized by a diffusion generated pn junction. 7« Solarzelle nach Anspruch 1 bis 6, dadurch gekenn zeichnet , daß die Dicke der Siliziumnitridschicht so ausgelegt ist, daß optimale Antireflexion gewährleistet ist.7 «Solar cell according to claim 1 to 6, characterized in that the thickness of the Silicon nitride layer is designed so that optimal anti-reflection is guaranteed. 8. Solarzelle nach Anspruch 7, dadurch g e kennzeichnet , daß bei Verwendung von Silizium als Halbleitermaterial die Dicke der Siliziumnitridschicht im Bereich von 80 nm liegt.8. Solar cell according to claim 7, characterized in that when using Silicon as a semiconductor material, the thickness of the silicon nitride layer is in the range of 80 nm.
DE7836651U 1978-12-11 1978-12-11 Solar cell made from semiconductor material Expired DE7836651U1 (en)

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DE7836651U DE7836651U1 (en) 1978-12-11 1978-12-11 Solar cell made from semiconductor material

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DE7836651U DE7836651U1 (en) 1978-12-11 1978-12-11 Solar cell made from semiconductor material

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3725338A1 (en) * 1987-07-30 1989-02-09 Nukem Gmbh ENCLOSURE OF A PHOTOVOLTAIC ELEMENT

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3725338A1 (en) * 1987-07-30 1989-02-09 Nukem Gmbh ENCLOSURE OF A PHOTOVOLTAIC ELEMENT

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